A Study on RGBY LED Light using a Vacuum Printing Encapsulation Systems Method
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Jang, Min-Suk
(한국광기술원 반도체조명연구센터)
Kim, Yeoung-Woo (한국광기술원 LED 융합 연구센터) Shin, Gi-Hae (한국광기술원 반도체명연구센터) Park, Joung-Wook (한국광기술원 반도체조명 연구센터) Hong, Jin-Pyo (한국광기술원 반도체조명 연구센터) Song, Sang-Bin (한국광기술원 반도체조명 연구센터) Kim, Jae-Pil (한국광기술원 반도체조명 연구센터) |
1 | Atsushi Okuno and Noriko Fujita, “Filling the Via hole of IC by VPES(Vacuum Printing Encapsulation Systems) for stacked chip (3D packaging)”, Int'l Symposium on Electronic Materials and packaging, pp.133-138, 2002. |
2 | 김병년, 박민기, “LED를 이용한 고효율 비상등 시스템에 관한 연구” 한국조명전기설비학회 논문집, pp.6-8, 2010. |
3 | S. Muthu, F. J. P. Schuurmans, and M. D. Pashley, “Red, green, and blue LED based white light generation : lssues and control”, Proc. IEEE Industry Application Conference, Vol. 1, pp.327-333, Oct. 13-18, 2002. |
4 | E. F. Schubert, Light-Emitting Diodes, Cambridge University Press, 2006. |
5 | X. Qu, S.-C. Wong, and C. K. Tse, “Color control system for RGB LED light sources using junction temperature measurement”, Proc. IEEE Industrial Electronics Society, Nov. 5-8, pp.1361-1368, 2007. |
6 | 김래원 공저, “고출력 LED 및 고체광원 조명기술”, 아진출판사, 2006. |
7 | B. Pa가 et al., “A Study on the Preference of Changes of Color and Pattern of a LED(R,G,B) Luminaire”, KIIEE Autumn Conference 2006. |
8 | J. R. de Britto, et al., “A Proposal of LED Lamp Driver for Universal input Using Cuk Converter”, IEEE PESC 2008, pp.2640-2644, August, 1996. |
9 | 정병호, 김남오, 김덕구, 오금곤, 조금배, 이강연, “백색 LED와 RGB 멀티칩 LED 조명 장치의 특성 분석” 한국조명전기설비학회 논문지, Vol.23, NO.12, pp.23-30, 2009.12. 과학기술학회마을 DOI ScienceOn |
10 | Atsushi Okuno, Noriko Fujita and Yuki Ishikawa, “Low Cost and High Reliability Extremity CSP Packaging Technology”, Electronic components and Technology Conference, pp.1201-1204, 1999. |
11 | Atsushi Okuno, “Wafer Level CSP Process by VPES (Vacuum Printing Encapsulation Systems)” Int'l Symposium on Electronic Materials and packaging, pp.143-151, 2000. |
12 | 이레테크 미니탭사업부 저, “MINITAB 실무 완성”, 이레테크 2000. |
13 | 신무환,김재필, “LED 패키징 기술 입문”, 북스힐, 2009. |
14 | Atsushi Okuno, Noriko Fujita and Yuki Ishikawa, “High Reliability, High Density, Low Cost Packaging Systems for Matrix Systems for Matrix BGA and CSP by Vacuum Printing Encapsulation Systems(VPES)”, Proc. IEEE Transactions on advanced packaging, Vol. 22, NO.3 pp.391-396, August, 1999. DOI |
15 | Atsushi Okuno, “High Reliability, High Density, Low Cost Packaging Systems for Matrix BGA and CSP using Vacuum Printing Encapsulation Systems(VPES)”, Electronic Components and Technology Conference, pp.109-110, May 1998. |
16 | 임용빈, 박성현, 안병진, 김영일, “실용적인 실험계획법”, 자유아카데미, 2008. |
17 | Atsushi Okuno and Noriko Fujita, “Filling the Via hole of IC by VPES(Vacuum Printing Encapsulation Systems) for stacked chip (3D packaging)”, Electronic components and Technology Conference, pp.1444-1448, 2002. |
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