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http://dx.doi.org/10.6117/kmeps.2022.29.2.091

Effects of Solder Particle Size on Rheology and Printing Properties of Solder Paste  

Jun, So-Yeon (Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology)
Lee, Tae-Young (Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology)
Park, So-Jeong (Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology)
Lee, Jonghun (Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology)
Yoo, Sehoon (Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.2, 2022 , pp. 91-97 More about this Journal
Abstract
The wettability and rheological properties of solder paste with the size of the solder powder were evaluated. To formulate the solder paste, three types of solder powder were used: T4 (20~28 ㎛), T5 (15~25 ㎛), and T6 (5~15 ㎛). The viscosities of the T4, T5, and T6 solder pastes at 10 RPM were 155, 263, and 418 Pa·s, respectively. After 7 days, the viscosity of the T4 solder paste slightly increased by 2.6% and that of T5 was increased by 20.6%. The viscosity of the T6 solder paste after 7 days could not be measured due to high viscosity. The viscosity variation with solder particle size also affected on the printability of the solder. In the case of the T4 solder paste, printability, slump, bridging, and soldering properties were excellent. On the other hand, T5 showed slight dewetting and solder ball defects. Especially, T6, which the smallest powder size, showed poor printability and dewetting at the edge of solder.
Keywords
fine pitch; solder paste; rheology; flux; viscosity; printability; wettability;
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Times Cited By KSCI : 1  (Citation Analysis)
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