• 대한전자공학회논문지SD
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• 제47권10호
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• pp.1-6
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• 2010

본 연구에서는 S-파라미터 측정 데이터를 사용하는 RF측정방법으로 short-channel MOSFET의 RF 캐패시턴스 전압(C-V) 곡선을 상온에서 $225^{\circ}C$까지 추출하였으며, 추출된 고온 종속 특성을 엠피리컬하게 모델링하였다. RF C-V 특성곡선의 weak inversion영역에서 온도 변화에 따른 voltage shift가 threshold voltage shift보다 적은 현상이 관찰되었지만, 기존 long-channel C-V 이론 방정식으로 설명할 수 없는 현상임이 입증되었다. 이러한 short-channel C-V 곡선의 고온 종속 모델링을 위해서 새로운 엠피리컬 방정식이 개발되었다. 이 방정식의 정확도는 모델된 C-V곡선과 측정 데이터가 넓은 온도범위에서 잘 일치하는 결과를 관찰함으로써 입증되었다. 또한, 높은 게이트 전압에서는 온도가 증가함에 따라 채널 캐패시턴스 값이 감소하는 것을 확인할 수 있다.

• 한국표면공학회지
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• 제25권5호
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• pp.271-281
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• 1992

Amorphous hydrogenated silicon carbide(a-Si1-xCx : H) films have been prepared by the rf sputtering using a silicon target in a gas mixture of Argon and methane with varying methane gas flow rate(fCH) in the range of 1.5 to 3.5 sccm at constant Argon flow rate of 30sccm and rf power in the range of 3 to 6 W/$\textrm{cm}^2$. The effects of methane flow rate and rf power on the structure and optical properties of a-Si1-xCx : H films have been analysed by measuring both the IR absorption spectrum and the UV transmittance for the films. With increasing the methane flow rate, the optical band gap(Eg) of a-Si1-xCx : H films increases gradually from 1.6eV to the maximum value of 2.42eV at rf power of 4 W/$\textrm{cm}^2$, which is due to an increases in C/Si ratio in the films by an significant increase in the number of C-Hn bonds. As the rf power increases, the number of Si-C and Si-Hn bonds increases rapidly with simultaneous reduction in the number of C-Hn bonds, which is associated with an increase in both degree of methane decomposition and sputtering of silicon. The effects of rf power on the Eg of films are considerably influenced by the methane flow rate. At low methane flow rate, the Eg of films decreased from 2.3eV to 1.8eV with the rf power. On the other hand, at high methane flow rate, that of films increased slowly to 2.4eV.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.406-408
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• 1999

Amorphous carbon nitride thin films were prepared on pretreated silicon(100) substrate in sputtering graphite target by activated gas phase using RF reactively sputtering. We measured the FT-IR spectrum to identify C=N(nitrile)stretching mode(2200cm$\^$-1/), C-H stretching mode(2800cm$\^$-1/), C-H bending mode, C=C stretching mode C=N(imino) mode(1680cm$\^$-1/ ), and the XPS to investigate chemical structure of surface. By the results of FT-H and XPS spectrum, We confirmed that amorphous carbon nitride films with typel (C(1s): 285.9[eV], N(1s): 398.5[ev]) and type 2(C1s): 287.5[eV, N(1s): 400.2[eV]) successfully were synthesized by RF reactively sputtering

• 한국세라믹학회지
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• 제34권2호
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• pp.202-208
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• 1997

Bi층 SrBi2Ta2O9(SBT)박막을 상온에서 rf magnetron sputtering에 의해 Pt/Ti/SiO2/Si기판위에 증착한 다음 산소 분위기 하에서 1시간동안 75$0^{\circ}C$, 80$0^{\circ}C$, 85$0^{\circ}C$로 열처리하였다. 타겟은 박막내의 Bi와 Sr의 부족을 보상하기 위해 20mole%의 Bi2O3와 30mole%의 SrCO3를 과잉으로 넣어 사용하였으며, 80$0^{\circ}C$로 열처리한 박막의 조성은 Sr0.7Bi2.0Ta2.0O9.0이었다. 200nm의 두께를 갖는 이 SBT박막은 치밀한 미세구조와, 1MHz의 주파수에서 210의 유전상수, 0.05의 유전손실을 나타내었고, 또한 100 kMz에서 32$0^{\circ}C$의 큐리온도를 나타냈으며 그 온도에서의 유전상수는 314이었다. 이 SBT박막의 잔류분극(2Pr)과 항전계(2Ec)값은 각각 인가전압 3V에서 9.1$\mu$C/$\textrm{cm}^2$과 85kV/cm이었고, 5V의 bipolar pulse 하에서 1010 cycle까지 피로현상이 나타나지 않았으며, 누설전류 밀도는 150kV/cm에서 7$\times$10-7A/$\textrm{cm}^2$의 값을 보였다. rf magnetron sputtering 으로 제조된 SBT박막은 비휘발성 메모리 소자에의 응용이 가능하다.

• 한국전기전자재료학회논문지
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• 제18권11호
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• pp.977-982
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• 2005

Al/AlN/n-type 6H-SiC (0001) MIS structures were prepared by AlN layers on vicinal 6H-SiC(0001) substrates with reactive RF magnetron sputtering method. The AlN films were annealed at $900^{\circ}C$, $N_2$ atmosphere lot 1 minutes showed the best result. With XRD analysis, AlN(0002) peak was clearly found. The typical dielectric constant value of the AlN film in the MIS capacitors was obtained as 8.4 from photo C-V. Also, the gate leakage current density of the MlS capacitor was $10^{-10}\;A/cm^2$ order within the electric field of 1.8 MV/cm. Finally, the amount of interface trap densities, $D_{it}$, was evaluated as $5.3\times10^{10}\;eV^{-1}cm^{-2}$ at (Ec-0.85) eV.

• 한국재료학회지
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• 제13권4호
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• pp.205-212
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• 2003

RF sputtering process was applied to produce thin hydroxyapatite［HA, Ca10($PO_4$)$_{6}$ $ (OH)_2$films on Ti-6Al-4V alloy substrates. To make a 101.6 mm dia.${\times}$5 mm HA target, the commercial HA powder was first calcinated for 3h at $200^{\circ}C$. A certain amount of the calcinated HA powder was pressed under a pressure of 20,000 psi by the cold isostatic press(CIP) and the pressed HA target was sintered for 6 h at $1,200^{\circ}C$. The effects of different heat treating conditions on the bonding strength between HA thin films and Ti-6Al-4V alloy substrates were studied. Before deposition, the alloy substrates were annealed for 1 h at $850^{\circ}C$ under $3.0${\times}$10^{-3}$ Xtorr, and after deposition, the hydroxyapatite/Ti-6Al-4V alloy thin films were annealed for 1 h at 400, 600 and $800^{\circ}C$ under the atmosphere, respectively. Experimental results represented that the HA thin films on the annealed substrates had higher hardness than non-heat treated substrates before the deposition.

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권6호
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• pp.653-657
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• 2015

A new paired gate-source voltage RF capacitance-voltage (C-V) method of extracting the effective channel length and parasitic capacitance using the intersection between two closely spaced linear regression lines of the gate capacitance versus gate length measured from S-parameters is proposed to remove errors from conventional C-V methods. Physically verified results are obtained at the gate-source voltage range where the slope of the gate capacitance versus gate-source voltage is maximized in the inversion region. The accuracy of this method is demonstrated by finding extracted value corresponding to the metallurgical channel length.

• 한국세라믹학회지
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• 제35권5호
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• pp.472-478
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• 1998

Ferroelectric SrBi2Ta2O9(SBT) films were deposited on Pt/Ti/SiO2/Si substrates at 50$0^{\circ}C$ using a sintered SBT target Bi and Ta targets by modified rf magnetron sputtering and then were annealed at 80$0^{\circ}C$ for 10min in oxygen ambinet(760 torr) The composition of the SBT films could be easily controlled using the mul-ti-targets. The film composition of {{{{ {Sr }_{0.8 } {Bi }_{2.9 } {Ta}_{2.0 } {O }_{9 } }} was obtained with SBTd sputtering power of 100 W Bi of 25W and Ta of 10 W. A 250nm thick SBT films exhibited a dense and uniform microstructure and showed the remanent polarization(Pr) of 14.4 $\mu$C/cm2 and the coercive field({{{{ {E }_{c } }})of 60 kV/cm at applied voltage of 5 V. The SBT films show practically no polarization fatigue up to {{{{ {10 }_{10 } }} cycles under 5V bipolar pulse. The retention characteristics of the SBT films looked very promising and the leakage current density of the SBT films was about 1.23$\times${{{{ {10 }^{-7 } }}A/c{{{{ {m }^{2 } }} at 120kV/cm.

• 한국재료학회지
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• 제16권4호
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• pp.264-271
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• 2006

RF sputtering process was applied to produce thin hydroxyapatite(HAp) films on Ti-6Al-4V alloy substrates. The effects of different heat treatment conditions on the chemical composites between HAp thin films and Ti-6Al-4V alloy substrates were studied. After deposition, the HAp thin films were heat treated for 1h at $400^{\circ}C,\;600^{\circ}C\;and\;800^{\circ}C$ under the atmosphere, and analyzed O/M, FESEM-EDX and ESCA, respectively. Experimental results represented that interface of HAp thin films and Ti-6Al-4V alloy substrates was composed Ti-OH, TiO, TiN, $Al_2O_3,\;V_2O_3,\;VO_2$. pyrophosphate and decreased carbide followed by the increase of heat treatment temperature.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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• pp.88-91
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• 2000

The $(Sr_{0.85}Ca_{0.15})TiO_3$(SCT) thin films are deposited on Pt-coated electrode(Pt/TiN/$SiO_2$/Si) using RF sputtering method. The crystallinity of SCT thin films is increased with increase of substrate temperature in the temperature range of 200~500$[^{\circ}C]$. V-I characteristics of SCT thin films show the increasing leakage current with the increases of deposition temperature. The conduction mechanism of the SCT thin films observed in the temperature range of 25~100$[^{\circ}C]$ can be divided into four characteristic regions with different mechanism by the increasing current.