Comparisons of Interfacial Reaction Characteristics on Flip Chip Package with Cu Column BOL Enhanced Process (fcCuBE®) and Bond on Capture Pad (BOC) under Electrical Current Stressing |
Kim, Jae Myeong
(STATS ChipPAC Korea Ltd.)
Ahn, Billy (STATS ChipPAC Korea Ltd.) Ouyang, Eric (STATS ChipPAC Inc.) Park, Susan (STATS ChipPAC Korea Ltd.) Lee, Yong Taek (STATS ChipPAC Korea Ltd.) Kim, Gwang (STATS ChipPAC Korea Ltd.) |
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