The Wetting Properties of UBM and TSM-coated Layer to the Lead-free Solders in Si-wafer/Glass Flip-Chip Packaging (Si-wafer/Glass 플립칩 패키징에서 UBM 및 TSM 코팅층의 무연 solder에 대한 젖음 특성)
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- Proceedings of the KWS Conference
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- 2000.04a
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- pp.170-173
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- 2000