• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.2
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• pp.10-18
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• 2011

In order to develop highly-integrated RGBY(Red, Green, Blue, Yellow) LED light, a high thermal radiation ceramic package was manufactured, and the encapsulation process was applied with a vacuum printing encapsulation system(VPES). After the completion of vacuum printing, the shape of the encapsulation layer could be controlled by heat treatment during the curing process, and the optical power became highly increased as the encapsulation layer approached a dome shape. The optical characteristics involved in a Correlated Color Temperature(CCT), a Color Rendering Index (CRI), and the efficiency of RGBY LED light were able to be identified by the experimental designing method. Regarding the characteristics of the white light of RGBY LED light, which were measured on the basis of the aforementioned optical characteristics, CRI posted 88, CCT recorded 5,720[$^{\circ}K$], and efficiency exhibited 52[lm/W]. The chip temperature of RGBY LEDs was below 55[$^{\circ}C$] when the consumption power of LED chips was 0.1[W] for the red, 0.3[W] for the green, 0.08[W] for the blue, and 0.24[W] for the yellow. Also, the thermal resistance of the highly-integrated RGBY LED light measured by T3Ster was 2.3[K/W].

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.13-13
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• 2009

We have investigated the fabrication and properties of bendable PZT film formed on plastic substrates for the application in flexible memory. These devices used the PZT active layer formed on $SiO_2/Si$ wafer by sol-gel method with optimized device layouts and Pt electrodes. After etching Pt/PZT/Pt layers, patterned by photolithography process. these layers were transferred on PET plastic substrate using elastomeric stamp. The level of performance that can be achieved approaches that of traditional PZT. devices on rigid bulk wafers.

• Journal of Applied Reliability
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• v.9 no.2
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• pp.131-148
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• 2009

An organic light emitting diode (OLED), also light emitting polymer (LEP) and organic electro luminescence (OEL), is any light emitting diode (LED) whose emissive electroluminescent layer is composed of a film of organic compounds. The layer usually contains a polymer substance that allows suitable organic compounds to be deposited. They are deposited in rows and columns onto a flat carrier by a simple "printing" process. The resulting matrix of pixels can emit light of different colors. Such systems can be used in television screens, computer displays, small, portable system screens such as cell phones and PDAs, advertising, information and indication. OLEDs can also be used in light sources for general space illumination, and large-area light-emitting elements. In this paper, we develop the general guide line of the accelerated life test for assuring B10 life of AMOLED(Active Matrix Organic Light Emitting Diode) and PMOLED(Passive Matrix Organic Light Emitting Diode) which are widely used for display monitor less than 115 mm.

• Journal of Powder Materials
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• v.23 no.4
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• pp.276-281
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• 2016

Carbonyl iron (CI) is successfully incorporated as an additive into a polystyrene (PS) matrix via a highenergy ball milling method, under an n-hexane medium with volume fractions between 1% and 5% for electromagnetic interference shielding applications by the combination of magnetic CI and an insulating PS matrix. The morphology and the dispersion of CI are investigated by field emission scanning electron microscopy, which indicates a uniform distribution of CI in the PS matrix after 2 h of milling. The thermal behavior results indicate no significant degradation of the PS when there is a slight increase in the onset temperature with the addition of CI powder, when compared to the as-received PS pellet. After milling, there are no interactions between the CI and the PS matrix, as confirmed by Fourier transformed infrared spectroscopy. In this study, the milled CI-PS powder is extruded to make filaments, and can have potential applications in the 3-D printing industry.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.866-869
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• 2004

A carbon nanotube field emission display(CNT FED) panel with a 2 inch diagonal size was fabricated by using a screen printing of a prepared photo-sensitive CNT paste and vacuum in-line sealing technology. After a surface treatment of the patterned CNT, only the carbon nanotube tips are uniformly exposed on the surface. The diameter of the exposed CNTs are usually about 20nm. The sealing temperature of the panel was around 390 $^{\circ}C$ and the vacuum level was obtained with $1.4{\times}10^{-5}$torr at the sealing. The field emission properties of the diode type CNT FED panel were characterized Now, we are developing a triode type CNT FED with a self-aligned gate-emitter structure.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.77-77
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• 2010

본 연구에서는 Sn-3.0Ag-0.5Cu (SAC305) 무연솔더의 최적 인쇄성을 위한 PCB 및 마스크설계, 스크린프린팅 공정변수의 최적값을 실험계획법을 통해 평가하였다. 사용된 칩은 가로 0.4mm 세로 0.2mm의 0402 MLCC칩이며, 사용된 시험보드는 OSP 표면처리된 PCB이었다. 인쇄성을 판단하기 위한 공정인자는 금속마스크 두께, 마스크홀 크기, 패드크기 및 모양, 인쇄각도, 인쇄속도, 판분리속도이었다. ANOVA분석을 통해 주인자를 파악하였으며, 인쇄성에 영향을 미치는 주인자는 마스크두께와 인쇄각도임이 확인되었다. 그 후 중심 합성법을 이용하여 인쇄성 최적 조건을 확인하였다. 결과로 나타난 등고선/표면도를 통해, 마스크두께가 작을 때에는 인쇄각도가 작아야 높은 인쇄성을 갖으며, 또한 마스크 두께가 클 경우에는 인쇄각도가 커야 높은 인쇄성을 가짐을 알 수 있었다. 추가실험을 통해서 인쇄성 표면도의 정확도를 확인하였으며, 실험값은 표면도에서 표시된 인쇄성값과 비슷함을 알 수 있었다. 또한, 인쇄성이 낮은 영역과 높은 영역에서 접합강도값을 측정하였으며, 인쇄성이 좋은 영역에서 접합강도도 높음을 알 수 있었다.

• Journal of the Korean Ceramic Society
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• v.41 no.1
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• pp.30-35
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• 2004

PMW-PZT thick films of about $30{\mu}m$ thickness were fabricated on Pt/$TiO_2$/$SiN_x$Si substrate by the hybrid method of screen printing and PZT sol application. With the increase of the number of the sol application times, the sintered density and electrical properties of PMW-PZT thick films were evidently increased. For the PMW-PZT thick film with PZT sol application of 10-times, the dielectric constant ($\varepsilon_r$) was 745 at the frequency of 100 KHz and thepiezoelectric coefficient ($d_33$) was 155 pC/N at the applied pressure of 1 atm.

• Journal of Oral Medicine and Pain
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• v.8 no.1
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• pp.77-82
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• 1983

The author measured the degree of alveolar bone resorption around mandibular central incisors in Korean female(254). Mandibulr central incisors were selected from the females who do not have periodontal disease or malocclusion. The selected radiograms were enlarged in the $5"\times7"$ printing papers for the precise measuring. The obtained results were as follows : 1. The average alveolar bone resorption around mandibular central incisors in Korean women were 1.91mm in 3rd decade, 2, 16mm in 4th decade, 2.51mm in 5th deacade, 2.70mm in 6th decade, 2.94mm in older age group. 2. Alveolar bone resorption and age were in positive correlation; there is a tendency that the alveolar bone resorption increase with aging. 3. The regression equation is as follows. Y=13.57x + 7.06(r=0.60, n=254) (Y=estimated age, x=Length(C-E Junction alveolar crest)lar crest)

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.91-97
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• 2022

The wettability and rheological properties of solder paste with the size of the solder powder were evaluated. To formulate the solder paste, three types of solder powder were used: T4 (20~28 ㎛), T5 (15~25 ㎛), and T6 (5~15 ㎛). The viscosities of the T4, T5, and T6 solder pastes at 10 RPM were 155, 263, and 418 Pa·s, respectively. After 7 days, the viscosity of the T4 solder paste slightly increased by 2.6% and that of T5 was increased by 20.6%. The viscosity of the T6 solder paste after 7 days could not be measured due to high viscosity. The viscosity variation with solder particle size also affected on the printability of the solder. In the case of the T4 solder paste, printability, slump, bridging, and soldering properties were excellent. On the other hand, T5 showed slight dewetting and solder ball defects. Especially, T6, which the smallest powder size, showed poor printability and dewetting at the edge of solder.

• Korean Journal of Materials Research
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• v.25 no.12
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• pp.719-726
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• 2015

For a decade, solution-processed functional materials and various printing technologies have attracted increasingly the significant interest in realizing low-cost flexible electronics. In this study, Cu nanoparticles are synthesized via the chemical reduction of Cu ions under inert atmosphere. To prevent interparticle agglomeration and surface oxidation, oleic acid is incorporated as a surface capping molecule and hydrazine is used as a reducing agent. To endow water-compatibility, the surface of synthesized Cu nanoparticles is modified by a mixture of carboxyl-terminated anionic polyelectrolyte and polyoxylethylene oleylamine ether. For reducing the surface tension and the evaporation rate of aqueous Cu nanoparticle inks, the solvent composition of Cu nanoparticle ink is designed as DI water:2-methoxy ethanol:glycerol:ethylene glycol = 50:20:5:25 wt%. The effects of poly(styrene-co-maleic acid) as an adhesion promoter(AP) on rheology of aqueous Cu nanoparticle inks and adhesion of Cu pattern printed on polyimid films are investigated. The 40 wt% aqueous Cu nanoparticle inks with 0.5 wt% of Poly(styrene-co-maleic acid) show the "Newtonian flow" and has a low viscosity under $10mPa{\cdots}S$, which is applicable to inkjet printing. The Cu patterns with a linewidth of $50{\sim}60{\mu}m$ are successfully fabricated. With the addition of Poly(styrene-co-maleic acid), the adhesion of printed Cu patterns on polyimid films is superior to those of patterns prepared from Poly(styrene-co-maleic acid)-free inks. The resistivities of Cu films are measured to be $10{\sim}15{\mu}{\Omega}{\cdot}cm$ at annealing temperature of $300^{\circ}C$.