• 한국전기전자재료학회논문지
• /
• 제35권3호
• /
• pp.241-245
• /
• 2022

In this study, we measured and comparatively analyzed the characteristics of MPS (Merged Pin Schottky) diodes in 4H-SiC by changing the areal ratio between the Schottky and PN junction region. Increasing the temperature from 298 K to 473 K resulted in the threshold voltage shifting from 0.8 V to 0.5 V. A wider Schottky region indicates a lower on-resistance and a faster turn-on. The effective barrier height was smaller for a wider Schottky region. Additionally, the depletion layer became smaller under the influence of the reduced effective barrier height. The wider Schottky region resulted in the ideality factor being reduced from 1.37 to 1.01, which is closer to an ideal device. The leakage saturation current increased with the widening Schottky region, resulting in a 1.38 times to 2.09 times larger leakage current.

• 마이크로전자및패키징학회지
• /
• 제26권3호
• /
• pp.15-22
• /
• 2019

In these days, importance of the power electronic devices and modules keeps increasing due to electric vehicles and energy saving requirements. However, current silicon-based power devices showed several limitations. Therefore, wide band gap (WBG) semiconductors such as SiC, GaN, and $Ga_2O_3$ have been developed to replace the silicon power devices. WBG devices show superior performances in terms of device operation in harsh environments such as higher temperatures, voltages and switching speed than silicon-based technology. In power devices, the reliability of the devices and module package is the critically important to guarantee the normal operation and lifetime of the devices. In this paper, we reviewed the recent trends of the power devices based on WBG semiconductors as well as expected future technology. We also presented an overview of the recent package module and fabrication technologies such as direct bonded copper and active metal brazing technology. In addition, the recent heat management technologies of the power modules, which should be improved due to the increased power density in high temperature environments, are described.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
• /
• pp.148-148
• /
• 2011

Recently, there have been many research activities to develop the large-area plasma source, which is able to generate the high-density plasma with relatively good uniformity, for the plasma processing in the thin-film solar cell and display panel industries. The large-area CCP sources have been applied to the PECVD process as well as the etching. Especially, the PECVD processes for the depositions of various films such as a-Si:H, ${\mu}c$-Si:H, Si3N4, and SiO2 take a significant portion of processes. In order to achieve higher deposition rate (DR), good uniformity in large-area reactor, and good film quality (low defect density, high film strength, etc.), the application of VHF (>40 MHz) CCP is indispensible. However, the electromagnetic wave effect in the VHF CCP becomes an issue to resolve for the achievement of good uniformity of plasma and film. Here, we propose a new electrode as part of a method to resolve the standing wave effect in the large-area VHF CCP. The electrode is split up a series of strip-type electrodes and the strip-type electrodes and the ground ones are arranged by turns. The standing wave effect in the longitudinal direction of the strip-type electrode is reduced by using the multi-feeding method of VHF power and the uniformity in the transverse direction of the electrodes is achieved by controlling the gas flow and the gap length between the powered electrodes and the substrate. Also, we provide the process results for the growths of the a-Si:H and the ${\mu}c$-Si:H films. The high DR (2.4 nm/s for a-Si:H film and 1.5 nm/s for the ${\mu}c$-Si:H film), the controllable crystallinity (~70%) for the ${\mu}c$-Si:H film, and the relatively good uniformity (1% for a-Si:H film and 7% for the ${\mu}c$-Si:H film) can be obtained at the high frequency of 40 MHz in the large-area discharge (280 mm${\times}$540 mm). Finally, we will discuss the issues in expanding the multi-electrode to the 8G class large-area plasma processing (2.2 m${\times}$2.4 m) and in improving the process efficiency.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
• /
• pp.148-148
• /
• 2008

Low-k dielectric materials are an alternative plan to improve the signal propagation delay, crosstalk, dynamic power consumption due to resistance and parasitic capacitance generated the decrease of device size. Now, various materials is studied for the next generation. Diethoxymethlysiliane (DEMS) precursor using this study has two ethoxy groups along with one methyl group attached to the silicon atoms. SiCOH thin films were deposited on p-type Si(100) substrate by Plasma Enhanced Chemical Vapor Deposition (PECVD) using DEMS. In this study, we studied the effect of oxygen($O_2$) flow rate for DEMS to characteristics of thin films. The characteristics of thin films deposited using DEMS and $O_2$ evaluated through refractive index, dielectric constant(k), surface roughness, I-V(MIM:Al / SiCOH / Ag), C-V(MIM), deposition rate.

• 한국진공학회지
• /
• 제7권4호
• /
• pp.368-373
• /
• 1998

초고집적 회로의 미세화에 따라 다층배선에서 기생저항(parasitic resistance)과 정전 용량의 증가는 RC시정수(time constant)의 증가로 인하여 소자의 동작속도를 제한하고 있 다. 이로 인하여 발생되는 배선지연의 문제를 해결하기 위하여 매우 낮은 유전상수를 갖는 층간 절연물질이 필요하다. 이러한 저유전상수 층간절연물질로서 현재 유기계 물질중의 하 나인 a-C:F이 주목받고 있는 물질이다. 본 연구에서는 ECRCVD를 이용하여 a-C:F박막과 Si기판사이의 밀착력을 향상시키기 위하여 a-C:H박막을 500$\AA$증착한 후 a-C:F을 증착전력 500W에서 원료가스의 유량비($C_2F_6, CH_4/(C_2F_6+CH_4)$))를 0~1.0까지 변화시키면서 상온에서 증착하 였다. a-C:F박막의 특성은 SEM, FT0IR, XPS, C-V meter와 AFM등을 이용하여 두께, 결 합상태, 유전상수, 표면형상 및 표면 거칠기를 관찰하였다. a-C:F박막에서 불소함량은 가스 유량비가 1.0일 경우에는 최대 약31at.%정도 검출되었으며, 가스 유량비가 증가됨에 따라 증 가하였다. 또한 유전상수는 a-C:H의 유전상수 $\varepsilon$=3.8에서 $\varepsilon$=2.35까지 감소하였다. 이는 영 구 쌍극자 모멘트가 1.5인 C-H결합은 감소하고 영구 쌍극자 모멘트가 0.6, 0.5인 CF, CF2결 합이 증가하였기 때문이다. 하지만 $400^{\circ}C$에서 질소분위기로 1시간 동안 furnace열처리 후에 가스유량비가 1.0인 a-C:F박막에서 불소의 함량이 감소하여 C-F결합이 줄어들었다. 이로 인하여 유전상수가 열처리전의 2.7에서 열처리후 3.2까지 상승하였다.

• 한국신재생에너지학회:학술대회논문집
• /
• 한국신재생에너지학회 2007년도 춘계학술대회
• /
• pp.280-283
• /
• 2007

The first grid-connected, building-integrated transparent amorphous silicon photovoltaic installation has been operated since October 2004 in Yongin, Korea. The 2.2kWp transparent PV system was applied to the facade of entrance hall in newly constructed KOLON E&C R&D building. The PV module is a nominal 0.98m ${\times}$ 0.95m, 10% transparent, laminated, amorphous(a-Si) thin-film device rated at 44 Wp per module. To demonstrate the architectural features of thin film PV technologies for daylighting application, transparent PV modules are attached to the building envelope with the form of single glazed window and special point glazing(SPG) frames. Besides power generation, the 10% transmittance of a-Si PV module provides very smooth natural daylight to the entrance hall without any special shading devices for whole year. The installation is fully instrumented and is continuously monitored in order to allow the performance assessment of amorphous silicon PV operating at the prevailing conditions. This paper presents measured power performance data from the first 12 months of operation. For the first year, annual average system specific yield was just 486.4kWh/kWp/year which is almost half of typical amorphous silicon PV output under the best angle and orientation. It should be caused by building orientation and self-shading of adjacent mass. Besides annual power output, various statistical analysis was performed to identify the characteristics of transparent thin film PV system.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2011년도 추계학술발표대회
• /
• pp.16.2-16.2
• /
• 2011

Graphene has attracted significant attention due to its unique characteristics and promising nanoelectronic device applications. For practical device applications, it is essential to synthesize high-quality and large-area graphene films. Graphene has been synthesized by eloborated mechanical exfoliation of highly oriented pyrolytic graphite, chemical reduction of exfoliated grahene oxide, thermal decomposition of silicon carbide, and chemical vapor deposition (CVD) on metal substrates such as Ni, Cu, Ru etc. The CVD has advantages over some of other methods in terms of mass production on large-areas substrates and it can be easily separated from the metal substrate and transferred to other desired substrates. Especially, plasma-enhanced CVD (PECVD) can be very efficient to synthesize high-quality graphene. Little information is available on the synthesis of graphene by PECVD even though PECVD has been demonstrated to be successful in synthesizing various carbon nanostructures such as carbon nanotubes and nanosheets. In this study, we synthesized graphene on $Ni/SiO_2/Si$ and Cu plate substrates with CH4 diluted in $Ar/H_2$ (10%) by using an inductively-coupled PECVD (ICPCVD). High-quality graphene was synthesized at as low as $700^{\circ}C$ with 600 W of plasma power while graphene layer was not formed without plasma. The growth rate of graphene was so fast that graphene films fully covered on substrate surface just for few seconds $CH_4$ gas supply. The transferred graphene films on glass substrates has a transmittance at 550 nm is higher 94%, indicating 1~3 monolayers of graphene were formed. FETs based on the grapheme films transferred to $Si/SiO_2$ substrates revealed a p-type. We will further discuss the synthesis of graphene and doped graphene by ICPVCD and their characteristics.

• 센서학회지
• /
• 제5권1호
• /
• pp.30-36
• /
• 1996

적당한 크기의 저항률을 가지며 안정된 고감도 가스 센서 개발을 위해 ZnO를 기본물질로 하여 $Al_{2}O_{3}$를 4wt. %, $TiO_{2}$를 1wt. % 및 $V_{2}O_{5}$를 0.2 wt. %의 비율로 첨가시켜 타겟을 제작하여 RF 마그네트론 스퍼터링법 으로 ZnO 박막을 성장시켰다. 기판은 $SiO_{2}/Si$를 사용하였고, 박막의 부착이 좋도록 기판온도는 $250^{\circ}C$로 유지시켰으며, 10 mTorr의 산소분위기에서 약 80 W의 RF power로 10분간 박막을 성장시켰다. 보다 안정된 고감도의 박막을 제작하기 위해 $400^{\circ}C-800^{\circ}C$까지 열처리 한 결과, 산소분위기에서 $700^{\circ}C$로 60분 동안 열처리를 한 박막이 기타 다른 가스류(類)보다 TMA 가스에 대해 좋은 감지 특성을 나타냈으며 TMA 가스 농도 160 ppm에서 최대 550의 감도를 보였고, 안정성 및 선형성이 우수하였다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 추계학술대회 논문집
• /
• pp.241-241
• /
• 2009

For the Radio Frequency Integrated Passive Device (RFIPD) application, we have successfully developed and characterized high break-down voltage metal-insulator-metal (MIM) capacitors with 2,000 ${\AA}$ plasma-enhanced chemical vapor deposition (PECVD) silicon nitride which deposited with $SiH_4/NH_3$ gas mixing rate, working pressure, and RF power of PECVD at $250^{\circ}C$ chamber temperature. At the PECVD process condition of gas mixing rate (0.957), working pressure (0.9 Torr), and RF power (60 W), the AFM RMS value of about 2,000 ${\AA}$ silicon nitride on the bottom metal was the lowest of 0.862 nm and break-down electric field was the highest of about 8.0 MV/cm with the capacitance density of 326.5 $pF/mm^2$.

• 한국결정성장학회지
• /
• 제31권4호
• /
• pp.149-153
• /
• 2021

ε-Ga₂O₃ 박막은 금속 유기 화학 기상 증착법(MOCVD)에 의해 4H-SiC 기판에 성장되었으며, 결정성은 성장 조건에 따라 평가되었다. ε-Ga₂O₃의 최적 조건은 665℃의 성장 온도와 200 sccm의 산소 유량에서 성장한 것으로 나타났다. hexagonal 핵이 합쳐지면서 2차원으로 성장되었고, hexagonal 핵의 배열 방향은 기판의 결정 방향과 밀접한 관련이 있었다. 그러나 ε-Ga₂O₃의 결정 구조는 hexagonal이 아닌 orthorhombic 구조를 가짐을 확인하였다. 결정상 전이는 열처리에 의해 수행되었다. 그리고 상 전이된 β-Ga₂O₃ 박막과 비교하기 위해 4H-SiC에서 β-Ga₂O₃ 박막을 바로 성장하였다. 상 전이된 β-Ga₂O₃ 박막은 바로 성장한 것보다 더 나은 결정성을 보여주었다.