• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.1
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• pp.140-145
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• 2005

The existing analytical expression for the voltage between the power and ground plane consist of metal-dielectric-metal board is expressed in the two dimensional infinite series. To reduce the computation time, the two dimensional infinite series is converted to the one dimensional infinite series using the summation formula of Fourier series. We applied these equations to the analysis of voltage between the $9‘{\times}4'$ size power-ground plane. The derived one dimensional infinite series shows the more rapid convergency and the more accurate result than the two dimensional infinite series. This equation can be applied to the power-ground plane analysis which needs a lot of the repeating computation.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.1
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• pp.41-44
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• 2005

A new method to reduce the computation time in power/ground-plane analysis is proposed. The existing method using the two dimensional infinite series summation take a lot of computation time. The proposed method is based on the approximation of impedance in the frequency domain through the Mobius transform. This method shows the good accuracy and the high speed in computing. In the case of impedance calculation for 9'x4' board, the proposed method takes 0.16 second of computing time whereas the existing method takes 2.2 second. This method can be applied to the analysis and design of power/ground-plane that need a lot of computation steps.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.44-47
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• 2005

This paper presents the efficient plan for the EMI improvement from of TFT-LCD Module. It investigates the frequency characteristics of Power/Ground Plane of TFT-LCD drive circuit PCB concretely. After the frequency characteristics is reviewed, EMI improvement is tried to insert to RC termination between Power/Ground Plane and to shift resonance frequency. It is confirmed by a simulation result and RC Termination which is inserted the point where the resonance characteristics change is necessary. It applied in 19 "SXGA TFT-LCD drive circuits and the EMI improvement verification is described.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.12
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• pp.1272-1278
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• 2009

The cancellation method of P/G(power/ground) plane resonances which are generated between the power plane and the ground plane in a 4-layer PCB(Printed Circuit Boards) with a via-hole for the improvement of the RE(Radiated Emission) characteristic is presented. The validity of the proposed method was confirmed from simulation and measurement of performances of signal transmission characteristic, intensities of edge-radiation and radiated emission of PCB with a via-hole.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.1
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• pp.436-440
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• 2014

To verity the effect of PCB plane layer to the output characteristics of the Switched Mode Power Supply (SMPS), this paper compared with a generic one-layer PCB and a double-side PCB. This paper specially focused on the voltage, the current and the high frequency noise of the output characteristic of the SMPS, using a double-side PCB which has same layout and was installed a ground plane on the opposite side. This double-side PCB was assembled by all same components which used on the SMPS using the single-side PCB. The experiment results show the SMPS using the ground plan PCB can efficiently reduce the high frequency noise to 50mV at 100MHz from 150mV in the single-side PCB. And the results also show the high harmonics frequency was reduced as well.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.385-388
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• 1999

A new frequency-variant equivalent circuit model of power/ground plane is presented. The equivalent circuit is modeled with grid cells. The circuit parameters of each cell were extracted by using Fasthenry. To verify the developed circuit model, its s-parameters are compared with the measured s-parameters 〔2〕 and the full-wave simulation-based s-parameters. Consequently, it is shown that our frequency-variant equivalent circuit model can accurately predict imperfect ground effects under the high frequency operation of electronic package.

• Journal of electromagnetic engineering and science
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• v.15 no.2
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• pp.120-122
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• 2015

This study presents a new, simple method for improving the front-to-back (F/B) ratio of a microstrip patch antenna (MSA) based on surface wave suppression. The back radiation of the MSA is significantly reduced by using the meandered ground plane edges and placing split-ring resonators (SRRs) in the middle of the meandered slots. By loading SRRs near the center of the meandered ground plane edges, some parts of the diffracted back-lobe power density can be reduced further. Compared to the F/B ratio of a conventional MSA with a full ground plane of the same size, an improved F/B ratio of 18 dB has been achieved experimentally for our proposed MSA.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.6
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• pp.43-50
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• 2010

In this paper, we analyzed radiated emission generated by the split power/ground plane structures in order to reduce EMI in system modules. The magnetic fields and electric fields were simulated and measured on the test boards under various conditions. In order to reduce radiated emission, we have to determine spacing and location of the split ground gap so that input signal frequency does not coincide with the resonance frequency of the split power/ground plane structure and the phase of reflection coefficient is close to $0^{\circ}$ at input signal frequency. Moreover, we found that inserting a stitching capacitor could reduce the radiated emission. Low magnitude of reflection coefficient and the phase close to $0^{\circ}$ are required to reduce radiated emission. It is necessary to properly decide value and location of a stitching capacitor to fulfil those requirements.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.324-327
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• 2002

For the characterization of arbitrary shaped printed circuit board, lossy transmission line grid model based on SPICE netlist and analytical plane model based on the segmentation method are proposed in this paper. Two methods are compared with an arbitrary shaped power/ground plane. Furthermore, design considerations for the complete power distribution network structure are discussed to ensure the maximum value of the PDN impedance is low enough across the desired frequency range and to guide decoupling capacitor selection.

• Journal of electromagnetic engineering and science
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• v.11 no.3
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• pp.192-200
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• 2011

This paper proposes a new modeling method for estimating the impedance of an on-chip power/ground meshed plane. Frequency dependent R, L, and C parameters are extracted based on the proposed method so that the model can be applied from DC to high frequencies. The meshed plane model is composed of two parts: coplanar multi strip (CMS) and conductor-backed CMS. The conformal mapping technique and the scaled conductivity concept are used for accurate modeling of the CMS. The developed microstrip approach is applied to model the conductor-backed CMS. The proposed modeling method has been successfully verified by comparing the impedance of RLC circuit based on extracted parameters and the simulated impedance using a 3D-field solver.