• Journal of the Korea Society for Simulation
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• v.11 no.3
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• pp.59-65
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• 2002

Semiconductor wafer fabrication is a business of high capital investment and fast changing nature. To be competitive, the production in a fab needs to be effectively planned and scheduled starting from the ramping up phase, so that the business goals such as on-time delivery, high output volume and effective use of capital intensive equipment can be achieved. Project executed that use conveyor in bay semiconductor A line. But conveyor capability is lacking and rundown happened in equipment. Do design without normal simulation and conveyor system failed. The comparison is peformed through simulation using .AutoMod a window 98 based discrete system simulation software, as a tool for comparing performance of proposed layouts. In this research estimate optimum conveyor capability, there is the purpose.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.45-51
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• 2012

Multilayer co-extrusion blown film construction is a popular technique for producing plastic films for various packaging industries. Automated detection of defective films can improve the quality of film production process. In this paper, we propose a film inspection system that can detect and classify film defects robustly. In our system, first, film images are acquired through a high speed line-scan camera under an appropriate lighting system. In order to detect and classify film defects, an inspection algorithm is developed. The algorithm divides the typical film defects into two groups: intensity-based and texture-based. Intensity-based defects are classified based on geometric features. Whereas, to classify texture-based defects, a texture analysis technique based on local binary pattern (LBP) is adopted. Experimental results revealed that our film inspection system is effective in detecting and classifying defects for the multilayer co-extrusion blown film construction line.

• Journal of the Semiconductor & Display Technology
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• v.9 no.2
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• pp.55-60
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• 2010

Ink transfer process from the printing roll to the moving web was investigated using a CFD technique for the application in R2R printed electronics. In line with the requirement that the web handling speed needs to be increased further for the cost competitiveness, the effects of web moving velocity with relatively complex roll patterns were analyzed. To make the present analysis more realistic, the numerical geometry and the ink properties were selected to match those of the real printing production system. Our numerical results showed that both web handling speed and complex printing-roll patterns influenced the shape of the transferred ink. As the web moving speed approaches towards 30mpm, a significant distortion of the shape of the transferred ink occurred. In the range of pattern width smaller than 100 microns, a phase distortion was also found to occur in all the printing-roll patterns considered in the present work but the ratio of the phase distortion to the line width gets smaller as the width becomes smaller. Thus, the web handling speed and the shape of printing-roll pattern will be important elements for the better printing quality under 100 micron line width range.

• Proceedings of the Safety Management and Science Conference
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• 2008.11a
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• pp.303-316
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• 2008

For the past 25 years, Korean semiconductor has experienced enormous growth to be the highest production country in the world. Semiconductor industry is very time sensitive and driven by technology and process, and requires 24-hour full operation. The environment includes many different types of equipment, utilities, different gases and toxic chemicals as well as high voltage electricity. We have performed a survey with 3-shift engineers and workers in one line. The content of the questionnaire was about the correlation between fatigue and performance shaping factor (work type and work ability), and as a result we were able to deduce the correlation, p-value and the pattern of scatter plot. The shape of the model was made of 4 blocks for fatigue, 5 blocks for work type and 5 blocks for work ability, i. e. 14 blocks in total. As a conclusion to this findings, there was a correlation between fatigue and work type and work ability specifically in semiconductor industry, and we need some effort to reduce this.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2004.10a
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• pp.50-61
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• 2004

Nowadays Laser Controllable Thermo-cleaving is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor. The concept of this method is shown in Picture 1. Laser beam heats glass up to strain point not to melting point and cooling system chills glass to make maximum thermal stress in glass and then the thermal stress generates micro thermal crack in other words blind crack. Laser Controllable Thermo-cleaving controls the thermal stress to optimize the blind crack up to level of mass-production line.

• Journal of the Korea Safety Management & Science
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• v.9 no.1
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• pp.197-211
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• 2007

The power of semiconductor, Korea is continuously constructing semiconductor production line for keeping a front-runner status. however, studies and data about potential risks in semiconductor factory are still short. If fire does not initially suppressed, the fire causes a great damage. To decrease fire risk factors, in addition to fire fighting safety equipment, more important thing is how to design and construct fire protection system. The current fire protection codes about semiconductor factory come under functional law, and this law is short of consideration about particularity of factory. The existing prescriptive fire codes depending on experience compose without evident engineering verifications, thus equipments which is created by the current prescriptive fire code may bring about a variety of problems. For example, the design under the current regulation can not cope with the excessive investments, low efficiencies, and the diversifying construction designs and be applied to the quick changes of new technologies. Ergo, an optimal design for fire protection is to equip fire protection arrangements with condition and environment of production field. Manufacturing factory of semiconductors is a windowless airtight space. And for cleanliness, there exists strong flow of cooperation. Therefore, there is a need for fire safety design that meets the characteristic of a clean room. Accordingly, we are to derive smoke flow according to cooperation process within a clean room and construction plan of an optimal sensor system. In this study, in order to confirm the performance of proposed smoke-exhaust equipment and suggest efficient smoke exhaust device when there is a fire of 1MW of methane in the clean room of company H, we have implemented fire simulation using fluid dynamics computation.

• Journal of the Korea Society for Simulation
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• v.14 no.3
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• pp.1-12
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• 2005

Designing a production and equipment investment plan for semiconductors, many variables must be taken into account. However, depending on these variables could bring many changes to the plans, and the end result is hard to predict. Because it's hard to predict the end result, it's never easy to make a standard production plan. So, the goal of this project is to design a production plan based on past marketing patterns to satisfyall the variables and come up with a reasonable thesis on a standardized process.

• Journal of KIISE:Computing Practices and Letters
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• v.6 no.3
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• pp.311-318
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• 2000

The importance of the semiconductor industry in Korea has been growing, but the manufacturers are experiencing two major problems: poor optimization of production and low localization ratio of production equipments. Due to the complex manufacturing processes and special features such as OTD (On Time Delivery) and LIPAS (Line Item Performance Against Schedule) possibilities, several attempts to apply MRP or spreadsheet have been failed to meet the expectations. This paper describes the computer modeling technique as the solutions to analyze the problem, to formalize the semiconductor manufacturing process, and to build an advanced manufacturing environments. The computer simulation models are built referring the FAB facilities of the National Inter - University Semiconductor Research Center to show the FAB processes and the functions of each process.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.464-464
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• 2010

A few years ago, for maintaining high stability and production yield of production equipment in a semiconductor fab, on-line monitoring of wafers is required, so that semiconductor manufacturers are investigating a software based process controlling scheme known as virtual metrology (VM). As semiconductor technology develops, the cost of fabrication tool/facility has reached its budget limit, and reducing metrology cost can obviously help to keep semiconductor manufacturing cost. By virtue of prediction, VM enables wafer-level control (or even down to site level), reduces within-lot variability, and increases process capability, $C_{pk}$. In this research, we have practiced VM on $SiO_2$ etch rate with optical emission spectroscopy(OES) data acquired in-situ while the process parameters are simultaneously correlated. To build process model of $SiO_2$ via, we first performed a series of etch runs according to the statistically designed experiment, called design of experiments (DOE). OES data are automatically logged with etch rate, and some OES spectra that correlated with $SiO_2$ etch rate is selected. Once the feature of OES data is selected, the preprocessed OES spectra is then used for in-situ sensor based VM modeling. ICP-RIE using 葰.56MHz, manufactured by Plasmart, Ltd. is employed in this experiment, and single fiber-optic attached for in-situ OES data acquisition. Before applying statistical feature selection, empirical feature selection of OES data is initially performed in order not to fall in a statistical misleading, which causes from random noise or large variation of insignificantly correlated responses with process itself. The accuracy of the proposed VM is still need to be developed in order to successfully replace the existing metrology, but it is no doubt that VM can support engineering decision of "go or not go" in the consecutive processing step.

• The Journal of the Convergence on Culture Technology
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• v.9 no.1
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• pp.191-197
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• 2023

The purpose of the study was to provide an educational environment for designing and producing virtual reality practice contents that can be used in semiconductor production lines and clean rooms. Through this process, the user can acquire practical knowledge through experiences close to reality, such as experiencing the main semiconductor solar cell manufacturing facilities as well as procedural knowledge before and after entering the clean room.. In particular, it provides users with an immersion experience close to reality by creating an environment for experiential content necessary for semiconductor and solar cell manufacturing processes and clean room entrance procedure experiential content, which is expected to improve education immersion, realism, cost, efficiency, and education satisfaction. Depending on the characteristics of Dangerous, Impossible, Counter-productive etc, immersive content makes learners immersed in the learning content, induces proactive/active learning, and embodies the learning content, resulting in positive results in the field of improving educational effectiveness.