• 품질경영학회지
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• 제42권4호
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• pp.633-646
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• 2014

Purpose: The conventional predicted MFTBF by military standard has a wide discrepancy to that of real-world operation, which leads to overstock and increase operation cost. This paper introduces a analyzing frame using operational reliability and cost data to overcome the discrepancy, and provides reliability improvement process employing the analyzing frame. Methods: This paper suggests Reliability-Cost Matrix (R-C Matrix) and Operational Reliability & Cost Index (ORCI) as a tool for reliability evaluation. Results: KOREIP(KAI's Operational Reliability Evaluation and Improvement Process) is developed employing Reliability-Cost Matrix and Operational Reliability & Cost Index. Conclusion: KOREIP provides a process and its activities based on Reliability-Cost Matrix frame. The process and activities leads reliability improvement of aerospace electronic equipments by means of categorizing and follow-up action based on the concept of frame.

• 한국신뢰성학회지:신뢰성응용연구
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• 제15권3호
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• pp.145-148
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• 2015

The products to meet the requirement of are installed in nuclear power plant and the reliability target should be provided in the requirement. However, it is not easy to set a reliability target using quantitative analysis. The objective of this paper is to propose a method of reliability target setting considered warranty cost for process controller and then compare a reliability target with reliability analysis result.

• 한국가스학회지
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• 제16권6호
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• pp.41-47
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• 2012

화학공정을 효율적으로 설계 및 관리하기 위한 도면으로 공정흐름도와 공정배관 계장도가 있다. 본 도면들은 공정의 운전조건 및 설비에 대한 정보를 제공하지만 공정이 정상적으로 운전할 신뢰도는 제공하지 못한다. 따라서 본 연구에서는 유향그래프 분석기법을 이용하여 화학공정의 예방점검 정비주기 및 시점을 결정하기 위한 정보를 제공할 수 있는 신뢰도흐름도를 개발하였다. 유향그래프 분석기법은 화학공정이 정상적으로 작동할 가능성을 평가할 수 있는 기법으로써 노드와 아크를 사용하여 화학공정을 유향그래프로 모델화하고, 이 유향그래프를 순차적으로 해석하여 화학공정의 신뢰도를 평가하는 기법이다. 본 연구에서는 운전시간에 따른 화학공정의 신뢰도를 분석하고, 그 결과를 공정배관 계장도에 삽입하여 신뢰도흐름도를 개발하였다. 본 신뢰도흐름도는 화학공정의 기본 도면인 공정흐름도, 공정배관 계장도와 마찬가지로 화학공정의 설계, 예방점검 등 설비관리에 효율적으로 이용될 수 있을 것이다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제3권3호
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• pp.107-113
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• 2003

Microelectronics device performance and its reliability are directly related to and controlled by its constituent materials and their microstructure. Specific processes used to form and shape the materials microstructure need to be controlled in order to achieve the ultimate device performance. Examples of front-end and back-end ULSI processes, packaging process, and novel optical storage materials are given to illustrate such process-structure-property-reliability relationship. As more novel materials are introduced to meet the new requirements for device shrinkage, such under-standing is indispensable for future generation process development and reliability assessment.

• 산업공학
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• 제19권1호
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• pp.19-25
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• 2006

In the development process, the objective of a reliability growth program is to track the increase in system reliability, and determine as early as possible whether or not the system reliability is growing at a sufficient rate to meet the required goal and allocate available resources accordingly. Implementation of this kind of program will provide very useful information on concept selection, product/process reliability, and cost effectiveness without too much time, money and engineering effort being spent on the development of failure suspect parts. The purpose of this research is to present a practical method for efficiently monitoring a reliability growth test process using AMSAA(Army Materiel Systems Analysis Activity) reliability growth model. The presented growth management is a viable method for identifying failure modes, incorporating design changes and monitoring reliability progress on an on-going basis during the early stages of a product development program.

• International Journal of Reliability and Applications
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• 제12권1호
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• pp.49-60
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• 2011

The geometric process (GP) has been widely used for modeling failure and repair time sequences of repairable systems. The GP is mathematically tractable but restrictive in reliability applications since it actually assumes that the mean function of inter-failure times sequence asymptotically decreases to zero; and the mean function of successive repair times sequence asymptotically increases to infinity. This is generally unrealistic from an engineering perspective. This paper presents three extended GP models for modeling reliability deterioration and improvement (or growth) process. The extensions maintain the advantage of mathematical tractability of GP model. Their usefulness and appropriateness are illustrated with three real-world examples.

• 한국신뢰성학회지:신뢰성응용연구
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• 제15권4호
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• pp.248-255
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• 2015

Purpose : The purpose of this research is to develop the optimized method and process in the reliability-growth target setting, especially for complex and repairable system (or products) such as vehicle and airplane, construction equipment. Method : A reliability-growth test plan specifies a scenario to achieve the planned reliability value (or reliability target). The major elements in test planning are reliability-growth starting time and reliability level at that time, reliability-growth rate and reliability-growth target. All of them except a reliability target can be referred to the previous development data and reference researches. The reliability target level is directly influencing to test period (or time) which is related to test and warranty cost together. There are a few researches about the reliability target setting method and but showing the limitations to consider the views of engineering, business and customer together. There is no research how to handle the target setting process in detail. Result : We develop the optimized method and systematic process in reliability target setting with considering such views. This research also establish the new concept as production capability which means company (or supplier) capability to product its products. Conclusion : In this research result, we apply the new method to a few projects and can set the reasonable test planning. The developing results is showing the good balance between the developing cost and warranty cost at market.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2001년도 정기학술대회
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• pp.273-275
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• 2001

With the continuous advancement in electronics technology, especially the usage of new materials and the introduction of new and immature manufacturing process, stress and time dependent types of physical, chemical and mechanical imperfections are introduced to the electronic hardware. These types of imperfections are called flaws. A reliability stress screening process(RSS) is a process which involves the application of operational and/or environmental stress to electronic hardware on a 100% basis, for the purpose of precipitating inherent, as well as process-induced, flaws while neither destroying nor degrading in a significant way the hardware being stressed.

• 산업경영시스템학회지
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• 제36권2호
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• pp.49-55
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• 2013

When developing a product, ensuring the quality and reliability is essential. Reliability process is always underestimated compared to its importance, especially in the field of domestic medical devices. In this paper, reliability process developed for near-infrared solid microscope, based on a variety of existing practices and other product process. The following findings were obtained as research progressed. First, learning about the medical equipment needed to assure the quality and reliability standards. Second, reliability process established to design a product in the field of medical devices.

• 산업경영시스템학회지
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• 제35권4호
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• pp.1-9
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• 2012

Decisions on reliability screening rules and burn-in policies are determined based on the estimated reliability. The variability in a semiconductor manufacturing process does not only causes quality problems but it also makes reliability estimation more complicated. This study investigates the nonuniformity characteristics of integrated circuit reliability according to defect density distribution within a wafer and between wafers then develops optimal burn-in policy based on the estimated reliability. New reliability estimation model based on yield information is developed using a spatial stochastic process. Spatial defect density variation is reflected in the reliability estimation, and the defect densities of each die location are considered as input variables of the burn-in optimization. Reliability screening and optimal burn-in policy subject to the burn-in cost minimization is examined, and numerical experiments are conducted.