Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1997.11a
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- Pages.279-281
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- 1997
A Study on the Properties of Platinum Dry Etching using the MICP
MICP를 이용한 Platinum 건식 식각 특성에 관한 연구
- Kim, Jin-Sung (Seoul Natl. Univ.) ;
- Kim, Jung-Hun (Seoul Natl. Univ.) ;
- Kim, Youn-Taeg (Seoul Natl. Univ.) ;
- Joo, Jung-Hoon (KunSan Univ.) ;
- Whang, Ki-Woong (Seoul Natl. Univ.)
- Published : 1997.11.29
Abstract
The properties of Platinum dry etching were investigated in MICP(Magnetized Inductively Coupled Plasma). The problem with Platinum etching is the redeposition of sputtered Platinum on the sidewall. Because of the redeposits on the sidewall, the etching of patterned Platinum structure produce feature sizes that exceed the original dimension of the PR size and the etch profile has needle-like shape.[1] Generally,
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