• 반도체디스플레이기술학회지
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• 제16권2호
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• pp.1-8
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• 2017

The visual inspection of electronic parts consists of two steps: automatic visual inspection and verification inspection. In the stage of a verification inspection, the human inspector sequentially inspects all the areas which detected in the automatic inspection. In this study, we propose an algorithm to determine the order of verification inspection by Bayes inference well known in the field of machine learning. This is a method of prioritizing a region estimated to have a high probability of defect using experience data of past inspection. This algorithm was applied to the visual inspection of ultraviolet filters to verify its effectiveness. As a result of the comparison experiment, it was confirmed that the verification inspection can be completed 30% of the conventional method by adapting proposed algorithm.

• 반도체디스플레이기술학회지
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• 제2권4호
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• pp.1-7
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• 2003

In this paper, we design the pattern generator circuits using PLDs(Programmable Logic Devices). The pattern generator is the circuit which generates the test pattern signal for the inspection of logical defects of semiconductor products. The proposed circuits are designed by the PLD design tool(MAX+ II of ALTERA). Also the designed circuits are simulated for the verification of the designed ones. The simulation results have a good performance.

• 반도체디스플레이기술학회지
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• 제16권3호
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• pp.53-58
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• 2017

Recently, advance in technology have increased the importance of visual inspection in semiconductor inspection areas. In PCB visual inspection, accurate line estimation is critical to the accuracy of the entire process, since it is utilized in preprocessing steps such as calibration and alignment. We propose a line estimation method that is differently weighted for the line candidates using a histogram of gradient information, when the position of the initial approximate corner points is known. Using the obtained line equation of the outline, corner points can be calculated accurately. The proposed method is compared with the existing method in terms of the accuracy of the detected corner points. The proposed method accurately detects corner points even when the existing method fails. For high-resolution frames of 3.5mega-pixels, the proposed method is performed in 89.01ms.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1996년도 춘계학술대회 논문집
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• pp.24-29
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• 1996

The seniconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip effect on the functions of the semiconductors. The defects of the chip surface is crack or void. Because general inspection method requires many inspection processes, the inspection system which searches immediately and preciselythe defects of the semiconductor chip surface. We propose the inspection method by using the computer vision system. This study presents an image processing algorithm for inspecting the surface defects(crack, void)of the semiconductor test samples. The proposed image processing algorithm aims to reduce inspection time, and to analyze those experienced operator. This paper regards the chip surface as random texture, and deals with the image modeling of randon texture image for searching the surface defects. For texture modeling, we consider the relation of a pixel and neighborhood pixels as noncasul model and extract the statistical characteristics from the radom texture field by using the 2D AR model(Aut oregressive). This paper regards on image as the output of linear system, and considers the fidelity or intelligibility criteria for measuring the quality of an image or the performance of the processing techinque. This study utilizes the variance of prediction error which is computed by substituting the gary level of pixel of another texture field into the two dimensional AR(autoregressive model)model fitted to the texture field, estimate the parameter us-ing the PAA(parameter adaptation algorithm) and design the defect detection filter. Later, we next try to study the defect detection search algorithm.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.841-842
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.651-652
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• 2013

• 반도체디스플레이기술학회지
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• 제11권3호
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• pp.1-6
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• 2012

In this paper, inspection system based on optical scanning mechanism is designed and developed for solar cell wafer. It consists of optical scanning mechanism, NIR camera optics, machinery and control system, algorithm of defect detection and software. Optical scanning mechanism is composed of geometrical camera optics and structured hybrid illumination system. It is used to inspection of surface defects. NIR camera optics is used for inspection of defects inside solar cell wafer. It is shown that surface and internal micro defects can be detected in developed inspection system for solar cell wafer.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.143-148
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• 2019

Numerous pipe lines can be found on various plant-based industrial sites. These pipelines should be periodically checked for defects. Most of these pipelines are internally inaccessible and difficult to visually inspect. Therefore, the inspection is being carried out with the help of non-contact inspection equipment such as ultrasonic flaw detection equipment. The use of ultrasonic flaw detection equipment can raise time and efficiency issues. In order to solve this problem, we will study the basic technology necessary for the development of automated inspection system equipped with ultrasonic measuring equipment and verify the validity through the fabrication of the demonstration device.

• 한국산학기술학회논문지
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• 제15권10호
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• pp.5906-5911
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• 2014

요즈음 생산되는 반도체의 제품이 제대로 작동하는지, 낮은 습도 또는 높은 온도에서 잘 견디는가를 검사하는 패키지 조립 및 검사 공정이 현장에 많이 있다. 또한 검사공정에서 사용되고 있는 반도체 테스트 핸들러 픽커 검사장비가 있는데, 본 연구에서는 CATIA 프로그램을 이용하여 3D 모델링하였으며, ANSYS 프로그램을 이용하여 반도체 테스트 핸들러 픽커 검사장비 프레임의 모델에 대하여 3가지 피로하중에 대한 해석을 하였다. 해석 결과로서 Case 1과 Case 2 모두 프레임의 가운데에서 최대 변형량이 발생하고 불규칙 피로 하중들 중에서 가장 하중의 변동이 심한 'SAE bracket history'가 가장 불안정하고 'Sample history'가 가장 안정함을 보이고 있다. 본 연구의 피로 해석 결과는 반도체 테스트 핸들러 픽커 검사장비 프레임의 파손방지 및 내구성을 검토함으로서 그 프레임의 설계에 효율적으로 활용이 될 수 있다.

• 반도체디스플레이기술학회지
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• 제10권1호
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• pp.17-22
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• 2011

LEDs(Light Emitting Diodes) are becoming widely used and increasingly in demand. Quality inspection of the LEDs has become more important. Two-dimensional inspection systems are limited in inspection capability, so threedimensional(3-D) inspection systems are needed. In this paper, a cost-effective and simple 3-D measurement system of LED packages using phase measuring profilometry(PMP) is proposed. The proposed system uses a pico projector to project sinusoidal fringe patterns and to shift phases instead of piezocrystal. It was evaluated using extremely accurate gauge blocks, yielding excellent repeatability of about 12 um(3-sigma). 3-D measurements of various LED packages were performed to demonstrate the applicability and efficiency of the proposed system.