• JSTS:Journal of Semiconductor Technology and Science
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• 제4권3호
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• pp.196-203
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• 2004

A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

• International Journal of Control, Automation, and Systems
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• 제6권4호
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• pp.613-619
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• 2008

A method to produce a desired current pattern in a multiple-source EIT system using voltage sources is presented. Application of current patterns to a body is known to be superior to the application of voltage patterns in terms of high spatial frequency noise suppression, resulting in high accuracy in conductivity and permittivity images. Since current sources are difficult and expensive to build, the use of voltage sources to apply the current pattern is desirable. An iterative algorithm presented in this paper generates the necessary voltage pattern that will produce the desired current pattern. The convergence of the algorithm is shown under the condition that the estimation error of the linear mapping matrix from voltage to current is small. Simulation results are presented to illustrate the convergence of the output current.

• Korean Chemical Engineering Research
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• 제46권2호
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• pp.389-396
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• 2008

벤조시클로부텐(benzocyclobutene; BCB)과 플라즈마 화학기상증착(PECVD)된 산화규소막이 코팅된 웨이퍼들 사이의 계면에서, 고온 열순환 공정에 의한 잔류응력 및 본딩 결합력의 효과를 4점 굽힙시험법과 웨이퍼 곡률 측정법에 의해 평가하였다. 이를 위해 웨이퍼들은 사전에 확립된 표준 본딩공정에 의거하여 본딩하였으며 이들 웨이퍼에 대한 열순환 공정은 상온으로부터 최대 순환온도 사이에서 수행하였다. 최대 온도 350 및 $400^{\circ}C$에서 수행한 열순환 공정에서, 본딩 결합력은 첫번째 순환공정 동안 크게 증가하는 데, 이는 순환공정 시 발생하는 산화규소막의 축합 반응에 의한 잔류응력 감소 때문인 것으로 분석되었다. 이러한 산화규소막의 잔류응력이 감소함에 따라 BCB와 산화규소막으로 구성된 다층막의 잔류응력에 의해 변형되는 에너지는 상승하였고 따라서 BCB와 산화규소막 사이 다층막의 의 본딩 결합력은 증가하였다.

• Journal of Microbiology and Biotechnology
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• 제26권2호
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• pp.213-225
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• 2016

To reduce attrition in drug development, it is crucial to consider the development and implementation of translational phenotypic assays as well as decipher diverse molecular mechanisms of action for new molecular entities. High-throughput fluorescence and confocal microscopes with advanced analysis software have simplified the simultaneous identification and quantification of various cellular processes through what is now referred to as high-content screening (HCS). HCS permits automated identification of modifiers of accessible and biologically relevant targets and can thus be used to detect gene interactions or identify toxic pathways of drug candidates to improve drug discovery and development processes. In this review, we summarize several HCS-compatible, biochemical, and molecular biology-driven assays, including immunohistochemistry, RNAi, reporter gene assay, CRISPR-Cas9 system, and protein-protein interactions to assess a variety of cellular processes, including proliferation, morphological changes, protein expression, localization, post-translational modifications, and protein-protein interactions. These cell-based assay methods can be applied to not only 2D cell culture but also 3D cell culture systems in a high-throughput manner.

• Wind and Structures
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• 제20권3호
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• pp.405-422
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• 2015

In previous model- and full-scale studies, high-amplitude vertical vibrations of mast-arm traffic signal structures have been shown to be due to vortex shedding, a phenomenon in which alternatingly shed, low-pressure vortices induce oscillating forces onto the mast-arm causing a cross-wind response. When the frequency of vortices being shed from the mast-arm corresponds to the natural frequency of the structure, a resonant condition is created causing long-lasting, high-amplitude vibrations which may lead to the fatigue failure of these structures. Turbulence in the approach flow is known to affect the cohesiveness of vortex shedding. Results from this full-scale investigation indicate that the surrounding terrain conditions, which affect the turbulence intensity of the wind, greatly influence the likelihood of occurrence of long-lasting, high-amplitude vibrations and also impact whether reduced service life due to fatigue is likely to be of concern.

• Korean Chemical Engineering Research
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• 제45권5호
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• pp.479-486
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• 2007

BCB 수지를 이용하여 본딩한 웨이퍼의 BCB 두께, 본딩 촉진제의 사용여부 및 이웃하는 적층 물질의 종류에 따른 본딩 결합력에 대한 영향을 4-점 굽힘방법을 이용하여 규명한다. 실험결과 본딩 결합력은 BCB 두께에 선형 비례하는데, 이는 BCB의 소성 변형의 정도가 두께에 비례하는 반면에 BCB의 항복 강도에는 영향을 미치지 않기 때문이다. 본딩한 BCB의 두께가 각각 $2.6{\mu}m$ 및 $0.4{\mu}m$인 경우에 대하여 본딩 촉진제를 사용 했을 때, 본딩 촉진제와 본딩된 물질의 표면에서는 공유 결합이 형성되기 때문에 본딩 결합력이 증가한다. 산화 규소막이 증착된 실리콘 웨이퍼와 BCB 사이 계면에서의 본딩 결합력은 글래스 웨이퍼와 BCB 사이의 계면에서 보다 약 3배 정도 높다. 이러한 본딩 결합력의 차이는 각 계면에서 Si-O 본드의 본딩 밀도 및 본드 파단 에너지의 차이에 기인한다. PECVD 산화 규소막을 증착한 실리콘 웨이퍼와 BCB 사이 계면의 경우, 기 측정된 $18J/m^2$ 및 $22J/m^2$의 본드 파단 에너지를 얻기 위해 각각 약 $12{\sim}13bonds/nm^2$ 및 $15{\sim}16bonds/nm^2$의 Si-O 본드 밀도가 필요하다. 반면에, 글래스 웨이퍼와 BCB 사이 계면의 경우에는 기 측정된 $5J/m^2$의 본드 파단 에너지를 얻기 위해 약 $7{\sim}8bonds/nm^2$의 Si-O 본드 밀도가 필요하다.

• 한국결정성장학회지
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• 제7권1호
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• pp.151-162
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• 1997

Pivalic acid를 진공 증류 및 zone refining을 이용 고순도로 정제하여 온도 표준 기준 물질로의 개발 가능성을 시험하였다. melting plateau curve를 이용하여 99.9997% 순도의 pivalic acid cell들의 삼중점을 측정한 결과 $35.956\pm 0.003^{\circ}C$를 얻을 수 있었다. 이상의 정밀도를 갖는 pivalic acid 삼중점 cell들은 고정밀도를 요구하지 않는 일반 thermistor 온도계류의 보정용으로 충분히 사용 가능한 것으로 판단된다.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2008년도 춘계 학술발표회 초청강연 및 논문집
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• pp.553-562
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• 2008

A remediation technique for buried pipeline system subject to permanent ground deformation is proposed. Specifically, EPS (expanded polystyrene) geofoam blocks are used as low density backfill, thereby reducing soil restraint and pipeline strains. In order to evaluate this remediation technique, a series of 12 centrifuge model tests with HDPE pipe were performed. The amount or spatial extent of the low density backfill was varied, as well as the orientation of the pipe with respect to the fault offset. Specifically, in the $-63.5^{\circ}$ test, the orientation was such that the pipe was placed in flexure and axial tension. The $-85^{\circ}$ orientation placed the pipe mainly in flexure. In all cases, the behavior of the remediated pipe was compared to that for the unremediated pipe. The geofoam backfill was successful in improving pipe behavior for two of the three pipe/fault orientations. However, for the $60^{\circ}$ orientation, the pipe buckled in compression irrespective of the geofoam backfill.

• Advances in aircraft and spacecraft science
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• 제2권3호
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• pp.345-365
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• 2015

This paper focuses on the design, fabrication, testing and analysis of a novel load-bearing element with energy dissipation capability. A single element comprises two von-Mises trusses (VMTs), which are sandwiched between two plates and connected to dashpots that stroke as the VMTs cycle between stable equilibrium states. The elements can be assembled in-plane to form a large plate-like structure or stacked with different properties in each layer for improved load-adaptability. Also introduced in the elements are pre-loaded springs (PLSs) that provide high initial stiffness and allow the element to carry a static load even when the VMTs cannot under harmonic disturbance input. Simulations of the system behavior using the Simscape environment show good overall correlation with test data. Good energy dissipation capability is observed over a frequency range from 0.1 Hz to 2 Hz. The test and simulation results show that a two layer prototype, having one soft VMT layer and one stiff VMT layer, can provide good energy dissipation over a decade of variation in harmonic load amplitude, while retaining the ability to carry static load due to the PLSs. The paper discusses how system design parameter changes affect the static load capability and the hysteresis behavior.

• 한국과학기술학회:학술대회논문집
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• 한국과학기술학회 2007년도 전기 학술대회
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• pp.21-67
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• 2007