• Journal of the Korea Institute of Information and Communication Engineering
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• 제13권3호
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• pp.531-536
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• 2009

In this paper, we propose $256{\times}256$ pixel array fingerprint sensor with an advanced circuits for detecting. The pixel level simple detection circuit converts from a small and variable sensing current to binary voltage out effectively. We minimizes an electrostatic discharge(ESD) influence by applying an effective isolation structure around the unit pixel. The sensor circuit blocks were designed and simulated in standard CMOS $0.35{\mu}m$ process. Full custom layout is performed in the unit sensor pixel and auto placement and routing is performed in the full chip.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 한국항해항만학회 2009년도 공동학술대회
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• pp.131-132
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• 2009

The container terminal can be divided into berth-side, yard area and gate. Until now, many studies related to the improvement of the terminal operation efficiency have been focused on berth and yard productivity. With regard to gate operation, existing studies were examined from hardware perspectives such as non-stop system using RFID(Radio Frequency Identification) or OCR(Optical Character Reader). Relatively little research has been curried out on the improvement of the gate in/out process. In this regard, this paper proposes the method to improve the terminal operation efficiency.

• KSII Transactions on Internet and Information Systems (TIIS)
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• 제8권9호
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• pp.3034-3055
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• 2014

Wireless Sensor Networks have extensively been utilized for ambient data collection from simple linear structures to dense tiered deployments. Issues related to optimal resource allocation still persist for simplistic deployments including linear and hierarchical networks. In this work, we investigate the case of dimensioning parameters for linear and tiered wireless sensor network deployments with notion of providing extended lifetime and reliable data delivery over extensive infrastructures. We provide a single consolidated reference for selection of intrinsic sensor network parameters like number of required nodes for deployment over specified area, network operational lifetime, data aggregation requirements, energy dissipation concerns and communication channel related signal reliability. The dimensioning parameters have been analyzed in a pipeline monitoring scenario using ZigBee communication platform and subsequently referred with analytical models to ensure the dimensioning process is reflected in real world deployment with minimum resource consumption and best network connectivity. Concerns over data aggregation and routing delay minimization have been discussed with possible solutions. Finally, we propose a node placement strategy based on a dynamic programming model for achieving reliable received signals and consistent application in structural health monitoring with multi hop and long distance connectivity.

• Journal of Korea Multimedia Society
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• 제19권8호
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• pp.1636-1645
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• 2016

In navigation systems that use collected trajectory for routing, the number and diversity of trajectory data are crucial despite the infeasible limitation which is that all routes should be collected in person. This paper suggests an algorithm combining trajectories only by collected GPS data and generating new routes for solving this problem. Using distance between two trajectories, the algorithm estimates road intersection, in which it also predicts the correlated direction of them with geographical coordinates and makes a decision to combine them by the correlated direction. With combined and generated trajectory data, this combination way allows trajectory-based navigation to guide more and better routes. In our study, this solution has been introduced. However, the ways in which correlated direction is decided and post-process works have been revised to use the sequential pattern of triangles' area GPS information between two trajectories makes in road intersection and intersection among sets comprised of GPS points. This, as a result, reduces unnecessary combinations resulting redundant outputs and enhances the accuracy of estimating correlated direction than before.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 한국해양정보통신학회 2009년도 추계학술대회
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• pp.1030-1034
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• 2009

IPv6 and Ubiquitous Healthcare Environment (UHE) has become a main stream of the next generation technologies. IPv6 is designed in many ways with enhanced features such as a routing, mobility, scalability, QOS and security as a replacement of IPv4. Also, UHE is developed to provide patients with convenience and efficient healthcare services using the remote home healthcare system. However, IPv4 currently used as an Internet protocol does not have enough capability to fully support UHE. It may result in a restricted implementation of UHE. As a result, research on IPv6 implementations in UHE is increasingly becoming an issue within the healthcare industry. IPv6 has enhanced features to implement the remote healthcare system such as Neighbour Discovery process and address auto-configuration. In this paper, a basic of IPv6 and UHE will be firstly introduced and secondly, benefits brought by IPv6 in UHE will be discussed. In addition, security issues in IPv6 will be analysed to conclude this paper.

• Journal of Information Processing Systems
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• 제15권4호
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• pp.833-852
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• 2019

In real time applications, due to their effective cost and small size, wireless networks play an important role in receiving particular data and transmitting it to a base station for analysis, a process that can be easily deployed. Due to various internal and external factors, networks can change dynamically, which impacts the localisation of nodes, delays, routing mechanisms, geographical coverage, cross-layer design, the quality of links, fault detection, and quality of service, among others. Conventional methods were programmed, for static networks which made it difficult for networks to respond dynamically. Here, machine learning strategies can be applied for dynamic networks effecting self-learning and developing tools to react quickly and efficiently, with less human intervention and reprogramming. In this paper, we present a wireless networks survey based on different machine learning algorithms and network lifetime parameters, and include the advantages and drawbacks of such a system. Furthermore, we present learning algorithms and techniques for congestion, synchronisation, energy harvesting, and for scheduling mobile sinks. Finally, we present a statistical evaluation of the survey, the motive for choosing specific techniques to deal with wireless network problems, and a brief discussion on the challenges inherent in this area of research.

• International Journal of Naval Architecture and Ocean Engineering
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• 제13권1호
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• pp.575-584
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• 2021

This study contains the process of developing a Mission Planning System (MPS) of an USV that can be applied in real situations and verifying them through HILS. In this study, we set the scenario of a single USV with limited operating time. Since the USV may not perform some missions due to the limited operating time, an objective function was defined to maximize the Mission Achievement Rate (MAR). We used a genetic algorithm to solve the problem model, and proposed a method using a 3-D population. The simulation showed that the probability of deriving the global optimal solution of the mission planning algorithm was 96.6% and the computation time was 1.6 s. Furthermore, USV showed it performs the mission according to the results of the MPS. We expect that the MPS developed in this study can be applied to the real environment where USV performs missions with limited time conditions.

• Journal of Communications and Networks
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• 제10권3호
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• pp.316-330
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• 2008

This paper proposes a novel method for transporting various types of user traffic effectively over the next generation network called integrated services digital network 3 (ISDN3) (or quantum network) using quantum packets. Basically, a quantum packet comprises one or more 53-byte quanta as generated by a "quantumization" process. While connection-oriented traffic is supported by fixed-size quantum packets each with one quantum to emulate circuit switching, connectionless traffic (e.g., IP packets and active packets) is carried by variable-size quantum packets with multiple quanta to support store-and-forward switching/routing. Our aim is to provide frame-like or datagram-like services while enabling cell-based multiplexing. The quantum packet method also establishes a flexible and extensible framework that caters for future packetization needs while maintaining backward compatibility with ATM. In this paper, we discuss the design of the quantum packet method, including its format, the "quantumization" process, and support for different types of user traffic. We also present an analytical model to evaluate the consumption of network resources (or network costs) when quantum packets are employed to transfer loss-sensitive data using three different approaches: cut-through, store-and-forward and ideal. Close form mathematical expressions are obtained for some situations. In particular, in terms of network cost, we discover two interesting equivalence phenomena for the cut-through and store-and-forward approaches under certain conditions and assumptions. Furthermore, analytical and simulation results are presented to study the system behavior. Our analysis provides valuable insights into the. design of the ISDN3/quantum network.

• Journal of the Microelectronics and Packaging Society
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• 제20권4호
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• pp.53-58
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• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.

• Journal of the Institute of Electronics Engineers of Korea SD
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• 제48권7호
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• pp.76-81
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• 2011

A new via cutting structure in 2-layer DRAM package substrate has been fabricated to lower its power distribution network(PDN) impedance. In new structure, part of the via is cut off vertically and its remaining part is designed to connect directly with the bonding pad on the package substrate. These via structure and substrate design not only provide high routing density but also improve the PDN impedance by shortening effectively the path from bonding pad to VSSQ plane. An additional process is not necessary to fabricate the via cutting structure because its structure is completed at the same time during a process of window area formation. Also, burr occurrence is minimized by filling the via-hole inside with a solder resist. 3-dimensional electromagnetic field simulation and S-parameter measurement are carried out in order to validate the effects of via cutting structure and VDDQ/VSSQ placement on the PDN impedance. New DRAM package substrate has a superior PDN impedance with a wide frequency range. This result shows that via cutting structure and power/ground placement are effective in reducing the PDN impedance.