• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2006.05a
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• pp.902-905
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• 2006

This paper presents a new RF testing scheme based on a design-for-testability (DFT) method for measuring functional specifications of RF integrated circuits (IC). The proposed method provides input impedance. gain, noise figure. input voltage standing wave ratio (VSWR) and output signal-to-noise ratio (SNR) of a low noise amplifier (LNA). The RF test scheme is based on theoretical expressions that produce the actual RF device specifications by output DC voltages from the DR chip.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.545-546
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• 2006

The improved model that external capacitances are connected to a conventional BSIM3v3 RF Macro model with Rg and Rsub is developed in this paper. The extracted external capacitances and resistances are modeled by scalable fitting equations. The modeled S-parameters of $0.13{\mu}m$ NMOSFET agree well with measured ones from 10MHz to 10GHz, verifying the accuracy of the improved model.

• Proceedings of the KIEE Conference
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• 2003.11c
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• pp.713-716
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• 2003

In recent, the contactless IC card is widely used in traffic, access control system and so forth. Contactless smart cards use a technology that enables card readers to provide power for transactions and communications without making physical contact with the cards. Usually electromagnetic signal is used for communication between the card and the reader. Contactless card is highly suitable for large quantity of card access and data transaction. And its use becomes a general tendency more and more because of the development of RF technology and improvement of requirement for user convenience. This paper describes the hardware module to process contactless protocol for implementation contactless IC card. And the hardware module consists of specific digital logic circuits that analyze digital signal from analog circuit and then generate data & status signal for CPU, and that convert the data from CPU into digital signal for analog circuit.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.2
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• pp.801-807
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• 2012

In this paper, design and implementation of frequency down converter based on LC filter technic. Single frequency down converter, designed a low-noise amplifier, mixer, IF amplifier, LC filter was configured. And it is composed of DC block capacitors and RF bypass capacitor. LC filter, replace it with the IC reduced the power and realized low cost. The gain of single down converter is about 10dBm and realized by 18MHz bandwidth at 70MHz band.

• 한국ITS학회:학술대회논문집
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• 2008.11a
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• pp.607-610
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• 2008

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.411-414
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• 2004

This paper introduces a modulation method for digital wireless communication based on general DS-QPSK. The design and fabrication is for home networking application to a typical RF transmitter with DS-QPSK modulator. This modulator implemented using VHDL hardware programming language, the fabrication of IC chip $5{\times}5 mm^2$ was carried by 27th IDEC MPW(Multi Project Wafer) process in 0.35${\mu}m$ rule at Samsung Inc. This paper presented the important of this technology for the future application in wireless sensor. This module can be efficient usage for home network to transmit the RF wireless sensor system.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.9
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• pp.14-23
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• 2010

This paper reports the fabrication of a DVB-T/H System in Package (SiP) that is able to receive and process the DVB-T/H signal. The DVB-T/H is the European telecommunication standard for Digital Video Broadcasting (DVB). An IC-embedded Printed Circuit Board (PCB) process, interpose a chip between PCB layers, has applied to the DVB-T/H SiP. The chip inserted in DVB-T/H SiP is the System on Chip (SoC) for mobile TV. It is comprised of a RF block for DVB-T/H RF signal and a digital block to convert received signal to digital signal for an application processor. To operate the DVB-T/H IC, a 3MHz DC-DC converter and LDO are on the DVB-T/H SiP. And a 38.4MHz crystal is used as a clock source. The fabricated DVB-T/H SiP form 4 layers which size is $8mm{\times}8mm$. The DVB-T/H IC is located between 2nd and 3rd layer. According to the result of simulation, the RF signal sensitivity is improved since the layout modification of the ground plane and via. And we confirmed the adjustment of LC value on power transmission is necessary to turn down the noise level in a SiP. Although the size of a DVB-T/H SiP is decreased over 70% than reference module, the power consumption and efficiency is on a par with reference module. The average power consumption is 297mW and the efficiency is 87%. But, the RF signal sensitivity is declined by average 3.8dB. This is caused by the decrease of the RF signal sensitivity which is 2.8dB, because of the noise from the DC-DC converter.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.3
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• pp.57-57
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• 2001

본 논문에서는 RFID를 위한 읽기 전용 CMOS 트랜스폰더를 one-chip으로 설계하였다. 리더에서 공급되는 자기장으로부터 트랜스폰더 칩의 전원을 공급하기 위한 전파정류기를 NMOS 트랜지스터를 사용하여 설계하였으며, 데이터 저장 소자로는 64비트의 ROM을 사용하였다. 메모리에 저장되어 있는 ID 코드는 Manchester 코딩되어 front-end 임피던스 변조 방식으로 리더에 전송된다. 임피던스 변조를 위한 감폭회로로는 리더와 트랜스폰더 사이의 거리가 변해도 일정한 감폭율을 갖는 새로운 감폭회로를 사용하였다. 설계된 회로는 0.65㎛ 2-poly, 2-metal CMOS 공정을 사용하여 IC로 제작되었다. 칩 면적은 0.9㎜×0.4㎜이다. 측정 결과 설계된 트랜스폰더 IC는 인식거리 내에서 약 20∼25%의 일정한 감폭율을 보이며, 125㎑의 RF에 대해 3.9kbps의 데이터 전송속도를 보인다. 트랜스폰더 칩의 전력소모는 읽기 모드시 약 100㎼이다. 인식거리는 약 7㎝이다.

• Proceedings of the KIEE Conference
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• 2002.11c
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• pp.481-484
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• 2002

In recent, the contactless IC card is widely used in traffic, access control system and so forth. And its use becomes a general tendency more and more because of the development of RF technology and improvement of requirement for user convenience. This paper describes the hardware module to process contactless protocol for implementation contactless IC card. And the hardware module consists of specific digital logic circuits that analyze digital signal from analog circuit and then generate data & status signal for CPU, and that convert the data from CPU into digital signal for analog circuit.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1776-1778
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• 2000

The demands placed on portable wireless communication equipment include low cost, low supply voltage, low power, dissipation, low noise, high frequency of operation, and low distortion. These design requirements cannot be met satisfactorily in many cases without the use of RF inductors. However, implementing the inductor on-chip has been regarded as an impractical task because of excessive substrate capacitance and substantial resistive losses due to metallization and the conductive silicon substrate. Hence, there is a great incentive to design, optimize, and model spiral inductors on Si substrate. So, we analyzed a chip inductors using electromagnetic analysis and established a set of design rules for rectangular spiral inductors.