• Journal of the Korean Society for Precision Engineering
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• v.18 no.2
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• pp.111-118
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• 2001

Tungsten probe is the most important part of a probe card, which is widely used for the performance test of wafer chips. Electro chemical etching becomes an exclusive choice for mass production of the tungsten probes. In the mass production, not only the shape of the probe but also the shape distribution of machined probes is important. A new method is proposed for the mass production of the tungsten probes. Tungsten wires are separated by a distance, and dipped into electrolyte. The dipping rate is controlled to shape the probes. Several experimental tests are performed to study the machining characteristics. From the test results, machining parameters including electrical conditions and anode position showed significant influences on the shape, repeatability, precision and quality of sharp tips.

• 전기의세계
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• v.19 no.6
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• pp.18-25
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• 1970

The object of this project is to manifest the mechanism of deterioration phenomena for dielectrics causing corona discharge and applies it for determine the standard corona detection technique. As the results, we observed that corona discharges may occur more strongly around cylindrical shape electrode in air than hemisphere shape electrode in vacuum, so that it depends on effects such as shape of the electrode, moisture, surface coditions, etc. According to observed the deterioration of dielectrics takes place in following stages. At first the attacked surface by an electron avalanche is uniformly eroded; then pits are formed; after that sharp channels are formed which lead to break-down as a treeing. The test are accelerated with higher frequencies by the cylindrical bar shape electrode in the pulse stright detection method more sensitive than Lissajous patterns. Lissajous patterns detection method is simple but usually insensitive and has disadvantage that the magnitude of the individual discharge is not measured.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.11
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• pp.180-188
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• 1998

Z-map is a special form of discrete nonparametric representation in which the height values at grid points on the xy-plane are stored as a 2D array z[i.j]. While z-map is the simplest form of representing sculptured surfaces and it is the most versatile scheme for modeling nonparametric objects, its practical application in industry (eg, tool-path generation) aroused much controversy over its weaknesses ; accuracy, singularity (eg, vertical wall), and some excessive storage needs. Although z-map has such limitations, much research on the application of z-map can be found in various articles. However, research on the systematic analysis of sculptured surface shape representation via z-map model is rather rare. Presented in this paper are the following: shape modeling power of the simple z-map model, exact (within tolerance) B-map representation of sculptured surfaces which have some feature-shapes such as vertical-walls and real sharp-edges by adopting some complementary B-map models, and some application examples.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1494-1495
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• 2006

A complete finite element analysis method for discharge onset process, which is governed and coupled by charge transport equation and electric field equation, was presented. The charge transport equation of first order was transformed into a second-order one by utilizing the artificial diffusion scheme. The two second-order equations were analyzed by the finite element formulation which is well-developed for second-order ones. The Fowler-Nordheim injection boundary condition was adopted for charge transport equation. After verifying the numerical results by comparing to the analytic solutions using parallel plane electrodes with one carrier system, we extended the result to blade-plane electrodes in 2D xy geometry with three carriers system. Radius of the sharp tip was taken to be 50 ${\mu}m$. When this sharp geometry was solved by utilizing the space discretizing methods, the very sharp tip was found to cause a singularity in electric field and space charge distribution around the tip. To avoid these numerical difficulties in the FEM, finer meshes, a higher order shape function, and artificial diffusion scheme were employed.

• Journal of Welding and Joining
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• v.26 no.5
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• pp.90-96
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• 2008

The objective of this paper is to investigate the effects of the laser power, the material thickness, comer angles, and the loop size on the formation of the comer in the cutting of Inconel 718 super-alloy sheet using high-power CW Nd: YAG laser. In order to investigate the influence of comer angles and loop sizes on the melted area and the formation of comer in the sharp comer, angular cutting tests and loop cutting tests were carried out. The results of the angular cutting tests were shown that the melted area is minimized and the melting mode is changed from nose melting in the thickness direction to the secondary melting induced by the attached dross when the comer angle is $90^{\circ}$. Through the results of loop cutting tests, the variation of the melted area and the comer shape in the sharp comer according to the loop size were examined. In addition, it was shown that a proper loop size is approximately 3 mm. The results of above experiments will be reflected on the knowledge base to generate optimal cutting path of the laser.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.3
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• pp.701-706
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• 1994

The discharge coefficients of critical sonic nozzles were obtained in a high pressure gas flow standard system, which was a gravitational weighing system. The discharge coefficients of critical sonic nozzle farbricated according to ISO specifications are in good agreement with ISO correlation. The discharge coefficients for small inlet radius decrease significantly as the inlet length become short due3 to separation at the sharp-edged inlet. For nozzles having long inlet radius, the effects of inlet length on the discharge coefficients were relatively small, but the effects become significant at the short inlet length. The effect of separation at the sharp-edged inlet is stronger than that of the boundary layer growth. The experimental results support that the shape of critical sonic nozzles suggested by ISO specifications is excellent.

• Design & Manufacturing
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• v.6 no.1
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• pp.52-57
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• 2012

Aspect of filling imbalance that is originated from imbalanced share rate in runner is changed by material property, runner layout that are factors of changing viscosity and by injection pressure, injection speed, melt temperature and mold temperature that are injection conditions. In this paper, we made a study of runner system that is one of factor of filling imbalance and Sharp Conner Effect and Groove Corner Effect that are recently released. The study are showed that filling rate of between inside and outside cavity was influenced on shape of runner. Also, we suggested runner system for filling imbalance by adapting the two effects at multi cavity of unary branch type and theoretical investigated flow in the Shrap Conner runner type.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.4
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• pp.336-343
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• 2004

This paper reports the first known free vibration data for thin rectangular plates with V-notches. The classical Ritz method is employed with two sets of admissible functions assumed for the transverse vibratory displacements. These sets include (1) mathematically complete algebraic-trigonometric polynomials which guarantee convergence to exact frequencies as sufficient terms are retained, and (2) corner functions which account for the bending moment singularities at the sharp reentrant corner of the Y-notch. Extensive convergence studies summarized herein confirm that the corner functions substantially enhance the convergence and accuracy of nondirectional frequencies for rectangular plates having the V-notch. In this paper, accurate frequencies and normalized contours of vibratory transverse displacement are presented for various notched plates, so that the effect of corner stress singularities may be understood.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.347-350
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• 2001

A typical Mold method is to form a gate electrode, a gate oxide, and emitter tip after fabrication of mold shape using wet-etching of Si substrate. In this study, however, new Mold method using a side wall space structure is used in order to make sharper emitter tip with a gate electrode. Using LPCVD(low pressure chemical vapor deposition), a gate oxide and electrode layer are formed on a Si substrate, and then BPSG(Boro phospher silicate glass) thin film is deposited. After, the BPSG thin film is flowed into a mold as high temperature in order to form a sharp mold structure. Next TiN thin film is deposited as a emitter tip substance. The unfinished device with a glass substrate is bonded by anodic bonding techniques to transfer the emitters to a glass substrate, and Si substrate is etched using KOH-deionized water solution. Finally, we made sharp field emitter array with gate electrode on the glass substrate.