Browse > Article

Analysis of Split Power/Ground Plane Structures for Radiated EMI Reduction  

Lee, Jang-Hoon (Dept. of Electronic Eng., Soongsil University)
Lee, Pil-Soo (Hynix Semiconductor)
Lee, Tae-Heon (Dept. of Electronic Eng., Soongsil University)
Kim, Chang-Gyun (Dept. of Electronic Eng., Soongsil University)
Song, In-Chae (School of Electronic Eng, Soongsil University)
Wee, Jae-Kyung (School of Electronic Eng, Soongsil University)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.47, no.6, 2010 , pp. 43-50 More about this Journal
Abstract
In this paper, we analyzed radiated emission generated by the split power/ground plane structures in order to reduce EMI in system modules. The magnetic fields and electric fields were simulated and measured on the test boards under various conditions. In order to reduce radiated emission, we have to determine spacing and location of the split ground gap so that input signal frequency does not coincide with the resonance frequency of the split power/ground plane structure and the phase of reflection coefficient is close to $0^{\circ}$ at input signal frequency. Moreover, we found that inserting a stitching capacitor could reduce the radiated emission. Low magnitude of reflection coefficient and the phase close to $0^{\circ}$ are required to reduce radiated emission. It is necessary to properly decide value and location of a stitching capacitor to fulfil those requirements.
Keywords
split power/ground plane structure; split ground gap; stitching capacitor; radiated emission; reflection coefficient;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Jingook Kim; Heeseok Lee; Joungho Kim; , "Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards," Advanced Packaging, IEEE Transactions on , vol.28, no.4, pp. 724-735, Nov. 2005.   DOI
2 Funato, H.; Suga, T., "Magnetic near-field probe for GHz band and spatial resolution improvement technique," Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on, vol., no., pp.284-287, Feb. 27 2006-March 3 2006.
3 Haw-Jyh Liaw: Merkelo, H; , "Signal integrity issues at split ground and power planes," Electronic Components and Technology Conference, 1996. Proceedings., 46th , vol., no., pp.752-755, 28-31 May 1996.
4 Ko, Y.; Ito, K.; Kudo, J.; Sudo, T.; , "Electromagnetic radiation properties of a printed circuit board with a slot in the ground plane," Electromagnetic Compatibility, 1999 International Symposium on , vol., no., pp.576-579, 1999.
5 Jingook Kim; Hyungsoo Kim; Youchul Jeong; Joungho Kim; , "Tapered slot shape on slotted reference plane of multi-layer PCB for reduction of crosstalk and radiated emission," Electrical Performance of Electronic Packaging, 2002 , vol., no., pp. 275-278, 2002.
6 Moran, T.E.; Virga, K.L.; Aguirre, G.; Prince, J.L.; , "Methods to reduce radiation from split ground plane structures [packaging]," Electrical Performance of Electronic Packaging, 1999 , vol., no., pp.203-206, 1999.
7 Dah-Weih Duan: Rubin, B.J.; Magerlein, J.H.; , "Distributed effects of a gap in power/ground planes," Electrical Performance of Electronic Packaging, 1999 , vol., no., pp.207-210, 1999.