• Proceedings of the KSME Conference
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• 2001.06e
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• pp.456-462
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• 2001

Comprehensive numerical computations are made of a homogenous spin-up in a cylindrical cavity with a time-dependent rotation rate. Numerical solutions are acquired to the governing axisymmetric cylindrical Navier-Stokes equation. A rotation rate formula is ${\Omega}_f={\Omega}_i+{\Delta}{\Omega}(1-{\exp}(-t/t_c))$. If $t_c$ is large, it implies that a rotation change rate is small. The Ekman number, E, is set to $10^{-4}$ and the aspect ratio, R/H, fixed to I. For a linear spin-up(${\epsilon}<<$), the major contributor to spin-up in the interior is not viscous-diffusion term but inviscid term, especially Coriolis term, though $t_c$ is very large. The viscous-diffusion term only works near sidewall. But for spin-up from rest, when $t_c$ is very large, viscous-diffusion term affects interior area as well as sidewall, initially. So azimuthal velocity of interior for large $t_c$ appears faster than that of interior for relatively small $t_c$. However, the viscous-diffusion term of interior decreases as time increases. Instead, inviscid term appears in the interior.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.2
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• pp.46-54
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• 2000

Because the installation of the optical cables in rooms is difficult, we can terminate the optical cable at the main enterence and use infrared wireless communications in the room. In this paper, we calculate the impulse response of the infrared wireless communication link and the optical power penalty due to multipath effect up to the third reflections with the source on the sidewall. We can locate the optical sources on the sidewall without problem because of relative large power reflected from the ceiling and sidewalls once. And the optical power penalty due to multipath effect can be neglected at the speed of 2 Mb/s.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.63-68
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• 2014

For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.3
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• pp.162-168
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• 2006

To fabricate nanometer scale InGaAs HEMTs, we have successfully developed various novel nano-patterning techniques, including sidewall-gate process and e-beam resist flowing method. The sidewall-gate process was developed to lessen the final line length, by means of the sequential procedure of dielectric re-deposition and etch-back. The e-beam resist flowing was effective to obtain fine line length, simply by applying thermal excitation to the semiconductor so that the achievable final line could be reduced by the dimension of the laterally migrated e-beam resist profile. Applying these methods to the device fabrication, we were able to succeed in making 30nm $In_{0.7}Ga_{0.3}As$ HEMTs with excellent $f_T$ of 426GHz. Based on nanometer scale InGaAs HEMT technology, several high performance millimeter-wave integrated circuits have been successfully fabricated, including 77GHz MMIC chipsets for automotive radar application.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.239-244
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• 2011

Nano Imprint Lithography(NIL) is technique for copying a pattern from stamp with nano size pattern in order to replicated the materials. It is very important to demold in order to make NIL process effectively. Self Assembled Monolayers(SAM) coater is manufactured by means of decreasing surface energy with the stamp surface treatment to improve release characteristics. Manufactured device contains tilting and rotation option for increasing process life time by coating on the sidewall of the pattern in stamp. The stamp coated with optimized tilting angle $30^{\circ}$ and rotation speed of 10rpm has more imprinting cycles than the stamping coated without tilting and rotation. Effective SAM coating on the sidewall of the pattern in stamp will improve by 50% of process life time.

• Journal of Welding and Joining
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• v.21 no.3
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• pp.85-91
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• 2003

Narrow gap welding has many advantages over conventional V-grooved butt welding such as high productivity, small deformation and improved mechanical property of joints. With narrower groove gap, less arc heat input is expected will all the other advantages of narrow gap welding. The main defects of narrow gap welding include the lack of root fusion, convex bead surface and irregular surface, all of which have negative effects on the next welding pass. This paper suggests an up-and-down torch oscillation for ultra narrow gap welding with gap size of 5mm and investigates the proper welding conditions to fulfill the reliable and high welding quality. First, GMA welding model was suggested for ultra narrow gap welding system with Halmoy's model referenced for wire melting modeling. And the arc length in ultra narrow gap was defined. Secondly, based on the experimental results of up-and-down torch oscillation welding, phase shift of current and wire extension length were simulated for varying oscillation frequency to show that weld the bead shape in ultra narrow gap welding can be predicted. As the result, it was confirmed that reliable weld quality in ultra narrow gap welding can be achieved with up-and-down torch oscillation above 15Hz due to its ability to provide uniform heat input along the sidewall of gap.

• Proceedings of the KIEE Conference
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• 1997.11a
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• pp.279-281
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• 1997

The properties of Platinum dry etching were investigated in MICP(Magnetized Inductively Coupled Plasma). The problem with Platinum etching is the redeposition of sputtered Platinum on the sidewall. Because of the redeposits on the sidewall, the etching of patterned Platinum structure produce feature sizes that exceed the original dimension of the PR size and the etch profile has needle-like shape.[1] Generally, $Cl_2$ plasma is used for the fence-free etching.[1][2][3] The main object of this study was to investigate a new process technology for the fence-free Pt etching. Platinum was etched with Ar plasma at the cryogenic temperature and with Ar/$SF_6$ plasma at room temperature. In cryogenic etching, the height of fence was reduced to 20% at $-190^{\circ}C$ compared with that of room temp., but the etch profile was not fence-free. In Ar/$SF_6$ Plasma, chemical reaction took part in etching process. The trend of properties of Ar/$SF_6$ Plasma etching is similar to that of $Cl_2$ Plasma etching. Fence-free etching was possible, but PR selectivity was very low. A new gas chemistry for fence-free Platinum etching was proposed in this study.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.4
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• pp.245-253
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• 2016

The friction and deformation of a tire causes heat generation, which causes a temperature rise of the tire. This temperature rise can be a source of tire damage. The object of this study is to investigate the cooling effect of the application of a fin to the tire side to suppress the temperature rise. Eight different fin shapes were considered, and the sidewall surface temperature reduction owing to the cooling fin shape was numerically analyzed. In addition, the flow characteristics and heat transfer characteristics of the vortex of the pin rear were compared.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.2
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• pp.128-131
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• 2004

In this study Bosch etching process repeating etch and deposition by STS-ICP ASEHR was evaluated. Fundamentally etch depth changes were affected by thickness of deposited PR, $SiO_2$ and depth, and pattern size on the substrate. However etch rates were observed to be changed by variable parameters such as platen power, coil power, and process pressure. Etch rate showed $1.2\mu{m}/min$ and sidewall profile showed $90\pm0.2^\circ$ with platen power 12W, coil power 500W, and etch/passivation cycle 6/7sec. It was confirmed that this result was very typical to Bosch process utilizing ICP.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.11
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• pp.972-980
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• 2002

This work is aimed at estimating the effects of various factors on the energy consumption of Korean-style apartment houses using TRNSYS. The factors considered here include the nominal size of floor area, type of remodeling, azimuth, sidewall insulation, and window type. Based on some assumptions, an actual apartment house is simplified into a model that is used for thermal load calculations. The simplified model is validated by showing a good agreement with the actual one in the predicted result. Remodeling balconies into unconditioned buffer spaces yields a favorable thermal performance in comparison with the original type regardless of the nominal size. Incorporating balconies into a conditioned indoor space leads to sharp increases in thermal loads, which must be avoided in view of energy conservation as well as structural problem. A quantitative assessment on the azimuthal effect indicates that the heating energy can be saved up to 16％ by taking the south or southeast direction. Reduction in the heating load with enhancing the sidewall insulation is gradual, so that a cost-effectiveness analysis may be needed when amending the regulations concerned. Glazing appears to significantly affect the heat transfer through window. A typical case illustrates that the heating load is decreased about 25％ by simply adopting triple glazing instead of double glazing.