• Title/Summary/Keyword: Schottky-barrier

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Study on Noise Behavior of GaAs SBGFET (GaAs SBGFET의 잡음동작에 관한 연구)

  • 박한규
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.14 no.3
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    • pp.6-11
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    • 1977
  • The noise behavior of the Schottky Barrier Gate FET has been investigated by the use of noise equivalent circuit. It has been found that an additional noise source has to be taken into account in the GaAs SBGFET's biased in the pinch-off region; the intervalley scattering noise and the hot electron noise. In this paper, a noise equivalent circuit has been used to determine the noise parameter which was taken into account influence of the saturation velocity of carrier and parasitic resistance.

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Relationship between Optical Properties Analyzed by Photoluminance of Bonding Structure Analyzed by X-ray Diffractometer (XRD 분석에 의한 결정구조와 PL 분석에 의한 광학적 특성의 상관성)

  • Oh, Teresa
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.1
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    • pp.70-75
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    • 2016
  • GZO films prepared on ITO glasses were annealed at various temperatures in a vacuum condition to research the relationship between oxygen vacancies and optical properties. GZO films after annealing in a vacuum showed the various optical-chemical properties depending on the annealing temperatures and oxygen gas flow rate during the deposition. The oxygen vacancy of GZO film prepared by oxygen gas flows of 22 sccm increased with increasing the annealing temperatures, because of the extraction of oxygen by the annealing. But the intensity of photoluminance of GZO with 22 sccm decreased in accordance with the annealing temperature, because of the reduction of ionized charge carriers. The oxygen vacancy by the extraction of oxygen enhanced a depletion, so the widen depletion had the strong Schottky barrier and the PL intensity due to the low carrier density decreased.

Simulation of metal-semiconductor contact properties for high-performance monolayer MoS2 field effect transistor

  • Park, Ji-Hun;U, Yeong-Jun;Seo, Seung-Beom;Choe, Seong-Yul
    • Proceeding of EDISON Challenge
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    • 2016.03a
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    • pp.299-304
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    • 2016
  • 2차원 반도체 소재의 경우 물질종류마다 내포하고 있는 고유결함에 의해서 Fermi-Level Pinning 이 발생하여 이로 인한 Schottky Barrier transistor로 동작을 하게 되며, 이는 접합부에 Carrier Injection 정도와 Schottky Barrier을 통과하는 Tunneling 정도에 의해서 소자의 특성이 결정 된다. 본 연구에서는 시뮬레이션을 통하여 2차원 반도체인 $MoS_2$소자를 설계하고, S/D Doping에 따라 접촉 저항 개선 효과와 소자의 동작특성이 어떠한 영향을 미치는지 연구하여 최대 $250cm^2/V{\cdot}sec$의 field effect mobility 의 결과를 얻었다. 또한 S/D doping 에 따라 각 저항 성분의 영향을 분석하였으며 면저항 및 접촉 저항 둘 다 doping 농도가 증가함에 따라 감소하는 결과를 나타내며, S/D doping의 영향은 접촉저항에서 더 크게 나타났다. 더불어 2차원 반도체의 Resistance network model 을 제안하여 subthreshold 영역에서는 $R_{ic}$, saturation 영역에서는 $R_{ish}$ 가 전체저항에서 주요한 변수로 전체저항식에 포함되어야 한다는 것을 시뮬레이션을 통해서 검증하였다.

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Schottky Barrier Tunnel Transistor with PtSi Source/Drain on p-type Silicon On Insulator substrate

  • O, Jun-Seok;Jo, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.146-146
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    • 2010
  • 일반적인 MOSFET (Metal-Oxide-Semiconductor-Field-Effect-Transistor)은 소스와 드레인의 형성을 위해서 불순물을 주입하고 고온의 열처리 과정을 거치게 된다. 이러한 고온의 열처리 과정 때문에 녹는점이 낮은 메탈게이트와 게이트 절연막으로의 high-k 물질의 사용에 제한을 받게된다. 이와 같은 문제점을 보완하기 위해서 소스와 드레인 영역에 불순물 주입공정 대신에 금속접합을 이용한 Schottky Barrier Tunnel Transistor (SBTT)가 제안되었다. SBTT는 $500^{\circ}C$ 이하의 저온에서 불순물 도핑없이 소스와 드레인의 형성이 가능하며 실리콘에 비해서 수십~수백배 낮은 면저항을 가지며, 단채널 효과를 효율적으로 제어할 수 있는 장점이 있다. 또한 고온공정에 치명적인 단점을 가지고 있는 high-k 물질의 적용 또한 가능케한다. 본 연구에서는 p-type SOI (Silicon-On-Insulator) 기판을 이용하여 Pt-silicide 소스와 드레인을 형성하고 전기적인 특성을 분석하였다. 또한 본 연구에서는 기존의 sidewall을 사용하지 않는 새로운 구조를 적용하여 메탈게이트의 사용을 최적화하였고 게이트 절연막으로써 실리콘 옥사이드를 스퍼터링을 이용하여 증착하였기 때문에 저온공정을 성공적으로 수행할 수 있었다. 이러한 게이트 절연막은 열적으로 형성시키지 않고도 70 mv/dec 대의 우수한 subthreshold swing 특성을 보이는 것을 확인하였고, $10^8$정도의 높은 on/off current ratio를 갖는 것을 확인하였다.

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An Analysis of RF-DC Converter Circuits with GaN Schottky Barrier Diodes (GaN-SBD를 이용한 RF-DC 변환기 회로 분석)

  • Son, Myung Sik
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.4
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    • pp.68-71
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    • 2021
  • In this paper, GaN-SBD devices with excellent breakdown voltage and frequency characteristics for use in high-power microwave wireless power transmission has been modeled for PSpice circuit simulation. The RF-DC conversion circuits were simulated and compared with a commercial Si-SBD device. Although the modeled GaN-SBD devices had lower RF-DC conversion efficiency compared to Si-SBD at 2.4 and 5.8 GHz, it was confirmed through PSpice circuit simulations that they can be used sufficiently according to the required application circuit in a high power situation.

Cryogenic voltage sampling for arbitrary RF signals transmitted through a 2DEG channel

  • Kim, Min-Sik;Kim, Bum-kyu;Kim, U.J.;Choi, H.K.;Kim, Ju-Jin;Bae, Myung-Ho
    • Progress in Superconductivity and Cryogenics
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    • v.24 no.2
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    • pp.23-26
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    • 2022
  • A lossless transport of an arbitrary waveform in a frequency range of 106-109 Hz through a conduction channel in a cryogenic temperature is of importance for a high-speed operation of quantum device. However, it is hard to use a commercial oscilloscope to directly detect the waveform travelling in a device located in a cryogenic system. Here, we developed a cryogenic voltage sampling technique by using a Schottky barrier gate prepared on a surface of a GaAs/AlGaAs device, which revealed that an incident rectangle waveform can transport through a 1 mm long two-dimensional conduction channel without waveform deformation up to 20 MHz, while further study is needed to increase the detection frequency.

Tunneling Properties of Ferromagnet/p-Si Schottky Diode Structure (강자성체/p-Si의 쇼트키 다이오드 구조에서 터널 특성)

  • 윤문성;이진용;함상희;김순섭;김지훈;김보경;윤태호;이상석;황도근
    • Proceedings of the Korean Magnestics Society Conference
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    • 2002.12a
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    • pp.170-171
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    • 2002
  • 최근에 스핀트로닉스 주요 관심 소자의 하나인 자성체와 반도체 하이브리드형 쇼트키 장벽 다이오드 (Schottky Barrier Diode; SBD) 소자는 금속과 반도체간의 장벽전압에 의해 다수 전자가 이동하는 현상을 이용한 것으로서 과거에 신호 검파용으로 사용하던 금속 접촉 다이오드와 유사한 구조와 원리를 가진다. 내부 저항이 작고 동작속도가 빨라서 PC의 전원 장치와 같이 고속, 고효율을 요구하는 환경에 많이 사용된다. 쇼트키 장벽 소신호 다이오드와 쇼트키 장벽 정류기의 구분은 불분명하며 보통 0.5 A를 기준으로 구분한다. (중략)

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Dependance of Ionic Polarity in Semiconductor Junction Interface (반도체 접합계면이 가스이온화에 따라 극성이 달라지는 원인)

  • Oh, Teresa
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.6
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    • pp.709-714
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    • 2018
  • This study researched the reasons for changing polarity in accordance with junction properties in an interface of semiconductors. The contact properties of semiconductors are related to the effect of the semiconductor's device. Therefore, it is an important factor for understanding the junction characteristics in the semiconductor to increase the efficiency of devices. For generation of various junction properties, carbon-doped silicon oxide (SiOC) was deposited with various argon (Ar) gas flow rates, and the characteristics of the SiOC was varied based on the polarity in accordance with the Ar gas flows. Tin-doped zinc oxide (ZTO) as the conductor was deposited on the SiOC as an insulator to research the conductivity. The properties of the SiOC were determined from the formation of a depletion layer by the ionization reaction with various Ar gas flow rates due to the plasma energy. Schottky contact was good in the condition of the depletion layer, with a high potential barrier between the silicon (Si) wafer and the SiOC. The rate of ionization reactions increased when increasing the Ar gas flow rate, and then the potential barrier of the depletion layer was also increased owing to deficient ions from electron-hole recombination at the junction. The dielectric properties of the depletion layer changed to the properties of an insulator, which is favorable for Schottky contact. When the ZTO was deposited on the SiOC with Schottky contact, the stability of the ZTO was improved by the ionic recombination at the interface between the SiOC and the ZTO. The conductivity of ZTO/SiOC was also increased on SiOC film with ideal Schottky contact, in spite of the decreasing charge carriers. It increases the demand on the Schottky contact to improve the thin semiconductor device, and this study confirmed a high-performance device owing to Schottky contact in a low current system. Finally, the amount of current increased in the device owing to ideal Schottky contact.