• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.528-528
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• 2007

Cu CMP widely has been using for the formation of multilevel metal interconnects by the Cu damascene process. And lower dielectric constant materials are required for the below 45nm technology node. As the dielectric constant of dielectric materials are smaller, the strength of dielectric materials become weaker. Therefore these materials are easily damaged by high down pressure during conventional CMP. Also, technical problems such as surface scratches, delamination, dishing and erosion are also occurred. In order to overcome these problems in CMP, the ECMP (electro-chemical mechanical planarization) has been introduced. In this process, abrasive free electrolyte, soft pad and low down force were used. The electrolyte is one of important factor to solve these problems. Also, additives are required to improve the removal rate, uniformity, surface roughness, defects, and so on. In this study, KOH and $NaNO_3$ based electrolytes were used for Cu ECMP and the electrochemical behavior was evaluated by the potentiostat. Also, the Cu surface was observed by SEM as a function of applied voltage and chemical concentration.

• Transactions on Electrical and Electronic Materials
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• 제14권2호
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• pp.90-93
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• 2013

Al:ZnO thin films were deposited using the radio frequency magnetron sputtering technique at various temperatures and sputtering powers. With the increase in the deposition temperature and the decrease in the radio frequency sputtering power, the crystallinity was increased and the surface roughness was decreased, which lead to the decrease in the electrical resistivity of the film. It is also clearly observed that, the intensity of the (002) XRD peak increases with increasing the substrate temperature [1,2]. The electrical resistivity and optical transmittance of the Al:ZnO thin film were analyzed as a function of the post-annealing temperature. It can be seen that with the annealing temperature set at $400^{\circ}C$, the resistivity decreases to a minimum value of $4.1{\times}10^{-3}{\Omega}cm$ and the transmittance increases to a maximum value of 85% of the Al:ZnO thin film.

• 한국전기전자재료학회논문지
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• 제20권4호
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• pp.342-347
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• 2007

$Bi_6Mg_2Nb_4O_{21}(BMN)$ thin films were deposited at various substrates by sputtering system for embedded capacitor applications. BMN thin films deposited at room temperature are manufactured as MIM(Metal/Insulator/Metal) structures. Dielectric properties and leakage current density were investigated as a function of various substrates and thickness of BMN thin films. Leakage current density of BMN thin films deposited on CCL(Copper Clad Laminates) showed relatively high value ($1{\times}10^{-3}A/cm^2$) at an applied field of 300 kV/cm on substrates, possibly due to relatively high value of roughness(rms $50{\AA}$) of CCL substrates. 100 nm-thick BMN thin films deposited on Cu/Ti/Si substrates showed the capacitance density of $300 nF/cm^2$, a dielectric constant of 32, a dielectric loss of 2 % at 100 kHz and the leakage current density of $1{\times}10^{-6}A/cm^2$ at an applied field of 300 kV/cm. BMN capacitors are expected to be promising candidates as embedded capacitors for printed circuit board(PCB).

• 한국전기전자재료학회논문지
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• 제22권2호
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• pp.137-141
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• 2009

AZO transparent conductive thin films were grown on $SiO_2$/Si and glass substrates using diethylzinc (DEZ) and trimethylaluminium (TMA) as the precursor and $H_2O$ as oxidant by atomic layer deposition. The structural, electrical, and optical properties of the AZO films were characterized as a function of film thickness at a deposition temperature of $150^{\circ}C$. The AZO films with various thicknesses show well-crystallized phases and smooth surface morphologies. The 190-nm-thick AZO films grown on Coming 1737 glass substrates exhibit rms(root mean square) roughness of 8.8 nm, electrical resistivity of $1.5{\times}10^{-3}\;{\Omega}-cm$, and an optical transmittance of 84% at 600nm wavelength. Atomic layer deposition technique for the transparent conductive oxide films is possible to apply for the deposition on flexible polymer substrates.

• 한국전기전자재료학회논문지
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• 제27권12호
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• pp.871-876
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• 2014

Efficiency of crystalline Si solar cell can be maximized as minimizing optical loss through antireflection texturing with inverted pyramids. Even if cost-competitive, soft lithography can be employed instead of photolithography for the purpose, some limitations still remain to apply the soft lithography directly to as-received solar grade wafer with a bunch of micro trenches on surface. Therefore, it is needed to develop a low-cost, effective planarization process and evaluate its output to be applicable to patterning process with PDMS stamp. In this study new surface planarization process is proposed and the change of micro scale trenches on the surface as a function of etching time is observed. Also, the effect of trenches on pattern quality by soft lithography is investigated using FEM structural analysis. In conclusion it is clear that the geometry and shape of trenches would be basic considerations for soft lithography application to low quality wafer.

• 한국재료학회지
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• 제31권3호
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• pp.122-131
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• 2021

In the fabrication of joined materials between anodized aluminum alloy and polymer, the performance of the metal-polymer joining is greatly influenced by the chemical properties of the oxide film. In a previous study, the dependence of physical joining strength on the thickness, structure, pore formation, and surface roughness of films formed on aluminum alloys is investigated. In this study, we investigated the effect of silane coupling treatment on the joining strength and sealing performance between aluminum alloy and polymer. After a two-step anodization process with additional treatment by silane, the oxide film with chemically modified nanostructure is strongly bonded to the polymer through physical and chemical reactions. More specifically, after the two-step anodization with silane treatment, the oxide film has a three-dimensional (3D) nanostructure and the silane components are present in combination with hydroxyl groups up to a depth of 150 nm. Accordingly, the joining strength between the polymer and aluminum alloy increases from 29 to 35 MPa, and the helium leak performance increases from 10-2-10-4 to 10-8-10-9 Pa ㎥ s-1.

• Kyungpook Mathematical Journal
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• 제61권4호
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• pp.831-843
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• 2021

In this paper we look at the three dimensional stagnation point flow problem over a rough rotating disk. We study the theoretical behaviour of the stagnation point flow, or forced flow, in the presence of a slip factor in which convective instability stationary modes appear. We make a numerical investigation of the effects of slip on the behaviour of the flow components of the stagnation point flow where the disk is rough. We provide, for the first time in the literature, a complete convective instability analysis and an energy analysis. Suitable similarity transformations are used to reduce the Navier-Stokes equations and the continuity equation into a system of highly non-linear coupled ordinary differential equations, and these are solved numerically subject to suitable boundary conditions using the bvp4c function of MATLAB. The convective instability analysis and the energy analysis are performed using the Chebyshev spectral method in order to obtain the neutral curves and the energy bars. We observe that the roughness of the disk has a destabilising effect on both Type-I and Type-II instability modes. The results obtained will be prominently treated as benchmarks for our future studies on stagnation flow.

• Geomechanics and Engineering
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• 제27권6호
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• pp.615-626
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• 2021

The main objective of this study is to present a fast and reliable approach to predict the swelling potential of clay-bearing rocks. Investigations showed that there is a good correlation between the swelling potential of a rock and its desire to absorb water due to its clay content which could be measured using the "Contact Angle" test as one of the most common ways to determine the wettability. In this test, the angle between a water drop and the flat rock surface on which it rests is measured. The present method is very fast and returns repeatable results and requires minimal sample preparation. Only having a saw-cut surface of a sample with any shape is all one needs to perform this test. The logic behind this approach is that the swelling potential of a rock is a function of its mineral content and molecular structure, which are not only distributed in the bulk of the sample but also reflected on its surface. Therefore, to evaluate swelling behavior, it is not necessary to wait for a sample to get wet all the way to its "internal structure" (which, due to the low permeability of clay-bearing rocks, is very slow and time-consuming). Instead, one can have a good sense of swelling potential by studying its surface. Parametric studies on the effect of moisture content, porosity, and surface roughness on the contact angle measurements showed that using a saw-cut oven-dried sample is a convenient way to evaluate the swelling potential by this method.

• 한국수자원학회:학술대회논문집
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• 한국수자원학회 2021년도 학술발표회
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• pp.63-63
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• 2021

Bed shear stress is important variable in river flow analysis. The bed shear stress has an effects on bed erosion, sediment transport, and mean flow characteristics. Quadratic formula to estimate bed shear stress is widely used, 𝜏=𝜌c_fu|u| in which friction coefficient, c_f, needs to be assigned to numerical models. The aim of this study is to estimate Chezy coefficient using bathymetry data measured by ADCP. Bed form geometry variables will be estimated form bed profile, then Chezy coefficient will be determined using estimated bed form geometry variables in order to set friction coefficient to numerical model. From the probability density function obtained from the bathymetry data, Chezy coefficient will be randomly generated since Chezy coefficient is not uniform over the space and it does not depend on spatial variables such as water depth and distance from river bank. Numerical test will be performed to find to demonstrate randomly extracted Chezy coefficient is appropriate. The result of this study is valuable in that the friction coefficient is estimated in consideration of the bed profile, and as a result, uncertainty of the friction coefficient can be reduced.

• 한국전기전자재료학회논문지
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• 제37권5호
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• pp.527-532
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• 2024

Physically Unclonable Functions (PUFs) provide a high level of security for private keys using unique physical characteristics of hardware. However, fabricating PUF chips requires numerous semiconductor processes, leading to high costs, which limits their applications. In this work, we introduce a low-cost manufacturing method for PUF security chips. First, surface roughening through wet-etching is utilized to create random variables. Additionally, physical vapor deposition is added to further enhance randomness. After PUF chip fabrication, both Hamming distance (HD) and Hamming weight (HW) are extracted and compared to verify the fabricated chip. It is confirmed that the PUF chip using two different multiple process variables demonstrates superior uniqueness and uniformity compared to the PUF security chip fabricated using only a single process variable.