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http://dx.doi.org/10.7736/KSPE.2014.31.12.1061

Basic Research For The 3DCD (3D Circuit Devices)  

Yun, Hae Yong (Department of Mechanical system Engineering, Andong University)
Kim, Ho Chan (Department of Mechanical and Automotive Engineering, Andong University)
Publication Information
Journal of the Korean Society for Precision Engineering / v.31, no.12, 2014 , pp. 1061-1066 More about this Journal
Abstract
Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.
Keywords
3DCD; Conductive Polymer; Plating; Printing circuit; Laser etching;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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