• Journal of Electrical Engineering and Technology
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• v.7 no.3
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• pp.406-410
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• 2012

This paper looks into the field inside the wide rectangular box structure that is excited by the High Power Electromagnetic(HPEM) source as a potential threat to electric grid and communication networks causing malfunction or destruction. The rectangular box is assumed power/ground planes and its internal field is calculated by the cavity model with the lightning strike excitation as an HPEM pulse. The accuracy of the calculation method employed here is validated through a $156mm{\times}106mm{\times}508{\mu}m$ parallel metallic plate case which is manufactured and tested, and is applied to the size of a building. With the help of the cavity model that takes into account loading, the level of the electric field is shown to decrease when a metal pillar is loaded between the power and ground planes.

• Journal of electromagnetic engineering and science
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• v.7 no.1
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• pp.7-11
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• 2007

PCB Power-Bus (comprising power/ground planes) impedance and fields are evaluated by an efficient series expansion method that is suggested in this paper. It is used to investigate the structure's radiated emission(RE) levels and find acceptable ways of loading the power/ground planes such as decoupling capcitor(DeCap)s, balanced feeding and slits, in order to reduce the interferences. Also, the calculations and measurements of a proposed geometry are verified by vector fitting as a analysis model to check the behavior of the slit.

• Journal of Biosystems Engineering
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• v.17 no.1
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• pp.27-36
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• 1992

Computer simulation was carried out to predict the motion and overturns of power tiller-trailer system this system when traveing over an obstacle on inclined planes. To estimate the effects of design factors (mass center of main body and wheel base), ground factors (ground inclination and height of obstacle), and operation factors (traveling velocity) on the sideways overturn, the motion of power tiller-trailer system was simulated as the factors were varied with five different levels.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.7
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• pp.1048-1056
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• 2001

Decoupling capacitors are commonly used to reduce the effect of SSN propagated through parallel power and ground planes in high-speed multilayer printed circuit boards (PCBs). In this paper, we introduced a simple high frequency measurement and proposed a wideband (50 MHz ∼3 GHz) equivalent circuit model for decoupling capacitor considering high frequency parasitic effects. The proposed model can be easily combined with the SPICE model of power supply planes far SSN analysis. The circuit simulations with the proposed model show good agreement with the measurement results. Also, we expect to accurately analyze the noise reduction effect as a function of value and location using the proposed model of decoupling capacitor.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.35-50
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• 2013

This paper discusses effects of mesh planes on signal integrity in high-speed glass ceramic packages. One of serious signal integrity issues in high-speed glass ceramic packages is high far-end (FE) noise coupling between signal interconnects. Based on signal integrity analysis, a methodology is presented for reducing far-end noise coupling between signal interconnects in high-speed glass ceramic modules. This methodology employing power/ground mesh planes with alternating spacing and a via-connected coplanar-type shield (VCS) structure is suggested to minimize far-end noise coupling between signal lines in high-speed glass ceramic packages. Optimized interconnect structure based on this methodology has demonstrated that the saturated far-end noise coupling of a typical interconnect structure in glass ceramic modules could be reduced significantly by 73.3 %.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.10 no.7
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• pp.1065-1073
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• 1999

This paper analyzed the ground bounce caused by the power plane resonance in the multilayered printed circuit board(PCB) using the Haar-wavelet-based Multiresolution Time-Domain (MRTD). In conventional Finite-Difference Time-Domain(FDTD), the highly fine vertical cell is needed to represent the distance between $V_{cc}$ plane and ground plane since the two planes are very close. Therefore the time step $\Deltat$ must be very small to satisfy the stability condition. As a result, a large number of iterations are needed to obtain the response in wanted time. For this problem, this paper showed that the computation time can be reduced by application of the MRTD method. The results obtained by the MRTD agree very well with those by FDTD method and analytic solutions. In conclusion, this paper proved the efficiency and accuracy of MRTD method for analyzing the EMI/EMC problems in PCB.

• Journal of electromagnetic engineering and science
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• v.2 no.2
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• pp.68-74
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• 2002

In this paper, a pre-layout design approach for high-speed microprocessor is proposed. For multilayer PCB stark up configuration as well as selection and placement of decoupling capacitors, an effective solution for reducing SSN and EMI is obtained by modeling and simulation of complete power distribution system. The system model includes VRM, decoupling capacitors, multiple power and ground planes for core voltage, vias, as well as microprocessor. Finally, the simulation results are verified by measurements data.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1436-1437
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• 2008

In this work, we investigate the electrical and electromagnetic behaviors of the power-bus with a variety of shapes of aperture, on the signal integrity, using a rigorous methods(Modal or MoM) along with Modal analysis method.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.2 s.117
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• pp.206-212
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• 2007

In this paper, a novel power/ground plane using the hybrid-cell electromagnetic band-gap(EBG) structure is proposed for the wide-band suppression of the ground bound noise(GBN) or simultaneous switching noise(SSN). The -30 dB stopband of the proposed structure starts from a few hundred MHz where the GBN/SSN energy is dominant. The distinctive features of this new structure are the thin spiral strip line and hybrid-cells. They realize the enhanced inductance and the shorter period of the EBG lattice. As a result, the lower cut-off frequency and bandwidth of the -30 dB stopband becomes lower and wider, respectively. In addition, the proposed structure has smaller number of resonance modes between power/ground planes and performs a low EMI behavior compared with the reference board.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1049-1052
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• 1998

A new simplified circuit model for the switching noise analysis of the complicated multi-layer IC package is developed. The current flowing mechanism on the ground and power planes of the package is simplified by using the dependent current soures and partial plane circuit model. The methodology is very cost-efficient as well as accurate. It is demonstrated that the nosie based on the simplified circuit model has an excellent agreement with that of the complicated full circuit model. However, the simplified model takes only 5 minutes for the switching noise simulation, while the full circuit model takes more than 4 hours.