• Journal of electromagnetic engineering and science
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• v.13 no.1
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• pp.54-61
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• 2013

An equivalent model has been developed to estimate the electromagnetic immunity for integrated circuits under a complex electromagnetic environment. The complete model is based on the characteristics of the equipment and physical configuration of the device under test (DUT) and describes the measurement setup as well as the target integrated circuits under test, the corresponding package, and a specially designed printed circuit board. The advantage of the proposed model is that it can be applied to a SPICE-like simulator and the immunity of the integrated circuits can be easily achieved without costly and time-consuming measurements. After simulation, measurements were performed to verify the accuracy of the equivalent model for immunity prediction. The improvement of measurement accuracy due to the added effect of a bi-directional coupler in the test setup is also addressed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.3
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• pp.129-134
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• 2018

Herein, we report the manufacture of high-performance, ambipolar organic field-effect transistors (OFETs) and complementary-like electronic circuitry based on a blended, polymeric, semiconducting film. Relatively high and well-balanced electron and hole mobilities were achieved by incorporating a small amount of ionic additives. The equivalent P-channel and N-channel properties of the ambipolar OFETs enabled the manufacture of complementary-like inverter circuits with a near-ideal switching point, high gain, and good noise margins, via a simple blanket spin-coating process with no additional patterning of each active P-type and N-type semiconductor layer.

• Journal of the Korean Electrochemical Society
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• v.2 no.3
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• pp.138-143
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• 1999

Recently, miniaturization of large scale integrated circuits (LSI) and printed circuit board (PCB) have become essential with the downsizing of electronic devices. Gold electroplating is applied of conductivity wiring or terminals for improvement of conductivity and corrosion resistance. However, electroplating is not applicable since the circuits are becoming finer and denser. Accordingly, electroless plating is recently highly attractive method because of the simplicity of the operation requiring no external source of current and no elaborate equipment. In this work, we tried to develop a plating technique on electroless Ni/Au plating. First, the electroless Ni plating was deposited on the PCB with agitation in the bath at $85^{\circ}C$. Then the Au layer was deposited on the Ni layer surface by same method at $90^{\circ}C$. The bonderability were tested in order to evaluate the stability of the electroless Ni/Au by gold wire or solder ball test.

• Prospectives of Industrial Chemistry
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• v.23 no.2
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• pp.1-11
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• 2020

In this report, we summarize recent progress in the development of electrolyte-gated transistors (EGTs) for various printed electronics. EGTs, employing a high capacitance electrolyte as gate dielectric layer in transistors, exhibits increasing of drive current, lowering operation voltage, and new transistor architectures. While the use of electrolytes in electronics goes back to the early days of silicon transistors, the new printable, fast-responsive polymer electrolytes are expanding their range of applications from printable and flexible digital circuits to various neuromorphic devices. This report introduces the structure and operating mechanism of EGT and reviews key developments in electrolyte materials used in printed electronics. Additionally, we will look at various applications with EGTs that are currently underway.

• Proceedings of the KIPE Conference
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• 2001.10a
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• pp.1-6
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• 2001

In this article, the fundamental concept, characteristics and application potentials of coreless printed-circuit-board (PCB) transformers are described. Coreless PCB transformers do not have the limitations associated with magnetic cores, such as the frequency limitation, magnetic saturation and core losses. In addition, they eliminate the manual winding process and its associated problems, including labor cost, reliability problems and difficulties in ensuring transformer quality in the manufacturing process. The parameters of the printed windings can be precisely controlled in modern PCB technology. Because of the drastic reduction in the vertical dimension, coreless PCB transformers can achieve high power density and are suitable for applications in which stringent height requirements for the circuits have to be met. A transformer's power density of $24W/cm^2$ has been reported in a power conversion application. When used in an isolation amplifier application, coreless PCB transformers tested so far enable the amplifier to achieve a remarkable linear frequency range of 1MHz, which is almost eight times higher than the frequency range of 120kHz in existing Integrated-Circuit products. PCB materials offer extremely high isolation voltage, typically from 15kV to 40kV, which is higher than many other isolation means such as optocouplers. It is envisaged that coreless PCB transformers can replace traditional core-based transformers in some industrial applications. Their application potentials deserve more attention and exploration.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1061-1066
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• 2014

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.23-27
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• 2000

Simultaneous Switching Noise (SSN) propagated through parallel power and ground planes in high-speed multilayer printed circuit boards (PCBs) causes malfunction of both digital and analog circuits. To reduce SSN, decoupling capacitors are generally used in the PCBs. In this paper, we improve the equivalent circuit model of decoupling capacitor in high-frequency range to analyze the effect of SSN reduction accurately. The analysis is performed by the microwave and RF design system (MDS) method and the finite difference time domain (FDTD) method. We compared the results by the ideal capacitor model with those by the proposed model.

• Journal of the Korean Institute of Telematics and Electronics
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• v.17 no.6
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• pp.78-85
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• 1980

A symmetrical 3-dB quadrature hybrid circuits, consisting mainly of bifilar pair of taitoted wires, is described. A cascade of two such hybrid circuits can achieve an octave bandwidth hybrid circuit with a small coupling loss. Since the proposed type is simple, compact, and low In cost 1 its applicarion may be preferred to the more common coaxial line or printed -circuit type hybrid version in the frequency region below 1 GHz. This study provides a design method for a hybrid circuit mixing two different antenna signals for the anti - ghosting of television signal.

• Journal of the Semiconductor & Display Technology
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• v.14 no.3
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• pp.57-60
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• 2015

Electric power in large devices is controlled by digital circuits, such as switching mode power supply. This kind of power circuits require accurate current sensor for power distribution. We studied characteristics of shunt resistor, which has many advantages for commercial application compared to Hall-effect current sensor. We applied ceramic package to the shunt resistor. Ceramic package has good thermal conductivity compared to plastic package, and this point is important for space requirement in Printed Circuit Board (PCB). Another advantage of the ceramic package is that surface mount technology (SMT) can be used for production. Our experimental results showed that the ceramic packaged resistor showed about 50% lower temperature than the plastic packaged one. Burning point and frequency characteristics are also discussed.

• Proceedings of the Korea Information Processing Society Conference
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• 2001.04b
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• pp.1209-1212
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• 2001

본 논문에서는 PCB(Printed Circuit Board)회로에서 고속 신호들을 전달하는 배선의 특성 및 배선의 요구사항에 의한 설계 규칙과 이론화된 공식은 이용하여 PCB상에 배치되는 부품들간의 배선경로를 추적하여 해당 배선의 특성을 분석하고, 흐르는 신호의 특성 및 해당 신호의 전기/전자적인 시뮬레이션을 수행할 수 있도록 하는 PCB회로의 신호통합 시뮬레이터에 대하여 언급하고 실험을 통하여 시뮬레이션의 타당성을 검증하였다.