• Title/Summary/Keyword: Resistance Method

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The Analysis of the Nano-Scale MOSFET Resistance

  • Lee Jun Ha;Lee Hoong Joo;Song Young Jin
    • Proceedings of the IEEK Conference
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    • 2004.08c
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    • pp.801-803
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    • 2004
  • The current drive in an MOSFET is limited by the intrinsic channel resistance. All the other parasitic elements in a device structure playa significant role and degrade the device performance. These other resistances need to be less than $10{\%}-20{\%}$ of the channel resistance. To achieve the requirements, we should investigate the methodology of separation and quantification of those resistances. In this paper, we developed the extraction method of resistances using calibrated TCAD simulation. The resistance of the extension region is also partially determined by the formation of a surface accumulation region that forms under the gate in the tail region of the extension profile. This resistance is strongly affected by the abruptness of the extension profile because the steeper the profile is, the shorter this accumulation region will be.

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A Study on Contact Resistance Reduction in Ni Germanide/Ge using Sb Interlayer

  • Kim, Jeyoung;Li, Meng;Lee, Ga-Won;Oh, Jungwoo;Lee, Hi-Deok
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.2
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    • pp.210-214
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    • 2016
  • In this paper, the decrease in the contact resistance of Ni germanide/Ge contact was studied as a function of the thickness of the antimony (Sb) interlayer for high performance Ge MOSFETs. Sb layers with various thickness of 2, 5, 8 and 12 nm were deposited by RF-Magnetron sputter on n-type Ge on Si wafers, followed by in situ deposition of 15nm-thick Ni film. The contact resistance of samples with the Sb interlayer was lower than that of the reference sample without the Sb interlayer. We found that the Sb interlayer can lower the contact resistance of Ni germanide/Ge contact but the reduction of contact resistance becomes saturated as the Sb interlayer thickness increases. The proposed method is useful for high performance n-channel Ge MOSFETs.

Effect of Environmental Factors on the Properties of Polymeric Material : Oil and Ozone Reaction Time (고분자재료의 물성에 미치는 환경인자의 영향: 오일 및 오존반응시간)

  • 박찬영
    • Journal of Environmental Science International
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    • v.9 no.6
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    • pp.511-515
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    • 2000
  • The purpose of this experiment is to prepare ethylene propylene diene terpolymer(EPDM)/ acrylonitrile butadiene rubber(NBR) blend which represents good environmental resistant properties including favorable oil and ozone resistance. With incorporation of EPDM, NBR and other ingredients, the rubber and chemical additives were mixed by mechanical method such as Banbury mixer and open 2-roll mill. Then rubber vulcanizates were manufactured by hot press and mechanical properties, oil and ozone resistance of the test specimens were measured. The oil resistance and ozone resistance of EPDM and NBR, respectively, is remarkably improved by blending EPDM with NBR. The optimum results of oil and zone resistant characteristics were obtained at EPDM/NBR(=25/75 wt%) composition ratio.

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Changes of Average Specific Resistance on Suspension Concentration (현탁액의 농도에 다른 여과 현균비저항값의 변화)

  • 장재선
    • Journal of Environmental Health Sciences
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    • v.22 no.1
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    • pp.12-20
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    • 1996
  • This study was carried out to investigate the change of average .specific resistance according to suspension concentration for study phenomena occurring during filtration period. As the results of this study, the following conclusions were obtained. The average specific resistance in 1% $CaCO_3$ suspension was showed power function(R=0.99), whereas in TOYO 5C and TOYO 5A paper were made little difference under high pressure. It represented from results that filtration theory in concord with cake filtration was no affected the average specific resistance of filter medium in cake filtration. In case of 0.1% $CaCO_3$ suspension filtration, the TOYO 5C was showed power function, whereas in TOYO 5A paper differently. In the present study, the $P_1$ value was calculated from the average specific resistance by filtration method. Therefore, $P_1$ value were $1.68\times 10^4Pa$, $4.05\times 10^3Pa$, and $3.15\times 10^3Pa$ in $5.3\times 10^4Pa$, $1.3\times 10^4Pa$, and $8.2\times 10^3Pa$, respectively. We concluded that propriety of new filtration theory was also proved.

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Dynamic Resistance Monitoring in Primary Circuit during Resistatnce Spot Welding (저항 점용접의 1차 회로 동저항 모니처링에 관한 연구)

  • 조용준;황정복;신현일;배경민;권태용;이세헌
    • Proceedings of the KWS Conference
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    • 1998.10a
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    • pp.129-132
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    • 1998
  • The dynamic resistance monitoring in primary circuit or T/C is one of the important issues in that in-process and real time quality assurance of resistance spot weld is needed to increase the product reliability. It is well known that tile dynamic resistance curve gives us very useful information about nugget growth and weldability. In the present paper, a new dynamic resistance detecting method is presented as a practical manner of weld quality assurance using instantaneous current and voltage measured by primary circuit. Primary dynamic resistance patterns are basically similar to those of the secondary, but there is evident advantage such as no extra devices are needed to obtain the quality assurance index and eventually feedback control will be possible caused by T/C based monitoring system.

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Intelligent quality estimation system using primary circuit variables of RSW (저항점용접 1차 공정변수를 이용한 지능형 용접품질 판단 시스템)

  • 조용준;이세헌;신현일;배경민;권태용
    • Proceedings of the KWS Conference
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    • 1999.10a
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    • pp.142-145
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    • 1999
  • The dynamic resistance monitoring is one of the important issues in that in-process and real time quality assurance of resistance spot weld is needed to increase the product reliability. Secondary dynamic resistance patterns, as a real manner, are hard to adapt those factors in real time and in-plant system. In the present study, a new dynamic resistance detecting method is presented as a practical manner of weld quality assurance at the primary circuit. By the correlation analysis, it is found that the primary dynamic resistance patterns are basically similar to those of the secondary. Various dynamic resistance indices are characterized with the primary curve. And quality of the weld, like the tensile shear strength, is estimated using adaptive neuro-fuzzy estimation system which is consisted of the Sugeno fuzzy algorithm. Through the fuzzy clustering and parameter optimization, real time weld quality assurance system with less efforts is proposed.

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A STUDY OF PROCESS PARAMETER MONITORING AND INTELLIGENT QUALITY ESTIMATION DURING RESISTANCE SPOT WELDING

  • Kim, Taehyung;Yongjun Cho;Kim, Yongjae;Sehun Rhee
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.330-335
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    • 2002
  • Resistance spot welding is one of the most widely used processes in sheet metal fabrication. Quality assurance of welding has been important to increase the productivity. In this study, weld quality estimation using primary circuit dynamic resistance applied to the in-process real-time systems. For quality estimation, factors relating to quality were extracted from the dynamic resistance, measured in the timer. The relationship between these factors and weld quality was determined through a artificial neural network model. This method has the advantage over the conventional one, such as obtaining the quality information without the use of extra devices.

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Real Time Quality Assurance with a Pattern Recognition algorithm during Resistance Spot Welding (패턴 인식 기법을 이용한 저항 점 용접의 실시간 품질 판단)

  • 조용준;이세헌
    • Journal of Welding and Joining
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    • v.18 no.3
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    • pp.114-121
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    • 2000
  • Since resistance spot welding has become one of the most popular sheet metal fabrication processes, a strong emphasis is being put on the quality of the welds. Throughout the years many quality estimation systems have been developed by many researchers to ensure weld quality. In this study, the process variables, which were monitored in the primary circuit of the welding machine, are used to estimate the weld quality with Hopfield neural network. The primary dynamic resistance is vectorized and stored as five patterns in the network. As the welding is done, the dynamic resistance patterns are recognized and the quality is estimated with the proposed method. Due to the primary process variables, it is possible to utilize this algorithms as an in-process real time quality monitoring system.

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Separation and Quantification of Parasitic Resistance in Nano-scale Silicon MOSFET

  • Lee Jun-Ha;Lee Hoong-Joo;Song Young-Jin;Yoon Young-Sik
    • KIEE International Transactions on Electrophysics and Applications
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    • v.5C no.2
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    • pp.49-53
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    • 2005
  • The current drive in a MOSFET is limited by the intrinsic channel resistance. All other parasitic elements in a device structure perform significant functions leading to degradation in the device performance. These other resistances must be less than 10$\%$-20$\%$ of the channel resistance. To meet the necessary requirements, the methodology of separation and quantification of those resistances should be investigated. In this paper, we developed an extraction method for the resistances using calibrated TCAD simulation. The resistance of the extension region is also partially determined by the formation of a surface accumulation region that gathers below the gate in the tail region of the extension profile. This resistance is strongly affected by the abruptness of the extension profile because the steeper the profile is, the shorter this accumulation region will be.

Reduction of metal-graphene contact resistance by direct growth of graphene over metal

  • Hong, Seul Ki;Song, Seung Min;Sul, Onejae;Cho, Byung Jin
    • Carbon letters
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    • v.14 no.3
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    • pp.171-174
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    • 2013
  • The high quality contact between graphene and the metal electrode is a crucial factor in achieving the high performance of graphene transistors. However, there is not sufficient research about contact resistance reduction methods to improve the junction of metal-graphene. In this paper, we propose a new method to decrease the contact resistance between graphene and metal using directly grown graphene over a metal surface. The study found that the grown graphene over copper, as an intermediate layer between the copper and the transferred graphene, reduces contact resistance, and that the adhesion strength between graphene and metal becomes stronger. The results confirmed the contact resistance of the metal-graphene of the proposed structure is nearly half that of the conventional contact structure.