• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.69-74
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• 2013

In this paper, the impact of integrating large number of I/O (Input-Output) and Core power Delivery Network (PDN) on a 6 layers Flip-Chip Ball Grid Array (FCBGA) package is investigated. The impact of core induced supply noise on high-speed I/O interfaces, and high-speed I/O interface's supply noise coupling to adjacent high-speed I/O interfaces' jitter impact are studied. Concurrent stress validation software is used to induce SSO noise on each individual I/O interfaces; and at the same time; periodic noise is introduced from Core PDN into the I/O PDN domain. In order to have the maximum coupling impact, a prototype package is designed to merge the I/O and Core PDN as one while impact on jitter on each I/O interfaces are investigated. In order to understand the impact of the Core to I/O and I/O to I/O noise, the on-die noise measurements were measured and results were compared with the original PDN where each I/O and Core PDN are standalone and isolated are used as a benchmark.

• IEMEK Journal of Embedded Systems and Applications
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• v.12 no.4
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• pp.193-204
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• 2017

Various 3D-stacked DRAMs have been proposed to overcome the memory wall problem. Hybrid Memory Cube (HMC) is a true 3D-stacked DRAM with stacked DRAM layers on top of a logic layer. The logic die is mainly used to implement a memory controller for HMC, and it is connected through a high speed serial link called SerDes with a host that is either a processor or another HMC. In HMC, the serial link is crucial for both performance and power consumption. Therefore, it is important that the link is configured properly so that the required performance should be satisfied while the power consumption is minimized. In this paper, we propose a HMC system model included the high speed serial link to estimate performance accurately. Since the link modeling strictly follows the link flow control mechanism defined in the HMC spec, the actual HMC performance can be estimated accurately with respect to each link configuration. Various simulations are conducted in order to deduce the correlation between the HMC performance and the link configuration with regard to memory utilization. It is confirmed that there is a strong correlation between the achievable maximum performance of HMC and the link configuration in terms of both bandwidth and latency. Therefore, it is possible to find the best link configuration when the required HMC performance is known in advance, and finding the best configuration will lead to significant power saving while the performance requirement is satisfied.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.9
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• pp.34-39
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• 2007

Serial links via backplane channels suffer from severe signal integrity problems which are normally caused by channel imperfections, such as flat loss, frequency-dependent loss, reflection, etc. Particularly, the frequency-dependent loss causes ISI(Inter-Symbol-Interference) at signal waveforms. Therefore, adaptive equalizing techniques have been exploited in many products to facilitate the ISI problem. In this paper, we present an analog adaptive equalizer circuit designed in a $0.18{\mu}m$ CMOS process. It achieves 10Gb/s data transmission through a long 34-inch backplane channel(or transmission line). The post-layout simulations demonstrate $8ps_{p-p}$ jitter with 10mW power dissipation. The core of the adaptive equalizer occupies the area of $0.56mm^2$.

• Journal of Electrical Engineering and Technology
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• v.9 no.6
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• pp.2224-2236
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• 2014

The performance of an isolated high voltage full bridge converter is improved using a voltage doubler. In a conventional high voltage full bridge converter, the diode of the transformer secondary voltage undergoes a voltage spike due to the leakage inductance of the transformer and the resonance occurring with the parasitic capacitance of the diode. In addition, in the phase shift control, conduction loss largely increases from the freewheeling mode because of the circulating current. The efficiency of the converter is thus reduced. However, in the proposed converter, the high voltage dual converter consists of a voltage doubler because the circulating current of the converter is reduced to increase efficiency. On the other hand, in the proposed converter, an input current is distributed when using parallel input / serial output and the output voltage can be doubled. However, the voltages in the 2 serial DC links might be unbalanced due to line impedance, passive and active components impedance, and sensor error. Considering these problems, DC injection is performed due to the complementary operations of half bridge inverters as well as the disadvantage of the unbalance in the DC link. Therefore, the serial output of the converter needs to control the balance of the algorithm. In this paper, the performance of the conventional converter is improved and a balance control algorithm is proposed for the proposed converter. Also, the system of the 1.5[kW] PCS is verified through an experiment examining the operation and stability.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.79-85
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• 2009

The design of a 3.2 Gb/s serial link receiver in $0.18{\mu}m$ CMOS process is presented. The major factors limiting the performance of high-speed links are transmission channel bandwidth, timing uncertainty. The design uses a multi-level signaling(4-PAM) to overcome these problems. Moreover, to increase data bit-rate and lower BER, we designed this circuit by using a current mode amplifier, Current-mode Logic(CML) sampling latches. The 4-PAM receiver achieves 3.2 Gb/s and BER is less than $1.0\;{\times}\;10^{-12}$. The $0.5\;{\times}\;0.6\;mm^2$ chip consumes 49 mA at 3.2 Gb/s from a 1.8-V supply.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.8
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• pp.79-88
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• 2009

This paper presents the analytical stiffness analysis method for a low-DOF planar parallel manipulator. An n-DOF (n<3) planar parallel manipulator to which 1- or 2-DOF serial mechanism is connected in series may be used as a positioning device in planar tasks requring high payload and high speed. Differently from a 3-DOF planar parallel manipulator, an n-DOF planar parallel counterpart may be subject to constraint forces as well as actuation forces. Using the theory of reciprocal screws, the planar stiffness is modeled such that the moving platform is supported by three springs related to the reciprocal screws of actuations (n) and constraints (3-n). Then, the spring constants can be precisely determined by modeling the compliances of joints and links in serial chains. Finally, the stiffness of two kinds of 2-DOF planar parallel manipulators with simple and complex springs is analyzed. In order to show the effectiveness of the suggested method, the results of analytical stiffness analysis are compared to those of numerical stiffness analysis by using ADAMS.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.165-168
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• 2002

As the demand for higher data-rate chip-to-chip communication such as memory-to-controller, processor-to-processor increases, low cost high-speed serial links\ulcorner become more attractive. This paper describes a 0.25-fm CMOS 1.6Gbps/pin 4-level transceiver using Stub Series Terminated Logic for high Bandwidth. For multi-gigabit/second application, the data rate is limited by Inter-Symbol Interference (ISI) caused by channel low pass effects, process-limited on-chip clock frequency, and serial link distance. The proposed transceiver uses multi-level signaling (4-level Pulse Amplitude Modulation) using push-pull type, double data rate and flash sampling. To reduce Process-Voltage-Temperature Variation and ISI including data dependency skew, the proposed high-speed calibration circuits with voltage swing controller, data linearity controller and slew rate controller maintains desirable output waveform and makes less sensitive output. In order to detect successfully the transmitted 1.6Gbps/pin 4-level data, the receiver is designed as simultaneous type with a kick - back noise-isolated reference voltage line structure and a 3-stage Gate-Isolated sense amplifier. The transceiver, which was fabricated using a 0.25 fm CMOS process, performs data rate of 1.6 ~ 2.0 Gbps/pin with a 400MHB internal clock, Stub Series Terminated Logic ever in 2.25 ~ 2.75V supply voltage. and occupied 500 * 6001m of area.

• Journal of Electrical Engineering and Technology
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• v.6 no.5
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• pp.605-612
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• 2011

As the power grids are integrated into one big umbrella called a "smart grid," communication protocol plays a key role in successful operations. The successful deployment of smart grid interoperability is a major hurdle that must be overcome. The micro grid, a small power system that distributes energy resource, is operated in diverse regions. Different vendors use different communication protocols in the operation of the micro grid. Recently, the IEC 61850 has been legislated to solve the interoperability problems in power utility automation. The present paper presents a micro grid system based on the IEC 61850 protocol. It consists of a micro grid monitoring system, a protocol converter that transforms serial data to IEC 61850 data, and distributed energy resource controllers for diverse DER nodes. A developed communication gateway can be deployed for DER controllers with serial links to exchange data with IEC 61850-based devices. The gateway can be extended to IEC 61850-based distribution automation systems, substation automation systems, or SCADA.

• Journal of the Institute of Electronics and Information Engineers
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• v.54 no.4
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• pp.25-31
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• 2017

This paper presents a 270/540/750/1500-Mb/s serial-data transmitter realized in a $0.13-{\mu}m$ CMOS technology for the applications of video data transmission. A low-cost RG-58 copper cable(5C-HFBT-RG6T) is exploited as a transmission medium connected to a single BNC connector, which shows cable loss 45 dB in maximum at 1.5 GHz. RLGC modeling provides an equivalent circuit for SPICE simulations of which characteristics are very similar to the measured cable loss. The loss can be compensated by pre-emphasis at transmitter and equalization at receiver if needed. Measurements of the proposed transmitter chip demonstrate the operations of 270-Mb/s, 540-Mb/s, 750-Mb/s and 1.5-Gb/s, and provide the output voltage levels of $370mV_{pp}$ at 1.5 Gb/s even with the pre-emphasis turned-off. The total power consumption is 104 mW from 1.2/3.3-V supplies and the chip occupies the area of $1.65{\times}0.9mm^2$.

• ETRI Journal
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• v.34 no.1
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• pp.122-125
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• 2012

A video signal through a high-density optical link has been demonstrated to show the reliability of optical link for high-data-rate transmission. To reduce optical point-to-point links, an electrical link has been utilized for control and clock signaling. The latency and flicker with background noise occurred during the transferring of data across the optical link due to electrical-to-optical with optical-to-electrical conversions. The proposed synchronization technology combined with a flicker and denoising algorithm has given good results and can be applied in high-definition serial data interface (HD-SDI), ultra-HD-SDI, and HD multimedia interface transmission system applications.