• Journal of the Korean Society for Heat Treatment
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• v.12 no.3
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• pp.231-239
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• 1999

Volume fraction and morphology of retained austenite, tensile properties of TRIP type high strength steel sheet with Fe-C-Si-Mn-Cu chemical composition have been investigated. The retained austenite of granular, bar and film type existing in specimen was obtained after intercritical annealing and austempering. The granular type retained austenite increased with increase of intercritical annealing and austempering temperature. With increase of intercritical annealing temperature, retained austenite and carbon contents increased. Maximum contents of retained austenite was obtained by austempering at $400^{\circ}C$. The maximum tensile strength was obtained by austempering at $450^{\circ}C$ and maximum elongation was obtained at $400^{\circ}C$. T.S${\times}$E.L value increased with increase of retained austenite contents due to the elongation strongly controlled by contents of retained austenite, but tensile strength was affected with various factors such as bainitic structure etc.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.4
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• pp.272-275
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• 2019

We investigated the electrical characteristics of amorphous silicon-zinc-tin-oxide (a-SZTO) thin films deposited by RF-magnetron sputtering at room temperature depending on the deposition time. We fabricated a thin film transistor (TFT) with a bottom gate structure and various channel thicknesses. With increasing channel thickness, the threshold voltage shifted negatively from -0.44 V to -2.18 V, the on current ($I_{on}$) and field effect mobility (${\mu}_{FE}$) increased because of increasing carrier concentration. The a-SZTO film was fabricated and analyzed in terms of the contact resistance and channel resistance. In this study, the transmission line method (TLM) was adopted and investigated. With increasing channel thickness, the contact resistance and sheet resistance both decreased.

• Journal of Powder Materials
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• v.14 no.4
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• pp.265-271
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• 2007

Electromagnetic wave absorbing materials have been developed to reduce electromagnetic interference (EMI) for electronic devices in recent years. In this study, Fe-Si-B-Nb-Cu base amorphous strip was pulverized using a jet mill and an attritor and heat-treated to get flake-shaped nanocrystalline powders, and then the powders were mixed, cast and dried with dielectric $Al_{2}O_{3}$ powders and binders. As a result, the addition of $Al_{2}O_{3}$ powders improved the absorbing properties of the sheets noticeably compared with those of the sheets without dielectric materials. The sheet mixed with 2 wt% $Al_{2}O_{3}$ powder showed the best electromagnetic wave absorption, which was caused by the increase of the permittivity and the electric resistance due to the dielectric materials finely dispersed on the Fe-based powder.

• Journal of Welding and Joining
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• v.35 no.2
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• pp.23-29
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• 2017

Mechanical properties and hardness distributions in arc brazed joints of Dual phase steel using Cu-Al insert metal were investigated. The maximum tensile shear load was 10.4kN at the highest brazing current. It was about 54% compared to tensile load of base metal. This joint efficiency is higher than that of joint of DP steel using Cu-based filler metals which are Cu-Si, Cu-Sn. Fracture positions can be divided into two types. Crack initiation commonly occurred at three point junction among upper sheet, lower sheet and the fusion zone. However crack propagations were different with increasing the brazing current. In case of the lower current, it instantaneously propagated along with the interface between fusion zone and upper base material. On the other hand, in case of higher current, a crack propagation occurred through fusion zone. When the brazing current is low (60, 70A), the interface shape is flat type. However the interface shape is rough type, when the brazing current is high (80A). It is thought that the interface shapes were the reason why the crack propagations were different with brazing current. The interface was the intermetallic compounds which consisted of $(Fe,Al)_{0.85}Cu_{0.15}$ IMC formed by crystallization at $1200^{\circ}C$during cooling. Therefore the maximum tensile shear load and the fracture behavior were determined by a interface shape and effective sheet thickness of the fracture position.

• Korean Journal of Metals and Materials
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• v.50 no.8
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• pp.557-562
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• 2012

Self-organized ruthenium (Ru) dots were fabricated by $400^{\circ}C$ RTA (rapid thermal annealing) and ALD (atomic layer deposition). The dots were produced under the $400^{\circ}C$ RTA conditions for 10, 30 and 60 seconds on all Si(100)/200 nm-SiO2, glass, and glass/fluorine-doped tin oxide (FTO) substrates. Electrical sheet resistance, and surface microstructure were examined using a 4-point probe and FE-SEM (field emission scanning electron microscopy). Ru dots were observed when a 30 nm-Ru layer on a Si(100)/200 nm-SiO2 substrate was annealed for 10, 30 and 60 seconds, whereas the dots were only observed on a glass substrate when a 50 nm-Ru layer was annealed on glass. For a glass/FTO substrate, RTA <30 seconds was needed for 30 nm Ru thick films. Those dots can increase the effective surface area for silicon and glass substrates by up to 5-44%, and by 300% for the FTO substrate with a < $20^{\circ}$ wetting angle.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.792-796
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• 2015

With high integration of electronic components, power inductors are also miniaturized. Recently, thick film processes for small size power inductors were developed and commercialized. However, the thick film process to prepare soft magnetic green sheets was not reported enough. In this study, we used Fe-Si magnetic and CIP (carbonyl iron powders) as starting materials to lead to a bimodal particle size distribution in the sheet. We proposed a newly developed 'Modified slurry preparation process' to get well dispersed condition even at high solid contents. Using the new process, it was possible to prepare a well dispersed slurry over 70 vol% of solid. BYK-103 was better than BYK-111 as dispersant in this slurry and the optimum amount was 0.6 wt%. The optimized slurry was formed into a sheet by tape casting process and then the sheet was laminated. We conformed that small size powder, large size powder, and epoxy resin were well dispersed in the green sheet.

• Korean Journal of Metals and Materials
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• v.49 no.4
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• pp.281-290
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• 2011

In order to gain better understanding of the selective surface oxidation and its influence on the galvanizability of a transformation-induced plasticity (TRIP) assisted steel containing 1.5 wt.% Si and 1.6 wt.% Mn, a model experiment has been carried out by depositing Si and Mn (each with a nominal thickness of 10 nm) in either monolayers or bilayers on a low-alloy interstitial-free (IF) steel sheet. After intercritical annealing at $800^{\circ}C$ in a $N_2$ ambient with a dew point of $-40^{\circ}C$, the surface scale formed on 590 MPa TRIP steel exhibited a microstructure similar to that of the scale formed on the Mn/Si bilayer-coated IF steel, consisting of $Mn_{2}SiO_{4}$ particles embedded in an amorphous $SiO_{2}$ film. The present study results indicated that, during the intercritical annealing process of 590 MPa TRIP steel, surface segregation of Si occurs first to form an amorphous $SiO_{2}$ film, which in turn accelerates the out-diffusion of Mn to form more stable Mn-Si oxide particles on the steel surface. During hot-dip galvanizing, particulate $Fe_{3}O_{4}$, MnO, and Si-Mn oxides were reduced more readily by Al in a Zn bath than the amorphous $SiO_{2}$ film. Therefore, in order to improve the galvanizability of 590 TRIP steel, it is most desirable to minimize the surface segregation of Si during the intercritical annealing process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.2
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• pp.303-310
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• 2008

We fabricated hydrogenated amorphous silicon(a-Si:H) 140 nm thick film on a $180\;nm-SiO_2/Si$ substrate with an inductively-coupled plasma chemical vapor deposition(ICP-CVD) equipment at $250^{\circ}C$. Moreover, 30 nm-Ni film was deposited with a thermal-evaporator sequently. Then the film stack was annealed to induce silicides by a rapid thermal annealer(RTA) at $200{\sim}500^{\circ}C$ in every $50^{\circ}C$ for 30 minuets. We employed a four-point tester, high resolution X-ray diffraction(HRXRD), field emission scanning electron microscope(FE-SEM), transmission electron microscope(TEM), and scanning probe microscope(SPM) in order to examine the sheet resistance, phase transformation, in-plane microstructure, cross-sectional microstructure evolution, and surface roughness, respectively. We confirmed that nano-thick high resistive $Ni_3Si$, mid-resistive $Ni_2Si$, and low resistive NiSi phases were stable at the temperature of <300, $350{\sim}450^{\circ}C$, and >$450^{\circ}C$, respectively. Through SPM analysis, we confirmed the surface roughness of nickel silicide was below 12 nm, which implied that it was superior over employing the glass and polymer substrates.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.05a
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• pp.266-269
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• 2009

Iron-based soft magnetic materials are widely used as cores, such as transformer transformers, motors, and generators. Reducing losses generated from soft magnetic materials of these applications results in improving energy conversion efficiency. Recently, the new P/M soft magnetic material realized an energy loss of 68 W/kg with a drive magnetic flux of 1 T, at a frequency of 1 kHz, rivaling general-purpose electromagnetic steel sheet in the low frequency range of 200 Hz to 1 kHz. In this research, the effect of rolling parameters on soft magnetic properties of Fe-based powder cores was investigated. The Fe-based soft magnetic plates were produced by the hot powder rolling process after both pure Fe and Fe-4%Si powders were canned, evacuated, and sealed in Cu can. The soft magnetic properties such as energy loss and coercive power were measured by B-H curve analyzer. The soft magnetic properties of rolled sheets were measured under conditions of a magnetic flux density of 1 T at a frequency of 200 kHz. It was found that rolling reduction ratio is the most effective parameter on reducing both energy loss and coercivity because of increasing aspect ratio with reduction ratio. By increasing aspect ratio from 1 to 9 through hot rolling of pure Fe powder, a significant loss reduction of one-third that of SPS sample was achieved.

• Journal of the Korean Ceramic Society
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• v.28 no.9
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• pp.675-682
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• 1991

Among many problems that need to be solved in the process of preparing multilayer chip LC filters, we studied the control of shrinkage in order to prevent the crack, warpage, and/or delamination which occurs at the interface between the inductance (L part) and the capacitance (C part). Shrinkage was controlled by compositions, powder size, calcining temperature and amount of organic binder. Capacitance sheet was prepared by mixing 65 wt% binder with the composition of 96 wt% TiO2 having an average particle size of 0.5 $\mu\textrm{m}$, 3 wt% CuO. After small amount of MnO2 and SiO2 added, it was calcined at 750$^{\circ}C$ for 2 hr. Inductance sheet was prepared by mixing 60 wt% binder with the composition of 49.5% mol% Fe2O3, 20.5 mol% ZnO, 20 mol% NiO and 10 mol% CuO which was calcined at 775$^{\circ}C$ for 2 hr. These sheets was laminated at 250 kg/$\textrm{cm}^2$, and cofired at 900$^{\circ}C$ for 2 hr to give rise to a multilayer chip LC filter without any warpage.