Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2012.05a
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- Pages.841-842
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- 2012
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- 2005-8446(pISSN)
A Study on Semiconductor Package Inspection Method using Moire Effect
Moire 효과를 이용한 반도체 Package 외관검사 방법연구
- Jang, Y.H. ;
- Yun, K.J. ;
- Shin, S.J. ;
- Lee, J.S. ;
- Kwak, S.K.
- Published : 2012.05.30