• Journal of Advanced Marine Engineering and Technology
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• v.39 no.8
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• pp.801-806
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• 2015

The experimental analysis of a crevice-type vapor chamber heat pipe (CVCHP) is investigated. The heat source of the CVCHP is a high-power light-emitting diode (LED). The CVCHP, which exhibits a bubble pumping effect, is used for heat dissipation in a high-heat-flux system. The working fluid is R-141b, and its charging ratio was set at 60 vol.% of the vapor chamber in a heat pipe. The total thermal conductivity of the falling-liquid-film-type model, which was a modified model, was 24% larger than that of the conventional model in the LED package. Flow visualization results indicated that bubbles grew larger as they combined. These combined bubbles pushed the working fluid to the top, partially wetting the heat-transfer area. The thermal resistance between the vapor chamber and tube in the modified design decreased by approximately 32%. The overall results demonstrated the better heat dissipation upon cooling of the high-power LED package.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.4
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• pp.255-261
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• 2005

With the advent of sub-90nm technologies, the system-on-chip (SoC) and system-in-package (SiP) are becoming the trend in delivering low-cost, low-power, and small-form-factor consumer electronic systems running at multiple GHz. The shortened transistor channel length reduces the transistor switching cycles to the range of several picoseconds, yet the time-of-flights of the critical on-chip and off-chip interconnects are in the range of 10 picoseconds for 1.5mm-long wires and 100 picoseconds for 15mm-long wires. Designers realize the bottleneck today often lies at chip-to-chip interconnects and the industry needs a good model to compute the inductance in these parts of circuits. In this paper we propose a new method for extracting accurate equivalent inductance circuit models for SPICE-level circuit simulations of system-on-chip (SoC) and system-in-package (SiP) designs. In our method, geometrical meshes are created and numerical methods are used to find the solutions for the electromagnetic fields over the fine meshes. In this way, multiple-GHz SoC and SiP designers can use accurate inductance modeling and interconnect optimization to achieve high yields.

• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.45-49
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• 2022

Through Silicon Via (TSV) is a technology that interconnects chips through silicon vias. TSV technology can achieve shorter distance compared to wire bonding technology with excellent electrical characteristics. Due to this characteristic, it is currently being used in many fields that needs faster communication speed such as memory field. However, there is performance degradation issue on TSV technology due to the parasitic capacitance. To deal with this problem, in this study, the parasitic capacitance with TSV design factors is analyzed using commercial tool. TSV design factors were set in three categories: size, aspect ratio, pitch. Each factor was set by dividing the range with TSV used for memory and package. Ansys electronics desktop 2021 R2.2 Q3D was used for the simulation to acquire parasitic capacitance data. DOE analysis was performed based on the reaction surface method. As a result of the simulation, the most affected factors by the parasitic capacitance appeared in the order of size, pitch and aspect ratio. In the case of memory, each element interacted, and in the case of package, it was confirmed that size * pitch and size * aspect ratio interact, but pitch * aspect ratio does not interact.

• The Korean Journal of Applied Statistics
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• v.29 no.6
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• pp.1077-1094
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• 2016

Apache Spark is a fast and general-purpose cluster computing package. It provides a new abstraction named resilient distributed dataset, which is capable of support for fault tolerance while keeping data in memory. This type of abstraction results in a significant speedup compared to legacy large-scale data framework, MapReduce. In particular, Spark framework is suitable for iterative machine learning applications such as logistic regression and K-means clustering, and interactive data querying. Spark also supports high level libraries for various applications such as machine learning, streaming data processing, database querying and graph data mining thanks to its versatility. In this work, we introduce the concept and programming model of Spark as well as show some implementations of simple statistical computing applications. We also review the machine learning package MLlib, and the R language interface SparkR.

• The Journal of Bigdata
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• v.5 no.2
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• pp.155-170
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• 2020

The purpose of this study was to apply machine learning techniques (Decision Tree, Random Forest, XGBoost) to data from the 4th~6th year of the Seoul Education Longitudinal Study to find the factors predicting the career maturity of middle school students in Seoul city. In order to evaluate the machine learning application result, the performance of the model according to the indicators was checked. In addition, the model was analyzed using the XGBoostExplainer package, and R and R Studio tools were used for this study. As a result, there was a slight difference in the ranking of variable importance by each model, but the rankings were high in 'Achievement goal awareness', 'Creativity', 'Self-concept', 'Relationship with parents and children', and 'Resilience'. In addition, using the XGBoostExplainer package, it was found that the factors that protect and deteriorate career maturity by panel and 'Achievement goal awareness' is the top priority factor for predicting career maturity. Based on the results of this study, it was suggested that a comparative study of machine learning and variable selection methods and a comparative study of each cohort of the Seoul Education Termination Study should be conducted.

• Journal of Integrative Natural Science
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• v.15 no.1
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• pp.9-18
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• 2022

This research examines the power of bootstrap two-sample test, and compares it with the powers of two-sample t-test and Wilcoxon rank sum test, through simulation. For simulation work, a positively skewed and heavy tailed distribution was selected as a population distribution, the chi-square distributions with three degrees of freedom, χ²₃. For two independent samples, the fist sample was selected from χ²₃. The second sample was selected independently from the same χ²₃ as the first sample, and calculated d+ax for each sampled value x, a randomly selected value from χ²₃. The d in d+ax has from 0 to 5 by 0.5 interval, and the a has from 1.0 to 1.5 by 0.1 interval. The powers of three methods were evaluated for the sample sizes 10,20,30,40,50. The null hypothesis was the two population medians being equal for Bootstrap two-sample test and Wilcoxon rank sum test, and the two population means being equal for the two-sample t-test. The powers were obtained using r program language; wilcox.test() in r base package for Wilcoxon rank sum test, t.test() in r base package for the two-sample t-test, boot.two.bca() in r wBoot pacakge for the bootstrap two-sample test. Simulation results show that the power of Wilcoxon rank sum test is the best for all 330 (n,a,d) combinations and the power of two-sample t-test comes next, and the power of bootstrap two-sample comes last. As the results, it can be recommended to use the classic inference methods if there are widely accepted and used methods, in terms of time, costs, sometimes power.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2021.05a
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• pp.463-465
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• 2021

Currently, the inspection method printed on food packages and boxes is to sample only a few products and inspect them with human eyes. Such a sampling inspection has the limitation that only a small number of products can be inspected. Therefore, accurate inspection using a camera is required. This paper proposes a deep learning object recognition technology model, which is an artificial intelligence technology, as a method for detecting the defects of expiration date printed on the product packaging. Using the Faster R-CNN (region convolution neural network) model, the color images, converted gray images, and converted binary images of the printed expiration date are trained and then tested, and each detection rates are compared. The detection performance of expiration date printed on the package by the proposed method showed the same detection performance as that of conventional vision-based inspection system.

• Korean Journal of Microbiology
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• v.32 no.3
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• pp.177-181
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• 1994

The sequences of the cytoplasmic 5S rRNAs(EMBL accession number X73589 and X73890) from two polupores, Ganoderma applanatum and Schizopora paradoxa, were determined by the direct chemical method for sequencing RNA and compared to the sequences of 9 reported mushrooms. 5S rRNAs of Ganoderma applanatum and Schizopora paradoxa consisted of 118 bases and fit the secondary structure model of the 5S rRNAs of basidiomycetes proposed by Huysmans et al. Based on Kimura’s K_nuc values, the closest fungus to Ganoderma applanatum was Ceratobasidium cornigerum and the one to Schizopora paradoxa was Bjerkandera adusta. When the secondary structures of 5S rRNAs of 11 mushrooms were compared the base substitution occurred at helix regions more than at loop regions. When a phylogenetic tree was constructed using the Neighbor program of the PHYLIP package, it partially discriminated and separated the mushrooms of the Hymenomycetes by the order.

• Korean Journal of Food Science and Technology
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• v.36 no.4
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• pp.580-585
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• 2004

Respiration of 'Fuyu' persimmon (Diospyros kaki) fruits were measured in terms of oxygen consumption rate and carbon dioxide evolution by closed system experiments at 0, 5, and $20^{\circ}C$. Enzyme kinetics-based respiration model was used to describe respiration rate as function of $O_2\;and\;CO_2$ gas concentrations $(R=V_m[O_2]/K_m+(1+[CO_2]/K_i)[O_2])$, and Arrhenius equation was applied to analyze temperature effect. $V_m\;and\;K_m$ increased, while $K_i$ decreased, with increasing temperature. $K_m\;of\;O_2$ consumption was greater than that of $CO_2$ evolution at equal temperature. Inhibitory effect of reduced $O_2$ level on $O_2$ consumption was more prominent than that on $CO_2$ evolution. Activation energy of respiration decreased with reduced $O_2$ and elevated $CO_2$ concentrations. Activation energy of $CO_2$ evolution was greater than that of $O_2$ consumption. Permeable package experiments verified respiration model parameters by showing good agreement between predicted and experimental gas concentrations in package.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.