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Improvement of Temperature Characteristics in Ceramic-packaged Shunt Resistors  

Kang, Doo-Won (Department of Electrical and Computer Engineering, Ajou University)
Jo, Jungyol (Department of Electrical and Computer Engineering, Ajou University)
Publication Information
Journal of the Semiconductor & Display Technology / v.14, no.3, 2015 , pp. 57-60 More about this Journal
Abstract
Electric power in large devices is controlled by digital circuits, such as switching mode power supply. This kind of power circuits require accurate current sensor for power distribution. We studied characteristics of shunt resistor, which has many advantages for commercial application compared to Hall-effect current sensor. We applied ceramic package to the shunt resistor. Ceramic package has good thermal conductivity compared to plastic package, and this point is important for space requirement in Printed Circuit Board (PCB). Another advantage of the ceramic package is that surface mount technology (SMT) can be used for production. Our experimental results showed that the ceramic packaged resistor showed about 50% lower temperature than the plastic packaged one. Burning point and frequency characteristics are also discussed.
Keywords
shunt resistor; ceramic package; plastic package; thermal conductivity; surface mount technology;
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