• 제목/요약/키워드: Semiconductor Production Line

검색결과 59건 처리시간 0.034초

반도체 확산공정에서의 컨베이어 적정속도와 길이를 구하는 시뮬레이션 (Conveyor Capability Simulation for Semiconductor Diffusion Area)

  • 박일석;이칠기
    • 한국시뮬레이션학회논문지
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    • 제11권3호
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    • pp.59-65
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    • 2002
  • Semiconductor wafer fabrication is a business of high capital investment and fast changing nature. To be competitive, the production in a fab needs to be effectively planned and scheduled starting from the ramping up phase, so that the business goals such as on-time delivery, high output volume and effective use of capital intensive equipment can be achieved. Project executed that use conveyor in bay semiconductor A line. But conveyor capability is lacking and rundown happened in equipment. Do design without normal simulation and conveyor system failed. The comparison is peformed through simulation using .AutoMod a window 98 based discrete system simulation software, as a tool for comparing performance of proposed layouts. In this research estimate optimum conveyor capability, there is the purpose.

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공압출 다층 플라스틱 필름 라인을 위한 결함 검사 시스템 (An Inspection System for Multilayer Co-Extrusion Blown Plastic Film Line)

  • 한종우;무하마드 타릭 마흐무드;최영규
    • 반도체디스플레이기술학회지
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    • 제11권2호
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    • pp.45-51
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    • 2012
  • Multilayer co-extrusion blown film construction is a popular technique for producing plastic films for various packaging industries. Automated detection of defective films can improve the quality of film production process. In this paper, we propose a film inspection system that can detect and classify film defects robustly. In our system, first, film images are acquired through a high speed line-scan camera under an appropriate lighting system. In order to detect and classify film defects, an inspection algorithm is developed. The algorithm divides the typical film defects into two groups: intensity-based and texture-based. Intensity-based defects are classified based on geometric features. Whereas, to classify texture-based defects, a texture analysis technique based on local binary pattern (LBP) is adopted. Experimental results revealed that our film inspection system is effective in detecting and classifying defects for the multilayer co-extrusion blown film construction line.

고속 웹 이송속도 및 복잡한 롤 패턴 형상을 고려한 R2R공정에서의 잉크전달 특성 해석 (Analysis of Ink Transfer for R2R Printing Process with High Speed Operation and Complex Roll Patterns)

  • 김경훈;김소희;나양
    • 반도체디스플레이기술학회지
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    • 제9권2호
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    • pp.55-60
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    • 2010
  • Ink transfer process from the printing roll to the moving web was investigated using a CFD technique for the application in R2R printed electronics. In line with the requirement that the web handling speed needs to be increased further for the cost competitiveness, the effects of web moving velocity with relatively complex roll patterns were analyzed. To make the present analysis more realistic, the numerical geometry and the ink properties were selected to match those of the real printing production system. Our numerical results showed that both web handling speed and complex printing-roll patterns influenced the shape of the transferred ink. As the web moving speed approaches towards 30mpm, a significant distortion of the shape of the transferred ink occurred. In the range of pattern width smaller than 100 microns, a phase distortion was also found to occur in all the printing-roll patterns considered in the present work but the ratio of the phase distortion to the line width gets smaller as the width becomes smaller. Thus, the web handling speed and the shape of printing-roll pattern will be important elements for the better printing quality under 100 micron line width range.

교대근무자의 피로와 수행영향인자 간의 상관관계 분석 (반도체 산업을 중심으로) (Correlation Analysis between Fatigue and Performance Shaping Factor for Alternation Worker's (Focused on the Semiconductor industry))

  • 윤용구;박범
    • 대한안전경영과학회:학술대회논문집
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    • 대한안전경영과학회 2008년도 추계학술대회
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    • pp.303-316
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    • 2008
  • For the past 25 years, Korean semiconductor has experienced enormous growth to be the highest production country in the world. Semiconductor industry is very time sensitive and driven by technology and process, and requires 24-hour full operation. The environment includes many different types of equipment, utilities, different gases and toxic chemicals as well as high voltage electricity. We have performed a survey with 3-shift engineers and workers in one line. The content of the questionnaire was about the correlation between fatigue and performance shaping factor (work type and work ability), and as a result we were able to deduce the correlation, p-value and the pattern of scatter plot. The shape of the model was made of 4 blocks for fatigue, 5 blocks for work type and 5 blocks for work ability, i. e. 14 blocks in total. As a conclusion to this findings, there was a correlation between fatigue and work type and work ability specifically in semiconductor industry, and we need some effort to reduce this.

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레이저를 이용한 LCO 유리 절단 (Laser Controllable Thermo-cleaving of LCD Glasses)

  • 이석준;콘드라텐코
    • 한국레이저가공학회:학술대회논문집
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    • 한국레이저가공학회 2004년도 추계학술대회논문집
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    • pp.50-61
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    • 2004
  • Nowadays Laser Controllable Thermo-cleaving is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor. The concept of this method is shown in Picture 1. Laser beam heats glass up to strain point not to melting point and cooling system chills glass to make maximum thermal stress in glass and then the thermal stress generates micro thermal crack in other words blind crack. Laser Controllable Thermo-cleaving controls the thermal stress to optimize the blind crack up to level of mass-production line.

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반도체 제조공정의 연기유동에 관한 연구 (A Study on Fire Hazard Analysis and Smoke Flowing for the Semiconductor Manufacturing Process)

  • 한수진;강경식
    • 대한안전경영과학회지
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    • 제9권1호
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    • pp.197-211
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    • 2007
  • The power of semiconductor, Korea is continuously constructing semiconductor production line for keeping a front-runner status. however, studies and data about potential risks in semiconductor factory are still short. If fire does not initially suppressed, the fire causes a great damage. To decrease fire risk factors, in addition to fire fighting safety equipment, more important thing is how to design and construct fire protection system. The current fire protection codes about semiconductor factory come under functional law, and this law is short of consideration about particularity of factory. The existing prescriptive fire codes depending on experience compose without evident engineering verifications, thus equipments which is created by the current prescriptive fire code may bring about a variety of problems. For example, the design under the current regulation can not cope with the excessive investments, low efficiencies, and the diversifying construction designs and be applied to the quick changes of new technologies. Ergo, an optimal design for fire protection is to equip fire protection arrangements with condition and environment of production field. Manufacturing factory of semiconductors is a windowless airtight space. And for cleanliness, there exists strong flow of cooperation. Therefore, there is a need for fire safety design that meets the characteristic of a clean room. Accordingly, we are to derive smoke flow according to cooperation process within a clean room and construction plan of an optimal sensor system. In this study, in order to confirm the performance of proposed smoke-exhaust equipment and suggest efficient smoke exhaust device when there is a fire of 1MW of methane in the clean room of company H, we have implemented fire simulation using fluid dynamics computation.

과거의 판매자료 패턴에 근거한 반도체 생산 계획의 수립 (Making Semiconductor Production Plan using the past marketing pattern reference)

  • 박동식;한영신;이칠기
    • 한국시뮬레이션학회논문지
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    • 제14권3호
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    • pp.1-12
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    • 2005
  • Designing a production and equipment investment plan for semiconductors, many variables must be taken into account. However, depending on these variables could bring many changes to the plans, and the end result is hard to predict. Because it's hard to predict the end result, it's never easy to make a standard production plan. So, the goal of this project is to design a production plan based on past marketing patterns to satisfyall the variables and come up with a reasonable thesis on a standardized process.

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반도체 웨이퍼 가공(FAD) 공정에서의 교육용 컴퓨터 모델 구축 (Construction of an Educational Computer Model for FAB of Semiconductor Manufacturing)

  • 전동훈;이칠기
    • 한국정보과학회논문지:컴퓨팅의 실제 및 레터
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    • 제6권3호
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    • pp.311-318
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    • 2000
  • 본 연구는 복잡하고 다양한 반도체 웨이퍼 가공 (FAB) 공정의 전체적인 흐름을 컴퓨터 모델로 구축하고 이를 Device 단면도를 나타내는 프리젠테이션 툴과 연동시키는 교육 모델의 개발을 목적으로 하였다. 급변하는 세계 반도체 시장에서 국내 반도체 업체는 지속적인 기술 개발과 더불어 효율적인 생산관리에 대응할 수 있도록 하여 국제 경쟁력을 키워야 할 것이다. 따라서 본 연구에서 다루어진 공정의 흐름과 각 단위공정의 특성을 바탕으로 설립된 모델은 서울대학교 반도체 공동 연구소를 대상으로 구현되었으나 앞으로 생산 관리를 담당할 국내 반도체 업체들의 신입사원과 현장기술자의 질적 향상을 위한 시청각 교육용 자료로의 활용 시 상당한 효과를 거둘 것이라 예상된다. 이는 생산업체에 국한되어지는 것만은 아니며 반도체 공정에 관련된 대학 학과목에서도 활용되어지리라 생각된다. 또한 확장성과 변화에 유연한 모델을 개발함으로써 반도체 생산 업체들은 구성된 표준 모델을 이용하여 각 회사의 실정에 맞추어 자사에 대한 시뮬레이션을 손쉽게 수행함으로써 많은 교육 효과와 이에 따른 원가 절감의 효과까지 거둘 수 있을 것이다.

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Virtual Metrology for predicting $SiO_2$ Etch Rate Using Optical Emission Spectroscopy Data

  • Kim, Boom-Soo;Kang, Tae-Yoon;Chun, Sang-Hyun;Son, Seung-Nam;Hong, Sang-Jeen
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.464-464
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    • 2010
  • A few years ago, for maintaining high stability and production yield of production equipment in a semiconductor fab, on-line monitoring of wafers is required, so that semiconductor manufacturers are investigating a software based process controlling scheme known as virtual metrology (VM). As semiconductor technology develops, the cost of fabrication tool/facility has reached its budget limit, and reducing metrology cost can obviously help to keep semiconductor manufacturing cost. By virtue of prediction, VM enables wafer-level control (or even down to site level), reduces within-lot variability, and increases process capability, $C_{pk}$. In this research, we have practiced VM on $SiO_2$ etch rate with optical emission spectroscopy(OES) data acquired in-situ while the process parameters are simultaneously correlated. To build process model of $SiO_2$ via, we first performed a series of etch runs according to the statistically designed experiment, called design of experiments (DOE). OES data are automatically logged with etch rate, and some OES spectra that correlated with $SiO_2$ etch rate is selected. Once the feature of OES data is selected, the preprocessed OES spectra is then used for in-situ sensor based VM modeling. ICP-RIE using 葰.56MHz, manufactured by Plasmart, Ltd. is employed in this experiment, and single fiber-optic attached for in-situ OES data acquisition. Before applying statistical feature selection, empirical feature selection of OES data is initially performed in order not to fall in a statistical misleading, which causes from random noise or large variation of insignificantly correlated responses with process itself. The accuracy of the proposed VM is still need to be developed in order to successfully replace the existing metrology, but it is no doubt that VM can support engineering decision of "go or not go" in the consecutive processing step.

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직업교육을 위한 가상현실 콘텐츠 구현 반도체 생산라인 클린룸 투어 VR 중심으로 (Development of virtual reality contents for vocational education Research on Semiconductor production line Clean Room Tour)

  • 이선민
    • 문화기술의 융합
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    • 제9권1호
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    • pp.191-197
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    • 2023
  • 본 연구의 목적은 반도체 생산라인-클린룸에 활용할 수 있는 가상현실 실습 콘텐츠 제작 설계, 제작과정에 관한상 교육환경을 제공을 목표로 진행하였다. 사용자는 본 과정을 통하여 클린룸 입장 전후의 절차적 지식과 함께, 반도체 솔라셀 주요 제조설비를 직접 체험하는 등 실제에 가까운 체험을 통한 실제적 지식을 습득할 수 있다. 특히 반도체 및 솔라셀 제조공정에 필요한 체험 콘텐츠와 클린룸 입실 절차 체험 콘텐츠 환경 조성하여 사용자에게 실제에 가까운 몰입 경험을 제공하며, 이는 교육의 몰입감, 실재감, 교육의 비용, 효율성 및 교육 만족도 향상을 기대 하였다. 이러한 실감 콘텐츠의 몰입감, 상호작용, 지능화 등 그 특징에 따라 고위험(Dangerous), 체험불가(Impossible), 고대가성(Counter-productive), 고비용(Expensive) 분야에 활발히 적용될 것으로 예상되며, 실감 콘텐츠 학습자가 학습내용에 몰입하게 하고, 주도적/능동적 학습을 유도함은 물론 학습내용을 체화시켜 교육효과 증진 부문에 긍정적인 성과를 기대 하게되었다.