• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.7 s.337
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• pp.21-26
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• 2005

An area efficient, low power switch-matrix semidigital FIR reconstruction filter for delta-sigma D/A converter is proposed. Filter coefficients are quantified to 7-bit and 7 current sources that correspond to each coefficient bit are used. The proposed semidigital FIR reconstruction filter is designed in a 0.25 um CMOS process and incorporates 1.5 mm$^{2}$ of active area and a power consumption is 3.8 mW at 2.5 V supply. The number of switching transistors is 1419 at 205 filter order. Simulation results show that the filter output has a dynamic range of 104 dB and 84 dB attenuation of out-of-band quantization noise.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.05a
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• pp.687-691
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• 2011

In this paper, we design an 8-bit eSuse OTP (one-time programmable) memory in consideration of EM (electro-migration) and eFuse resistance variation based on a $0.18{\mu}m$ generic process, which is used for an analog trimming application. First, we use an external program voltage to increase the program power applied an eFuse. Secondly, we apply a scheme of precharging BL to VSS prior to RWL (read word line) activation and optimize read NMOS transistors to reduce the read current flowing through a non-programmed cell. Thirdly, we design a sensing margin test circuit with a variable pull-up load out of consideration for the eFuse resistance variation of a programmed eFuse. Finally, we increase program yield of eFuse OTP memory by splitting the length of an eFuse link.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.647-650
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• 2006

Low temperature polycrystalline silicon (LTPS) technology using a high power laser have been widely applied to thin film transistors (TFTs) for liquid crystal, organic light emitting diode (OLED) display, driver circuit for system on glass (SOG) and static random access memory (SRAM). Recently, the semiconductor industry is continuing its quest to create even more powerful CPU and memory chips. This requires increasing of individual device speed through the continual reduction of the minimum size of device features and increasing of device density on the chip. Moreover, the flat panel display industry also need to be brighter, with richer more vivid color, wider viewing angle, have faster video capability and be more durable at lower cost. Kornic Systems Co., Ltd. developed the $KORONA^{TM}$ LTP/GLTP series - an innovative production tool for fabricating flat panel displays and semiconductor devices - to meet these growing market demands and advance the volume production capabilities of flat panel displays and semiconductor industry. The $KORONA^{TM}\;LTP/GLTP$ series using DPSS laser and XeCl excimer laser is designed for the new generation of the wafer & FPD glass annealing processing equipment combining advanced low temperature poly-silicon (LTPS) crystallization technology and object-oriented software architecture with a semistandard graphical user interface (GUI). These leading edge systems show the superior annealing ability to the conventional other method. The $KORONA^{TM}\;LTP/GLTP$ series provides technical and economical benefits of advanced annealing solution to semiconductor and FPD production performance with an exceptional level of productivity. High throughput, low cost of ownership and optimized system efficiency brings the highest yield and lowest cost per wafer/glass on the annealing market.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.1
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• pp.70-79
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• 2016

This paper proposes a low-power range-scaled 14b 30 MS/s pipeline-SAR composite ADC for high-performance CIS applications. The SAR ADC is employed in the first stage to alleviate a sampling-time mismatch as observed in the conventional SHA-free architecture. A range-scaling technique processes a wide input range of 3.0VP-P without thick-gate-oxide transistors under a 1.8 V supply voltage. The first- and second-stage MDACs share a single amplifier to reduce power consumption and chip area. Moreover, two separate reference voltage drivers for the first-stage SAR ADC and the remaining pipeline stages reduce a reference voltage disturbance caused by the high-speed switching noise from the SAR ADC. The measured DNL and INL of the prototype ADC in a $0.18{\mu}m$ CMOS are within 0.88 LSB and 3.28 LSB, respectively. The ADC shows a maximum SNDR of 65.4 dB and SFDR of 78.9 dB at 30 MS/s, respectively. The ADC with an active die area of $1.43mm^2$ consumes 20.5 mW at a 1.8 V supply voltage and 30 MS/s, which corresponds to a figure-of-merit (FOM) of 0.45 pJ/conversion-step.

• Journal of the Korean Society for Railway
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• v.13 no.5
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• pp.504-508
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• 2010

The development of high voltage Insulated Gate Bipolar Transistor (IGBT) have given new device advantage in the areas where they compete with conventional GTO (Gate Turnoff Thyristor) technology. The IGBT combines the advantages of a power MOSFET (Metal-Oxide Semiconductor Field-Effect Transistor) and a bipolar power transistor. The change of electrical characteristics for IGBT is mainly coming from the change of characteristics of MOSFET at the input gate and the PNP transistors at the output. The change of threshold voltage, which is one of the important design parameters, is brought by charge trapping at the gate oxide under the environment that radiation exists. The energy loss will be also studied as the inductance values are changed. In this paper, the electrical characteristics are simulated by SPICE, and compared for variation of inductance and threshold voltage based on IGBT.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.2
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• pp.61-67
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• 2006

We fabricate local damascene FinFET cell array in sub-60nm feature sized DRAM. The local damascene structure can remove passing-gate-effects in FinFET cell array. p+ boron in-situ doped polysilicon is chosen for the gate material, and we obtain a uniform distribution of threshold voltages at around 0.7V. Sub-threshold swing of 75mV/d and extrapolated off-state leakage current of 0.03fA are obtained, which are much suppressed values against those of recessed channel array transistors. We also obtain a few times higher on-state current. Based on the improved on- and off-state current characteristics, we expect that the FinFET cell array could be a new mainstream structure in sub-60nm DRAM devices, satisfying high density, low power, and high-speed device requirements.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.7
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• pp.61-67
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• 2009

This paper reports an Integer-N phase locked loop (PLL) frequency synthesizer which was implemented in a 250nm standard digital CMOS process for a UHF RFID wireless communication system. The main blocks of PLL have been designed including voltage controlled oscillator, phase frequency detector, and charge pump. The LC VCO has been used for a better noise property and low-power design. The source and drain juntions of PMOS transistors are used as the varactor diodes. The ADF4111 of Analog Device has been used for the external pre-scaler and N-divider to divide VCO frequency and a third order RC filter is designed for the loop filter. The measured results show that the RF output power is -13dBm with 50$\Omega$ load, the phase noise is -91.33dBc/Hz at 100KHz offset frequency, and the maximum lock-in time is less than 600us from 930MHz to 970MHz.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.3
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• pp.1700-1706
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• 2014

In this paper, a step down converter for LED backlight of mobile application has been proposed. The converter which is operated with 4 MHz high switching frequency is capable of reducing mounting area of passive devices consists of a power stage and a control block. Circuit elements of the power stage are inductor, output capacitor, MOS transistors and feedback resistors. The control block consists of pulse width modulator, error amplifier and oscillator etc. Proposed step down converter has been designed and verified using a $0.35{\mu}m$ 1-poly 4-metal BCD process technology. Simulation results show that the output voltage is 1.8 V in 3.7 V input voltage, output current 100 mA which is larger than 25 ~ 50 mA in conventional 500 KHz driven converter when the duty ratio is 0.4.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.33 no.11C
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• pp.963-969
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• 2008

This paper presents 6bit 100MHz Interpolation Flash Analog-to-Digital Converter, which can be applied to the Receiver of Wireless Tele-communication System. The 6bit 100MHz Flash Analog-to-Digital Converter simplifies and integrates S-R latch which multiplies as the resolution increases. Whereas the conventional NAND based S-R latch needed eight MOS transistors, this Converter was designed with only six, which makes the Dynamic Power Dissipation of the A/D Converter reduced up to 12.5%. The designed A/D Converter went through $0.18{\mu}m$ CMOS n-well 1-poly 6-metal process to be a final product, and the final product has shown 282mW of power dissipation with 1.8V of Supply Voltage, 100MHz of conversion rate. And 35.027dBc, 31.253dB SFDR and 4.8bits, 4.2bits ENOB with 12.5MHz, 50MHz of each input frequency.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.9
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• pp.11-20
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• 1998

High-speed complex-number arithmetic units are essential to baseband signal processing of modern digital communication systems such as channel equalization, timing recovery, modulation and demodulation. In this paper, a new complex-number multiplication algorithm is proposed, which is based on redundant binary (RB) arithmetic combined with radix-4 Booth recoding scheme. The proposed algorithm reduces the number of partial product by one-half as compared with the conventional direct method using real-number multipliers and adders. It also leads to a highly parallel architecture and simplified circuit, resulting in high-speed operation and low power dissipation. To demonstrate the proposed algorithm, a prototype complex-number multiplier-accumulator (CMAC) core with 10-bit operands has been designed using 0.8-$\mu\textrm{m}$ N-Well CMOS technology. The designed CMAC core contains about 18,000 transistors on the area of about 1.60 ${\times}$ 1.93 $\textrm{mm}^2$. The functional and speed test results show that it can operate with 120-MHz clock at V$\sub$DD/=3.3-V, and its power consumption is given to about 63-mW.