• Journal of the Korean Society for Precision Engineering
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• v.24 no.1 s.190
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• pp.71-78
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• 2007

Abrasive jet machining (AJM) has been traditionally used for removing rusts or paints. Nowadays, this is promising technology for micro bulk machining where brittle substrate materials are used. In order to get accurate details, masks such as metal, polymer or elastomer is inevitable. Among them, photo polymer which is sensitive to the light has been attractive for it's high accuracy using photolithography. In this research, SU-8 as a photo polymer is used since it is adequate for making thick mask. So, this paper describes how to make AJM masks using SU-8 with a photolithography process, and investigates the characteristics of SU-8 masks during AJM process. Also, an example of fabrication using AJM was shown.

• Polymer Science and Technology
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• v.8 no.5
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• pp.622-627
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• 1997

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.8
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• pp.598-604
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• 1999

This paper describes the research to minimize the film stress and maximize the aspect ratio of photoresist structure, especially about SU-8 for electroplating mold. UV LIGA process using SU-8 allows fabricating high aspect ratio polymer structures. However, it is hard to get fine patterns in the high aspect ratio structures because of high internal stress and difficulty of removing SU-8. The purpose of this paper is to setup the process condition for the obtainment of both low film stress and high aspect ratio and to find design rules that make the pattern be less dependent on stress problem. Firstly, the process of heat treatment and exposure of SU-8 are proposed. These two conditions control the amount of cross-linkage in polymer structure, which is the most important parameter of both pattern generation and remaining stress. Heat treatment is dealed with soft bake and post-exposure-bake. Temperature and time duration of each step are varied with heat treatment condition. Some test patterns are fabricated to evaluate the proposed process. Nickel electroplating is performed with the mold fabricated through the proposed process to confirm the SU-8 as a good electroplating mold.

• Journal of Sensor Science and Technology
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• v.16 no.5
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• pp.325-330
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• 2007

For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

• Carbon letters
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• v.24
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• pp.55-61
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• 2017

Carbon micropatterns (CMs) were fabricated from a negative-type SU-8 photoresist by proton ion beam lithography and pyrolysis. Well-defined negative-type SU-8 micropatterns were formed by proton ion beam lithography at the optimized fluence of $1{\times}10^{15}ions\;cm^{-2}$ and then pyrolyzed to form CMs. The crosslinked network structures formed by proton irradiation were converted to pseudo-graphitic structures by pyrolysis. The fabricated CMs showed a good electrical conductivity of $1.58{\times}10^2S\;cm^{-1}$ and a very low surface roughness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.125-128
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• 2004

In this paper, a novel processing technique for fabrication of high-temperature MEMS based on polymer-derived SiCN microstructures is described. PDMS molds are fabricated on SU-8 photoresist using standard UV-photolithographic processes. Liquid precursors are injected into the PDMS mold. And then, the resulting solid polymer structures are crosslinked under isostatic pressure, and pyrolyzed to form a ceramic capable of withstanding over $1500^{\circ}C$. These fabricated SiCN structures would be applied for high-temperature applications, such as heat exchanger and combustion chamber.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.155-156
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• 2013

• Bulletin of the Korean Chemical Society
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• v.27 no.11
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• pp.1763-1768
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• 2006

The application of poly(Co(II)-(1,8-diaminonaphthalene))(poly(Co-DAN)) and poly(1,8-diaminonaphthalene) (Poly(1,8-DAN)) to the electrocatalytic reduction of molecular oxygen was investigated, which were electrochemically grown by the potential cycling method on the glassy carbon electrodes. The reduction of oxygen at the polymer and its metal complex polymer coated electrodes were irreversible and diffusion controlled. The Poly(1,8-DAN) and Poly(Co-DAN) films revealed the potential shifts for the oxygen reduction to 30 mV and 110 mV, respectively, in an aqueous solution, compared with that of the bare electrode. Hydrodynamic voltammetry with a rotating ring-disk electrode showed that Poly(1,8-DAN) and Poly(Co-DAN) coated electrodes converted respectively 84% and 22% of $O_2$ to $H_2O$ via a four electron reduction pathway.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.549-550
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• 2006

It has become topic continuously at MEMS or semiconductor process to form three-dimensional multilayer structure. In this paper, we devised the new polymer pattern method that has multilayer structure. This is method that uses different kind of polymeric material. Specially, polymers used in this study that we propose became all pattern by photolithography, prevented that process increases. Here, polymer that we use used polymer of epoxy order called "SU-8" and polymer of novolak resin called "AZ-1518". The result, "SU-8" was formed pattern to 3.5um thickness, and "AZ-1518" about pattern 3um thickness. Also, It was been 6um thickness at same pattern area.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.376-379
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• 2003

In this paper, a novel processing technique for fabrication of high-temperature MEMS based on polymer-derived SiCN microstructures is described. PDMS molds are fabricated on SU-8 photoresist using standard UV-photolithographic processes. Liquid precursors are injected into the PDMS mold. And then, the resulting solid polymer structures are crosslinked under isostatic pressure, and pyrolyzed to form a ceramic capable of withstanding over $1500^{\circ}C$. These fabricated SiCN structures would be applied for high-temperature applications, such as heat exchanger and combustion chamber.