• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.50-53
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• 2001

In this study, gate leakage current mechanism has been analyzed for GaAs MESFET with different temperatures ranging from 27$^{\circ}C$ to 300$^{\circ}C$ . It is expected that the thermionic and field emission at the MS contact will dominate the current flow. Thermal cycle is applied to test the reliability of the device. From the results, it is proved that thermal stress gradually increases the gate leakage current at the same bias conditions and leads to the breakdown and failure mechanism which is critical in the field equipment. Finally the gate contact under the repeated thermal shock has been tested to check the quality of Schottky barrier and the current will be expressed in the analytical from to associate with the electrical characteristics of the device.

• 센서학회지
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• 제31권4호
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• pp.271-277
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• 2022

We analyzed the effects of the interface trap on the output characteristics of an inversion mode n-channel GaN Schottky barrier (SB)-MOSFET based on the N_it distribution using TCAD simulation. As interface trap number density (N_it) increased, the threshold voltage increased while the drain current density decreased. Under N_it=5.0×10¹⁰ cm^-2 condition, the threshold voltage was 3.2 V for V_DS=1 V, and the drain current density reduced to 2.4 mA/mm relative to the non-trap condition. Regardless of the N_it distribution type, there was an increase in the subthreshold swing (SS) following an increase in N_it. Under U-shaped N_it distribution, it was confirmed that the SS varied depending on the gate voltage. The interface fixed charge (Q_f) caused an shift in the threshold voltage and increased the off-state current collectively with the surface trap. In summary, GaN SB-MOSFET can be a building block for high power UV optoelectronic circuit provided the surface state is significantly reduced.

• 전기학회논문지
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• 제66권9호
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• pp.1351-1358
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• 2017

In this work, we investigated radiation hardness of GaN-based transistors which are strong candidates for next-generation power electronics. Field effect transistors with three types of gate structures including metal Schottky gate, recessed gate, and p-AlGaN layer gate were fabricated on AlGaN/GaN heterostructure on Si substrate. The devices were irradiated with energetic protons and alpha-particles. The irradiated transistors exhibited the reduction of on-current and the shift of threshold voltage which were attributed to displacement damage by incident energetic particles at high fluence. However, FET operation was still maintained and leakage characteristics were not degraded, suggesting that GaN-based FETs possess high potential for radiation-hardened electronics.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.263-266
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• 2003

The gate leakage current is first calculated using the experimental method between gate and drain by opening source electrode. Next, the gate to drain current has been obtained with a ground source. The difference of two current has been tested and provide that the existence of another source to Schotuy barrier height against the image force lowering effect.

• 한국산학기술학회논문지
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• 제5권1호
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• pp.83-86
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• 2004

고온용 마이크로 전자소자를 이용한 일산화탄소 가스센서를 개발하였다. 100-300℃의 영역에서 가스 감지 특성을 조사하였다. 센서의 가스 감도는 높고, 감지속도는 빠르고 센서는 재현성을 보여 주었다. Pt-SiC 및 Pt-SnO₂ 다이오드는 표준 반도체 공정을 이용하여 제작하였다. CO 가스 감지 특성은 정상상태 및 과도 상태의 조건아래에서 Ⅰ-Ⅴ 및 △Ⅰ-t법을 이용하여 CO 가스 농도와 온도의 함수로서 분석하였다. Pt-SnO₂촉매 층을 갖는 소자의 가스 감도가 Pt 게이트만으로 이루어진 소자보다 높았다. 실험 결과는 SnO₂층이 Pt막의 촉매 반응을 향상시키는 것을 보여주었다.

• 한국전기전자재료학회논문지
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• 제19권9호
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• pp.793-799
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• 2006

In this paper, the gate leakage current is first calculated using the experimental method between gate and drain by opening source electrode. the gate to drain current has been obtained with ground source. The difference between two currents has been tested and proves that the electric field generated by channel charge effect against the image force lowering.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.21-25
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• 1999

In order to remove minority carries of the base region at changing signal in conventional bipolar logic circuit, we made transistor which is composed of NPN transistor shortened buried layer under the Base region, PNP transistor which is merged in base, epi layer and substrate. Also the Ring-Oscillator for measuring transmission time-delay per gate was designed as well. In the result, we get amplitude of logic voltage of 200mV, the minimum of transmission delay-time of 211nS, and the minimum of transmission delay-time per gate of 7.26ns in AC characteristic output of Ring-Oscillator connected Gate.

• 한국정보통신학회논문지
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• 제5권1호
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• pp.157-165
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• 2001

집적 쇼트키 논리 게이트에서 전압 스윙을 크게 하기 위해서 백금 실리사이드 쇼트키 접합의 전기직 특성을 분석하였고, 이 접합에서 프로그램으로 특성을 시뮬레이션 하였다. 분석특성 특성을 위한 시뮬레이션 프로그램은 제조 공정용 SUPREM V와 모델링용 Matlab, 소자 구조용의 Medichi 툴이다. 시뮬레이션 특성을 위한 입력 파라미터는 소자 제작 공정의 공정 단계와 동일한 조건으로 하였다. 분석적인 전기적인 특성들은 순방향 바이어스에서 턴-온 전압, 포화 전류, 이상인자이고, 역방향 바이어스에서 항복 전압을 실제 특성과 시뮬레이션 특성 사이의 결과를 보였다. 결과로써 순방향 턴-온 전압, 역방향 항복전압, 장벽 높이는 기판의 증가된 농도의 변화에 따라 감소되었지만, 포화전류와 이상인자는 증가되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.80-81
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• 2008

Schottky barrier thin film transistors (SB-TFT) on polycrystalline silicon(poly-Si) are fabricated by platinum silicided source/drain for p-type SB-TFT. High quality poly-Si film were obtained by crystallizing the amorphous Si film with excimer laser annealing (ELA) or solid phase crystallization (SPC) method. The fabricated poly-Si SB-TFTs showed low leakage current level and a large on/off current ratio larger than $10^5$. Significant improvement of electrical characteristics were obtained by the additional forming gas annealing in 2% $H_2/N_2$ ambient, which is attributed to the termination of dangling bond at the poly-Si grain boundaries as well as the reduction of interface trap states at gate oxide/poly-Si channel.

• 한국산학기술학회논문지
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• 제9권6호
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• pp.1581-1584
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• 2008

버팅 콘택을 가진 쌍극 폴리사이드 게이트 구조에서 폴리실리콘 내의 순 도핑(net doping) 농도는 $n^+/p^+$ 중첩 및 실리사이드/폴리실리콘 층에서 도펀트의 수평 확산에 기인하여 감소하였다. 버팅 콘택 영역에서의 쇼트키 다이오드 형성은 $CoSi_2$의 열적 응집 현상에 의한 $CoSi_2$ 손실과 폴리실리콘 내의 농도 저하에 기인된다. DDI DRAM에서 기생 쇼트키 다이오드는 감지 증폭기의 노이즈 마진을 감소시켜 column성 불량을 일으킨다. Column성 불량은 $n^+/p^+$ 폴리실리콘 접합 부분을 물리적으로 분리시키거나, $CoSi_2$ 형성 전 질소 이온을 $p^+$ 영역에 주입 시켜 $CoSi_2$의 응집현상을 억제함으로써 줄일 수 있다.