• 한국표면공학회지
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• 제41권3호
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• pp.88-93
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• 2008

Ir-Re thin films with Ti interlayer were deposited onto the tungsten carbide substrate by ion beam assisted DC magnetron sputtering. The Ir-Re films were prepared with targets of having two atomic percent of 7:3 and 5:5. The microstructure and surface analysis of the specimen were conducted by using SEM, XRD and AFM. Mechanical properties such as hardness and adhesion strength of Ir-Re thin film also were examined. The interlayer of pure titanium was formed with 100 nm thickness. The film growth of Ir-30at.%Re was faster than that of Ir-50at.%Re in the same deposition conditions. Ir-Re thin films consisted of dense and columnar structure irrespective of the different target compositions. The values of hardness and adhesion strength of Ir-30at.%Re thin film coated on WC substrate were higher than those of Ir-50at.%Re thin film.

• 한국표면공학회지
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• 제36권1호
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• pp.27-33
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• 2003

Pulsed magnetron sputtering of graphite target was employed for deposition of diamond-like carbon (DLC) films. Time-resolved probe measurements of magnetron discharge plasma have been performed. It was shown that the pulsed magnetron discharge plasma density ($∼10^{17}$ $m^{-3}$ ) is close to that of vacuum arc cathode sputtering of graphite. Raman spectroscopy was sed to examine DLC films produced at low ( $U_{sub}$ / < 1 kV) pulsed bias voltages applied to the substrate. It has been shown that maximum content of diamond-like carbon in the coating (50-60%) is achieved at energy per deposited carbon atom of $E_{c}$ =100 eV. In spite of rather high percentage of $sp^3$-bonded carbon atoms and good scratch-resistance, the films showed poor adhesion because of absence of ion mixing between the film and the substrates. Electric breakdowns occurring during the deposition of the insulating DLC film also thought to decrease its adhesion.

• 한국세라믹학회지
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• 제37권10호
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• pp.1014-1020
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• 2000

RF 마크네트론 스퍼터법으로 Ce의 일부를 희토류 원소로 치환한 Ce$_{1-x}$RE$_{x}$O$_{2-y}$(0.1$\leq$x$\leq$0.4, RE=Y, Nd) 박막을 Si(111), $Al_2$O$_3$(1012) 기판 위에 1450~1$600^{\circ}C$로 소결한 target을 이용하여 성장시켰다. Ce$_{1-x}$RE$_{x}$O$_{2-y}$ 박막의 성장시 기판온도 및 증착시간 등을 변화시켜 성장시켰으며, 성장된 박막의 특성분석은 XRD, SEM, TEM으로 행하였다. 증착된 박막의 방향성 및 결정성장 거동은 증착온도 및 시간에 따라 차이를 보였다. Si(111) 기판 위에 증착된 Ce$_{1-x}$Y$_{x}$O$_{2-y}$(x=0.3) 박막의 경우, 80$0^{\circ}C$에 비해 7$50^{\circ}C$에서 증착 시간에 따른 (111) 우선배향성의 정도가 나은 결과를 보였으며, $Al_2$O$_3$(1012) 기판 위에 증착한 Ce$_{1-x}$Nd$_{x}$O$_{2-y}$(x=0.3) 박막 또는 (111) 우선배향성을 나타내었다.을 나타내었다.

• 반도체디스플레이기술학회지
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• 제2권3호
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• pp.19-23
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• 2003

Extended unbalanced magnetron sputtering system based on the cylindrical magnetron with a rotating cathode was developed. The unbalanced configuration of magnetic field was realized by means of additional lines of permanent magnets, placed along both sides of a 89 mm outer diameter and 600 mm long cylindrical cathode. The performance of the unbalanced magnetron was assessed in terms of the ion current density and the ion-to-atom ratio incident at the substrate. Furthermore, the paper presents the comparison of the internal plasma parameters, such as the electron temperature, electron density, plasma and floating potentials, measured by a Langmuir probe in various positions from the cathode, for conventional and unbalanced constructions of the cylindrical magnetron. The plasma density and ion current density are about 3-5 times higher than those of conventional one, in the unbalanced magnetron in a 0.24 Pa Ar atmosphere with a DC cathode power of 3 kW.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2006년도 춘계학술대회
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• pp.162-165
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• 2006

AZO (ZnO:Al) were fabricated by RF magnetron sputtering In $H_2/Ar(5%\;H_2)$ atmosphere, and structural, electrical and optical properties were investigated. The substrate temperatures were varied at RT, $100^{\circ}C,\;150^{\circ}C$ and$200^{\circ}C$. The resistivity of the films grown in $H_2/Ar(5%\;H_2)$ were reduced from $7.67{\times}10^{-4}{\Omega}\;cm$ to $5.95{\times}10^{-4}{\Omega}\;cm$ comparing that Ar (100%) and the transmittance of the ZnO:Al films in the visible range was 85%.

• 한국표면공학회지
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• 제36권4호
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• pp.296-300
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• 2003

Extended cylindrical magnetron sputtering system with rotating 600-mm long and 90-mm diameter graphite cathode and pulsed power supply voltage generator were developed and fabricated. Time-dependent Langmuir probe characteristics as well as carbon films thickness were measured. It was shown that ratio of ions flux to carbon atoms flux for pulsed magnetron discharge mode was equal to $\Phi_{i}$ $\Phi$sub C/ = 0.2. It did not depend on the discharge current in the range of $I_{d}$ / = 10∼60 A since both the plasma density and the film deposition rate were found approximately proportional to the discharge current. In spite of this fact carbon film structure was found to be strongly dependent on the discharge current. Grain size increased from 100 nm at $I_{d}$ = 10∼20 A to 500 nm at $I_{d}$ = 40∼60 A. To deposit fine-grained hard nanocrystalline or amorphous carbon coating current regime with $I_{d}$ = 20 A was chosen. Pulsed negative bias voltage ($\tau$= 40 ${\mu}\textrm{s}$, $U_{b}$ = 0∼10 ㎸) synchronized with magnetron discharge pulses was applied to a substrate and voltage of $U_{b}$ = 3.4 ㎸ was shown to be optimum for a hard carbon film deposition. Lower voltages were not sufficient for amorphization of a growing graphite film, while higher voltages led to excessive ion bombardment and effects of recrystalization and graphitization.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.96-97
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• 2012

In nitride and oxide film deposition, sputtered metals react with nitrogen or oxygen gas in a vacuum chamber to form metal nitride or oxide films on a substrate. The physical properties of sputtered films (metals, oxides, and nitrides) are strongly influenced by magnetron plasma density during the deposition process. Typical target power densities on the magnetron during the deposition process are ~ (5-30) W/cm2, which gives a relatively low plasma density. The main challenge in reactive sputtering is the ability to generate a stable, arc free discharge at high plasma densities. Arcs occur due to formation of an insulating layer on the target surface caused by the re-deposition effect. One current method of generating an arc free discharge is to use the commercially available Pinnacle Plus+ Pulsed DC plasma generator manufactured by Advanced Energy Inc. This plasma generator uses a positive voltage pulse between negative pulses to attract electrons and discharge the target surface, thus preventing arc formation. However, this method can only generate low density plasma and therefore cannot allow full control of film properties. Also, after long runs ~ (1-3) hours, depends on duty cycle the stability of the reactive process is reduced due to increased probability of arc formation. Between 1995 and 1999, a new way of magnetron sputtering called HIPIMS (highly ionized pulse impulse magnetron sputtering) was developed. The main idea of this approach is to apply short ${\sim}(50-100){\mu}s$ high power pulses with a target power densities during the pulse between ~ (1-3) kW/cm2. These high power pulses generate high-density magnetron plasma that can significantly improve and control film properties. From the beginning, HIPIMS method has been applied to reactive sputtering processes for deposition of conductive and nonconductive films. However, commercially available HIPIMS plasma generators have not been able to create a stable, arc-free discharge in most reactive magnetron sputtering processes. HIPIMS plasma generators have been successfully used in reactive sputtering of nitrides for hard coating applications and for Al2O3 films. But until now there has been no HIPIMS data presented on reactive sputtering in cluster tools for semiconductors and MEMs applications. In this presentation, a new method of generating an arc free discharge for reactive HIPIMS using the new Cyprium plasma generator from Zpulser LLC will be introduced. Data (or evidence) will be presented showing that arc formation in reactive HIPIMS can be controlled without applying a positive voltage pulse between high power pulses. Arc-free reactive HIPIMS processes for sputtering AlN, TiO2, TiN and Si3N4 on the Applied Materials ENDURA 200 mm cluster tool will be presented. A direct comparison of the properties of films sputtered with the Advanced Energy Pinnacle Plus + plasma generator and the Zpulser Cyprium plasma generator will be presented.

• 한국세라믹학회지
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• 제41권4호
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• pp.328-333
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• 2004

RF magnetron sputtering법에 의해 단상의 하이드록시아파타이트와 하이드록시아파타이트은 복합코팅층을 ZrO$_2$와 Si 웨이퍼 기판에 코팅하였다. 이들 코팅층들의 두께 0.7∼1.0$\mu\textrm{m}$ 범위였으며 또한 거칠기(roughness)는 3∼4nm였다. 열처리된 HAp 코팅층은 나노크기의 결정들로 구성되어 있었으며, 반면 Ag가 함유된 복합코팅층의 경우 결정질과 비결정질이 혼재되어 있었다. 열처리 전 HAp 코팅층의 Ca/P비는 1.9였고, Ag의 함량이 증가함에 따라 비는 감소하는 경향을 나타내었다. 또한 Ag 함량이 증가함에 따라 HAp코팅층의 미소 경도는 감소하였다.

• 한국세라믹학회지
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• 제41권2호
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• pp.106-110
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• 2004

NiO 산화물 타겟을 이용한 RF 마그네트론 스퍼터로 상온에서 Si(100) 기판 위에 NiO 박막을 증착시켜, 스퍼터 가스의 산소 유량비가 NiO 박막의 결정 배향성과 표면 형상에 미치는 영향을 조사하였다. Ar 가스에서 증착된 NiO 박막은 높은결정화도와 (100)면의 우선 배향성을 나타내었으나, $O_2$ 가스에서 증착된 경우에는 (111)면의 우선 배향성을 보였으며 그 증착속도도 감소하였다. 스퍼터 가스의 $O_2$ 함량에 따른 NiO 박막의 결정성과 우선배향성 변화에 대한 요인을 고찰하였으며, 박막의 표면 형상과 거칠기의 변화를 조사하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.70-70
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• 2017

TSV(through silicon via)는 긴 종횡비를 갖는 패턴에 Cu, Ta, Ti을 높은 conformality를 갖도록 증착하는 공정이다. Magnetron cathode의 자석 배열 설계는 target 물질 종류에 따라서 multitrack, water drop type등이 있으며 target과 substrate 사이의 공간에 플라즈마를 형성시켜서 기판에 이온 입사량을 늘린 후 기판 바이어스를 이용하여 이온 충돌, re-sputtering을 통한 재증착 과정을 통해 치밀한 금속 박막을 연속적으로 형성할 수 있도록 하는 것이 목적이다. 또한 sputter가 사용되고 있는 분야에 효율을 증대시키고, 증착되는 막의 품질향상을 위해 UBMS를 사용하고 있으며, 산업에 사용되어 지는 300 mm wafer용 시스템은 제작비가 약 10억 원 정도 소요되며 다양한 테스트를 진행하기 위해선 많은 비용이 소요된다. 따라서 비용과 소요시간을 줄여 다양한 테스트를 위해 소규모 플라즈마 시스템을 설계하게 되었다. 61 l/sec 터보 분자 펌프와 다이아프램 펌프를 기초로한 TMP station에 2.75 인치 CF flange가 장착된 6 way cross를 main 챔버로 활용하고, 작은 size의 unbalanced magnetron cathode를 제작, 장착한 다음 6 way cross 주변에 전자석을 적절히 배치하여 300 mm wafer system에서와 동일한 물리적 현상을 테스트 할 수 있도록 하였다. Fig1. (a) UBMS system의 사진을 나타내었고, (b)에는 6 way cross 내부에 발생된 플라즈마의 형상을 나타내었다. 전원 장치는 Advanced Energy사의 MDX-1.5K DC power supply를 사용하였고, 방전 전압 - 전류 관계의 가스 압력에 따른 plasma 현상과 magnetron 배율에 따른 plasma 현상 그리고 전자석에 의한 영향을 주로 관찰 하였다.