• Journal of Korean Society for Quality Management
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• v.42 no.4
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• pp.633-646
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• 2014

Purpose: The conventional predicted MFTBF by military standard has a wide discrepancy to that of real-world operation, which leads to overstock and increase operation cost. This paper introduces a analyzing frame using operational reliability and cost data to overcome the discrepancy, and provides reliability improvement process employing the analyzing frame. Methods: This paper suggests Reliability-Cost Matrix (R-C Matrix) and Operational Reliability & Cost Index (ORCI) as a tool for reliability evaluation. Results: KOREIP(KAI's Operational Reliability Evaluation and Improvement Process) is developed employing Reliability-Cost Matrix and Operational Reliability & Cost Index. Conclusion: KOREIP provides a process and its activities based on Reliability-Cost Matrix frame. The process and activities leads reliability improvement of aerospace electronic equipments by means of categorizing and follow-up action based on the concept of frame.

• Journal of Applied Reliability
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• v.15 no.3
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• pp.145-148
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• 2015

The products to meet the requirement of are installed in nuclear power plant and the reliability target should be provided in the requirement. However, it is not easy to set a reliability target using quantitative analysis. The objective of this paper is to propose a method of reliability target setting considered warranty cost for process controller and then compare a reliability target with reliability analysis result.

• Journal of the Korean Institute of Gas
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• v.16 no.6
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• pp.41-47
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• 2012

There are PFD(Process Flow Diagram) and P&ID(Piping and Instrument Diagram) for designing and managing chemical process efficiently. They provide the operation condition and equipment specifications of chemical process, but they do not provide the reliability of chemical process. Therefore, in this study, Reliability Flow Diagram(RFD) which provide the cycle and time of preventive maintenance has been developed using Directed Graph Analysis methodology. Directed Graph Analysis methodology is capable of assessing the reliability of chemical process. It models chemical process into Directed Graph with nodes and arcs and assesses the reliability of normal operation of chemical process by assessing Directed Graph sequential. In this paper, the chemical process reliability transition according to operation time was assessed. And then, Reliability Flow Diagram has been developed by inserting the result into P&ID. Like PFD and P&ID, Reliability Flow Diagram provide valuable and useful information for the design and management of chemical process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.3
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• pp.107-113
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• 2003

Microelectronics device performance and its reliability are directly related to and controlled by its constituent materials and their microstructure. Specific processes used to form and shape the materials microstructure need to be controlled in order to achieve the ultimate device performance. Examples of front-end and back-end ULSI processes, packaging process, and novel optical storage materials are given to illustrate such process-structure-property-reliability relationship. As more novel materials are introduced to meet the new requirements for device shrinkage, such under-standing is indispensable for future generation process development and reliability assessment.

• IE interfaces
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• v.19 no.1
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• pp.19-25
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• 2006

In the development process, the objective of a reliability growth program is to track the increase in system reliability, and determine as early as possible whether or not the system reliability is growing at a sufficient rate to meet the required goal and allocate available resources accordingly. Implementation of this kind of program will provide very useful information on concept selection, product/process reliability, and cost effectiveness without too much time, money and engineering effort being spent on the development of failure suspect parts. The purpose of this research is to present a practical method for efficiently monitoring a reliability growth test process using AMSAA(Army Materiel Systems Analysis Activity) reliability growth model. The presented growth management is a viable method for identifying failure modes, incorporating design changes and monitoring reliability progress on an on-going basis during the early stages of a product development program.

• International Journal of Reliability and Applications
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• v.12 no.1
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• pp.49-60
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• 2011

The geometric process (GP) has been widely used for modeling failure and repair time sequences of repairable systems. The GP is mathematically tractable but restrictive in reliability applications since it actually assumes that the mean function of inter-failure times sequence asymptotically decreases to zero; and the mean function of successive repair times sequence asymptotically increases to infinity. This is generally unrealistic from an engineering perspective. This paper presents three extended GP models for modeling reliability deterioration and improvement (or growth) process. The extensions maintain the advantage of mathematical tractability of GP model. Their usefulness and appropriateness are illustrated with three real-world examples.

• Journal of Applied Reliability
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• v.15 no.4
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• pp.248-255
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• 2015

Purpose : The purpose of this research is to develop the optimized method and process in the reliability-growth target setting, especially for complex and repairable system (or products) such as vehicle and airplane, construction equipment. Method : A reliability-growth test plan specifies a scenario to achieve the planned reliability value (or reliability target). The major elements in test planning are reliability-growth starting time and reliability level at that time, reliability-growth rate and reliability-growth target. All of them except a reliability target can be referred to the previous development data and reference researches. The reliability target level is directly influencing to test period (or time) which is related to test and warranty cost together. There are a few researches about the reliability target setting method and but showing the limitations to consider the views of engineering, business and customer together. There is no research how to handle the target setting process in detail. Result : We develop the optimized method and systematic process in reliability target setting with considering such views. This research also establish the new concept as production capability which means company (or supplier) capability to product its products. Conclusion : In this research result, we apply the new method to a few projects and can set the reasonable test planning. The developing results is showing the good balance between the developing cost and warranty cost at market.

• Proceedings of the Korean Reliability Society Conference
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• 2001.06a
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• pp.273-275
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• 2001

With the continuous advancement in electronics technology, especially the usage of new materials and the introduction of new and immature manufacturing process, stress and time dependent types of physical, chemical and mechanical imperfections are introduced to the electronic hardware. These types of imperfections are called flaws. A reliability stress screening process(RSS) is a process which involves the application of operational and/or environmental stress to electronic hardware on a 100% basis, for the purpose of precipitating inherent, as well as process-induced, flaws while neither destroying nor degrading in a significant way the hardware being stressed.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.36 no.2
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• pp.49-55
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• 2013

When developing a product, ensuring the quality and reliability is essential. Reliability process is always underestimated compared to its importance, especially in the field of domestic medical devices. In this paper, reliability process developed for near-infrared solid microscope, based on a variety of existing practices and other product process. The following findings were obtained as research progressed. First, learning about the medical equipment needed to assure the quality and reliability standards. Second, reliability process established to design a product in the field of medical devices.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.35 no.4
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• pp.1-9
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• 2012

Decisions on reliability screening rules and burn-in policies are determined based on the estimated reliability. The variability in a semiconductor manufacturing process does not only causes quality problems but it also makes reliability estimation more complicated. This study investigates the nonuniformity characteristics of integrated circuit reliability according to defect density distribution within a wafer and between wafers then develops optimal burn-in policy based on the estimated reliability. New reliability estimation model based on yield information is developed using a spatial stochastic process. Spatial defect density variation is reflected in the reliability estimation, and the defect densities of each die location are considered as input variables of the burn-in optimization. Reliability screening and optimal burn-in policy subject to the burn-in cost minimization is examined, and numerical experiments are conducted.