• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.3-14
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• 2013

In this paper, key design issues and considerations for Signal Integrity(SI) and Power Integrity(PI) of a TSV-based 3D IC are introduced. For the signal integrity and power integrity of a TSV-based 3-D IC channel, analytical modeling and analysis results of a TSV-based 3-D channel and power delivery network (PDN) are presented. In addition, various design techniques and solutions which are to improve the electrical performance of a 3-D IC are investigated.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.2
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• pp.188-193
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• 2010

In this paper, SI(Signal Integrity) characteristic of the 4-layer PCB(Printed Circuit Boards) with a through-hole via was analyzed by impedance mismatching between the through-hole via and the transmission line, and deterioration of clock pulse response characteristic due to the P/G plane resonances which are generated between the power and the ground plane. The minimized impedance mismatching between the through-hole via and the transmission line for the improving of SI characteristic is confirmed by the TDR(Time Domain Reflector) simulation and lumped element modeling of the through-hole via. And the cancellation method of P/G plane resonances for improvement of the SI characteristic is represented by simulation result.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.386-389
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• 2013

In this paper, for signal integrity analysing high-speed signal between a processor and a DDR2 memory, transient analysis is done and eye diagrams are generated using IBIS models of IC chips and S-parameters of transmission line. From the eye diagrams of such high-speed signals as DQ, DQS/DQSb, Clock, Address and Control, signal quality is assured through measuring timing and voltage margins during setup and hold times and verifying that the over-/under-shoot and the cross points of differential signals satisfy their specifications.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.27-33
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• 2010

We have successfully demonstrated a high-pin-count and thin embedded-LSI package to realize next generation's mobile terminals. The following three design key points were applied: (i) Using Cu posts, (ii) Using the coreless structure, (iii) Using a Cu plate as the ground plane. In order to quantitatively determine the contribution of the three points, the five-stage process for reducing the number of metal layers is described by means of the electrical simulation. The point-(i) and (ii) are effective from the viewpoint of the power integrity (PI); that is, these points play important roles in reducing the number of metal layers, and especially the point-(ii) contributes at least twice as the point-(i). The point-(iii) is not effective in the PI, but has a few effects on the signal integrity (SI). For reducing the number of metal layers, we should, at first, pay attention whether the PI characteristics fulfill the specification, and then we should confirm the SI characteristics.

• Journal of Electrical Engineering and Technology
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• v.11 no.1
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• pp.175-183
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• 2016

This paper brings out a novel method for reducing Near end and Far end Crosstalk using Electromagnetic Band Gap structures (EBG) in High Speed RF transmission lines. This work becomes useful in high speed closely spaced Printed Circuit Board (PCB) traces connected to multi core processors. By using this method, reduction of −40dB in Near-End Crosstalk (NEXT) and −60 dB in Far End Crosstalk (FEXT) is achieved. The results are validated through experimental measurements. Time domain analysis is performed to validate the signal integrity property of coupled transmission lines.

• Journal of international Conference on Electrical Machines and Systems
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• v.3 no.3
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• pp.248-251
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• 2014

As more vehicles become equipped with advanced electronic control systems, more consideration is needed with regards to automotive safety issues related to the effects of electromagnetic waves. Unwanted electromagnetic waves from the antenna, electricity and other electronic devices cause the performance and safety problem of automotive components. In general, Power Integrity and Signal Integrity analysis have been widely used, but these analyses have stayed PCB level. PCB base analysis is different from radiated emission TEST condition so its results are used just for reference. This paper proposes EMC optimization technology using module level 3-dimensional radiation simulation process closed to fundamental test conditions. If module level EMC analysis, which is proposed in this study, is applied to all automotive electronics systems, unexpected EMC noise will be prevented.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.12
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• pp.1716-1721
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• 2014

In this paper, a study on automation method for the circuit/EM (Electro-Magnetic) simulation is carried out to analyze effectively the SI/PI (Signal Integrity/Power Integrity) issues which occur on circuits and/or PCBs (Printed Circuit Boards). For the automation of the circuit/EM simulation, algorithms performing each process of the SI/PI analysis automatically (such as ports setup, circuit definition and SI/PI evaluation) are developed; thereby automation system for the SI/PI analysis is constructed with the algorithms. The automation of the circuit/EM simulation is accomplished in the environment of the C/S (Client/Server) architecture in order to reduce resources such as high cost computers demanded for the SI/PI analysis. The automation method for the SI/PI analyses proposed in this paper reduces effort, time, and cost spent on the environment setup for simulation and the SI/PI analysis process. In addition, the proposed method includes automation of the documenting process, which organizes, records and displays the SI/PI analysis results automatically for users.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.7
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• pp.786-795
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• 2010

In this paper, we propose a new EBG structure that the two unit cells are connected by the bridge line in signal transmission plane. The SSN of the power plane is reduced effectively by via holes and bridge lines connecting the unit cells. The superior signal transfer characteristic is shown between the signal lines in the signal transmission plane. The proposed EBG structure contains 1.2 GHz cut-off frequency and less than －30 dB suppression in the 8.3 GHz broad bandwidth. In addition, To improve the SI(Signal Integrity) in signal transmission plane keeping the same bandstop frequency range, the optimized location of the reference plane is proposed.

• Journal of The Institute of Information and Telecommunication Facilities Engineering
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• v.8 no.1
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• pp.1-5
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• 2009

In this paper, we propose a method that applies Vector Fitting (VF) technique to the equivalent circuit model for RF passive components. These days wireless communication system is getting smaller and smaller. So EMI/EMC is an issue in RF. We can solve PI/SI (Power Integrity/Signal Integrity) that one of EMI/EMC problem apply IFFT for 3D EM simulation multiple with input signal. That is time consuming task. Therefore equivalent circuit model using RF passive component is important. VF schemes are implemented to obtain the rational functions. S parameters of the equivalent circuit model is compared to those of EM simulation in case of the microstrip line structure.

• 한국정보통신설비학회:학술대회논문집
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• 2009.08a
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• pp.281-284
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• 2009

In this paper, we propose a method that applies Adaptive Frequency Sampling(AFS) technique to the equivalent circuit model for RF passive components. Thes days wireless communication system is getting smaller and smaller. So EMI/EMC is an issue in RF. We can solve PI(Power Integrity)/SI(Signal Integrity) that one of EMI/EMC problem apply IFFT for 3D EM simulation multiple with input signal. That is time comuming task. Therefore equivalent circuit model using RF passive component is important. AFS schemes are implemented to obtain the rational functions. S parameters of the equivalent circuit moldel is compared to those of EM simulation in case of the microstrip line structure.