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http://dx.doi.org/10.5515/KJKIEES.2009.20.12.1272

Improved Characteristic of Radiated Emission of a PCB by Using the Via-Hole Position  

Kim, Li-Jin (Department of Radio Science & Engineering, Chungnam National University)
Lee, Jae-Hyun (Department of Radio Science & Engineering, Chungnam National University)
Publication Information
The Journal of Korean Institute of Electromagnetic Engineering and Science / v.20, no.12, 2009 , pp. 1272-1278 More about this Journal
Abstract
The cancellation method of P/G(power/ground) plane resonances which are generated between the power plane and the ground plane in a 4-layer PCB(Printed Circuit Boards) with a via-hole for the improvement of the RE(Radiated Emission) characteristic is presented. The validity of the proposed method was confirmed from simulation and measurement of performances of signal transmission characteristic, intensities of edge-radiation and radiated emission of PCB with a via-hole.
Keywords
Through-Hole Via; Power/Ground Plane Resonance; Via-Hole Position; Radiated Emission; Edge Radiation;
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  • Reference
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