• Title/Summary/Keyword: SiN:H

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Analytical Model of Breakdown Voltages for 6H-SiC $p^{+}n$ Junction (6H-SiC $p^{+}n$ 접합의 항복 전압을 위한 해석적 모형)

  • Jeong, Yong-Seong
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.6
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    • pp.398-403
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    • 2001
  • In this paper, effective ionization coefficient for 6H-SiC is determined. Analytical formulas for the parallel plane breakdown voltage of the 6H-SiC p+n junction are derived by employing the ionization coefficients. The analytical breakdown voltages show good agreement with the numerical results of Dmitriev's[3]and the experimental results of Cree Research[9]over the doping range from 10$^{15}$ cm$^{-3}$ to 10$^{18}$ cm$^{-3}$.

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Effect of h-BN Content on Microstructure and Mechanical Properties of Si3N4 (질화규소의 미세조직과 기계적 성질에 미치는 h-BN 첨가의 영향)

  • 김승현;이영환;조원승;김준규;조명우;이은상;이재형
    • Journal of the Korean Ceramic Society
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    • v.40 no.9
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    • pp.867-873
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    • 2003
  • $Si_{3}N_{4}$-BN based machinable ceramics were fabricated by hot-pressing at $1800^{\circ}C$ for 2 h under a pressure of 25 MPa. The microstructure, mechanical properties, and machinability were investigated. With increasing h-BN content from 5 vol% to 30 vol%, three point flexural strength decreased from 1000 MPa of monolithic S $i_3$ $N_4$ to 720~400 MPa. The fracture toughness, $K_{IC}$ , was decreased from 7.6 MPaㆍ$m^{1/2}$ of monolithic S $i_3$ $N_4$ to 6.5~4.1 MPaㆍ$m^{1/2}$. The grain size and aspect ratio of $\beta$-S $i_3$ $N_4$ slightly decreased with increasing h-BN content. S $i_3$ $N_4$ monolith could not be machined due to brittle fracture, but S $i_3$ $N_4$-BN based machinable ceramics could be machined without fracture, showing excellent machinability. With increasing h-BN content, the thurst force during cutting and micro-drilling process was decreased.

Simulation Study of ion-implanted 4H-SiC p-n Diodes (이온주입 공정을 이용한 4H-SiC p-n Diode에 관한 시뮬레이션 연구)

  • Lee, Jae-Sang;Bahng, Wook;Kim, Sang-Cheol;Kim, Nam-Kyun;Koo, Sang-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.2
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    • pp.128-131
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    • 2009
  • Silicon carbide (SiC) has attracted significant attention for high frequency, high temperature and high power devices due to its superior properties such as the large band gap, high breakdown electric field, high saturation velocity and high thermal conductivity. We performed Al ion implantation processes on n-type 4H-SiC substrate using a SILVACO ATHENA numerical simulator. The ion implantation model used Monte-Carlo method. We simulated the effect of channeling by Al implantation in both 0 off-axis and 8 off-axis n-type 4H-SiC substrate. We have investigated the effect of varying the implantation energies and the corresponding doses on the distribution of Al in 4H-SiC. The controlled implantation energies were 40, 60, 80, 100 and 120 keV and the implantation doses varied from $2{\times}10^{14}$ to $1{\times}10^{15}\;cm^{-2}$. The Al ion distribution was deeper with increasing implantation energy, whereas the doping level increased with increasing dose. The effect of post-implantation annealing on the electrical properties of Al-implanted p-n junction diode were also investigated.

Enhanced Mechanical Properties and Thermal Stability of CrAlN Coatings by Interlayer Deposition (중간층 증착에 의한 CrAlN 코팅의 기계적 물성 및 내열성 향상에 관한 연구)

  • Kim, Hoe-Geun;Ra, Jeong-Hyeon;Song, Myeon-Gyu;Lee, Sang-Yul
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.100-100
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    • 2016
  • 물리기상증착방법 (Physical vapor deposition)에 의하여 합성된 천이금속 질화물 박막은 경도, 내마모성 등 절삭공구의 성능을 향상시키며, Ti-Al-N, Ti-Zr-N, Zr-Al-N, Cr-Si-N 등의 3원계 경질 박막에 대한 연구가 지속적으로 이루어지고 있다. 이중에서도 CrAlN 코팅은 높은 경도, 낮은 표면 조도 등의 우수한 기계적 특성 이외에 고온에서 안정한 합금상 형성으로 인하여 우수한 내열성을 보유하여 공구 코팅으로의 적용 가능성이 크다. 그러나 최근 공구사용 환경의 가혹화로 인하여 코팅의 내마모성 및 내열성 등의 물성 향상을 통한 공구의 수명 향상이 필요시 되고 있으며, 코팅에 적합한 중간층을 합성함으로써 공구 코팅으로의 적용 가능성을 높이는 연구들이 진행되고 있다. 본 연구에서는 CrAlN 코팅의 물성을 향상시키기 위해 CrAlN 코팅과 WC-Co 6wt.% 모재 사이에 CrN, CrZrN, CrN/CrZrSiN 등의 다양한 중간층을 합성하였으며, 중간층을 포함한 모든 코팅의 두께는 $3{\mu}m$ 로 제어하였다. 합성된 코팅의 미세조직, 경도 및 탄성계수, 내모성을 분석하기 위해 field emission scanning electron microscopy(FE-SEM), nano-indentation, ball-on-disk 마모시험기 및 ${\alpha}-step$을 사용하였다. 코팅의 내열성을 확인하기 위해 코팅을 furnace에 넣어 공기중에서 500, 600, 700, 800, 900, $1,000^{\circ}C$로 30분 동안 annealing 한 후에 nano-indentation을 사용하여 경도를 측정하였다. CrAlN 코팅을 나노 인덴테이션으로 분석한 결과, 모든 코팅의 경도(35.5-36.2 GPa)와 탄성계수(424.3-429.2 GPa)는 중간층의 종류에 상관없이 비슷한 값을 보인 것으로 확인됐다. 그러나, 코팅의 마찰계수는 중간층의 종류에 따라 다른 값을 보였으며, CrN/CrZrSiN 중간층을 증착한 CrAlN 코팅의 마찰계수는 0.34로 CrZrN 중간층을 증착한 CrAlN 코팅의 마찰계수(0.41)에 비해 낮은 값을 보였다. 또한, 코팅의 마모율 및 마모폭도 비슷한 경향을 보인 것으로 보아, CrN/CrZrSiN 중간층을 합성한 CrAlN 코팅의 내마모성이 상대적으로 우수한 것으로 판단된다. 이것은 중간층의 H/E ratio가 코팅의 내마모성에 미치는 영향에 의한 결과로 사료된다. H/E ratio는 파단시의 최대 탄성 변형율로써, 모재/중간층/코팅의 H/E ratio 구배에 따라 코팅 내의 응력의 완화 정도가 변하게 된다. WC 모재 (H/E=0.040)와 CrAlN 코팅(H/E=0.089) 사이에서 CrN, CrZrSiN 중간층의 H/E ratio 는 각각 0.076, 0.083 으로 모재/중간층/코팅의 H/E ratio 구배가 점차 증가함을 확인 할 수 있었고, 일정 응력이 지속적으로 가해지면서 진행되는 마모시험중에 CrN과 CrZrSiN 중간층이 WC와 CrAlN 코팅 사이에서 코팅 내부의 응력구배를 완화시키는 역할을 함으로써 CrAlN 코팅의 내마모성이 향상된 것으로 판단된다. 모든 코팅을 열처리 후 경도 분석결과, CrN/CrZrSiN 중간층을 증착한 CrAlN 코팅은 $1,000^{\circ}C$까지 약 28GPa의 높은 경도를 유지한 것으로 확인 되었고, 이는 CrZrSiN 중간층 내에 존재하는 $SiN_x$ 비정질상의 우수한 내산화성에 의한 결과로 판단된다.

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Fabrication of thin Film Transistor on Plastic Substrate for Application to Flexible Display (Flexible 디스플레이로의 응용을 위한 플라스틱 기판 위의 박막트랜지스터의 제조)

  • 배성찬;오순택;최시영
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.7
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    • pp.481-485
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    • 2003
  • Amorphous silicon (a-Si:H) based TFT process has been studied at the maximum temperature of 15$0^{\circ}C$ with 25${\mu}{\textrm}{m}$ thick flexible and adhesive tape type polyimide foil substrate, which has benefit on handling a rugged, flexible plastic substrate trough sticking simply it to glass. This paper summarize the process procedure of the TFT on the plastic substrate and shows its electrical characteristics in comparison with glass substrate using primarily the ON/OFF current ratio and the field effect mobility as the quality criterion. The a-SiN:H coating layer played an important role in decreasing surface roughness of plastic substrate, so leakage current of TFT was decreased and mobility was increased. The results show that high quality a-Si:H TFTs can be fabricated on the plastic substrates through coating a rough plastic surface with a-SiN:H.

Decomposition Behavior of Ferro-Si3N4 for High Temperature Refractory Application (고온 내화물 응용을 위한 질화규소철 (Ferro-Si3N4)의 분해거동)

  • Choi, Do-Mun;Lee, Jin-Seok;Choi, Sung-Churl
    • Journal of the Korean Ceramic Society
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    • v.43 no.9 s.292
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    • pp.582-587
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    • 2006
  • Decomposition behavior of $ferro-Si_3N_4$was investigated with varying temperature and holding time in mud components for high temperature refractory applications. Porosities gradually increased with increasing temperature and holding time due to the carbothermal reduction of $Si_3N_4\;and\;SiO_2$. Silicon monoxide (SiO) as a intermediate resulted from evaporation of $Si_3N_4\;and\;SiO_2$ reacted with C sources to generate needle-like ${\beta}-SiC$ and Fe in $Si_3N_4$ acted as a catalyst in order to enhance growth of SiC grain with the preferred orientation. SiC generation yield increased with increasing holding time, all of the $Si_3N_4\;and\;SiO_2$ affected on SiC formation up to 2h. However, SiC generation was only dependent on residual $SiO_2$ over 2h, because the carbothermal reduction reaction of $Si_3N_4$ was no longer possible at that time.

Refractive Index Control of Silicon Oxynitride Thick Films on Core Layer of Silica Optical Waveguide (실리카 광도파로의 Core층인 Silicon Oxynitride후박의 굴절률 제어)

  • 김용탁;조성민;윤석규;서용곤;임영민;윤대호
    • Journal of the Korean Ceramic Society
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    • v.39 no.6
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    • pp.594-597
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    • 2002
  • Silicon Oxynitride(SiON) thick films on p-type silicon(100) wafers have obtained by using plasma-enhanced chemical vapor deposition from SiH$_4$ , N$_2$O and N$_2$. Prism coupler measurements show that the refractive indices of SiON layers range from 1.4620 to 1.5312. A high deposition power of 180 W leads to deposition rates of up to 5.92${\mu}$m/h. The influence of the deposition condition on the chemical composition was investigated using X-ray photoelectron spectroscopy. After deposition of the SiON thick films, the films were annealed at 1050$^{\circ}C$ in a nitrogen atmosphere for 2 h to remove absorption band near 1.5${\mu}$m.

Wear Characteristics of Coated $Si_3N_4$-TiC Ceramic Tool (Coated $Si_3N_4$-TiC Ceramic 공구의 마모 특성)

  • 김동원;권오관;이준근;천성순
    • Tribology and Lubricants
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    • v.4 no.2
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    • pp.44-51
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    • 1988
  • Titanium carbide(TiC), Titanium nitride(TiN), and Titanium carbonnitride(Ti(C,N)) films were deposited on $Si_3N_4$-TiC composite cutting tools by chemical vapor deposition(CVD) using $TiCl_4-CH_4-H_2$, $TiCl_4-N_2-H_2$, and $TiCl_4-CH_4-N_2-H_2$ gas mixtures, respectively. The experimental results indicate that TiC coatings compared with TiN coatings on $Si_3N_4$ -TiC ceramic have an improved microstructural property, good thermal shock resistance, and good interfacial bonding. However TiN coatings compared with TiC coatings have a low friction coefficient with steel and good chemical stability. It is found by cutting test that coated insert compared with $Si_3N_4$-TiC ceramic have a superior flank and crater wear resistance. And multilayer coating compared with monolayer coating shows a improved wear resistance.

Hydrogenated a-Si TFT Using Ferroelectrics (비정질실리콘 박막 트랜지스터)

  • Hur Chang-Wu
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.9 no.3
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    • pp.576-581
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    • 2005
  • In this paper. the a-Si:H TFT using ferroelectric of $SrTiO_3$ as a gate insulator is fabricated on glass. High k gate dielectric is required for on-current, threshold voltage and breakdown characteristics of TFT Dielectric characteristics of ferroelectric are superior to $SiO_2$ and $Si_3N_4$. Ferroelectric increases on-current and decreases threshold voltage of TFT and also ran improve breakdown characteristics.$SrTiO_4$ thin film is deposited by e-beam evaporation. Deposited films are annealed for 1 hour in N2 ambient at $150^{\circ}C\~600^{\circ}C$. Dielectric constant of ferroelectric is about 60-100 and breakdown field is about IMV/cm. In this paper, the TFT using ferroelectric consisted of double layer gate insulator to minimize the leakage current. a-SiN:H, a-Si:H (n-type a-Si:H) are deposited onto $SrTiO_3$ film to make MFNS(Metal/ferroelectric/a-SiN:H/a-Si:H) by PECVD. In this paper, TFR using ferroelectric has channel length of$8~20{\mu}m$ and channel width of $80~200{\mu}m$. And it shows that drain current is $3.4{\mu}A$at 20 gate voltage, $I_{on}/I_{off}$ is a ratio of $10^5\~10^8,\;and\;V_{th}$ is$4\~5\;volts$, respectively. In the case of TFT without having ferroelectric, it indicates that the drain current is $1.5{\mu}A$ at 20gate voltage and $V_{th}$ is $5\~6$ volts. If properties of the ferroelectric thin film are improved, the performance of TFT using this ferroelectric thin film can be advanced.

Low resistivity Ohmic Co/Si/Co contacts to n-type 4H-SiC (낮은 접촉 저항을 갖는 Co/Si/co n형 4H-SiC의 오옴성 접합)

  • Kim, C.K.;Yang, S.J.;Lee, J.H.;Cho, N.I.;Jung, K.H.;Kim, N.K.;Kim, E.D.;Kim, D.H.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07b
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    • pp.764-768
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    • 2002
  • Characteristics of ohmic Co/Si/Co contacts to n-type 4H-SiC are investigated systematically. The ohmic contacts were formed by annealing Co/Si/Co sputtered sequentially. The annealings were performed at $800^{\circ}C$ using RTP in vacuum ambient and $Ar:H_2$(9:1) ambient, respectively. The specific contact resistivity$(\rho_c)$, sheet resistance$(R_s)$, contact resistance$(R_c)$, transfer length$(L_T)$ were calculated from resistance$(R_T)$ versus contact spacing(d) measurements obtained from TLM(transmission line method) structure. While the resulting measurement values of sample annealed at vacuum ambient were $\rho_c=1.0{\tiimes}10^{-5}{\Omega}cm^2$, $R_c=20{\Omega}$ and $L_T$ = 6.0 those of sample annealed at $Ar:H_2$(9:1) ambient were $\rho_c=4.0{\tiimes}10^{-6}{\Omega}cm^2$, $R_c=4.0{\Omega}$ and $L_T$ = 2.0. The physical properties of contacts were examined using XRD and AES. The results showed that cobalt silicide was formed on SiC and Co was migrated into SiC.

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