• Title/Summary/Keyword: Power/Ground Plane Resonance

Search Result 9, Processing Time 0.024 seconds

Power/Ground Plane Modeling and Experimental Characterization for EMI Improvement in TFT-LCD Driving Circuit (TFT-LCD 구동회로에서의 EMI 개선을 위한 Power/Ground Plane 모델링 및 실험적 검증)

  • Cho, Kang-Yeon;Nah, Wan-Soo;Lee, Hae-Hoon;Lee, Sung-Kyu
    • Proceedings of the KIEE Conference
    • /
    • 2005.11a
    • /
    • pp.44-47
    • /
    • 2005
  • This paper presents the efficient plan for the EMI improvement from of TFT-LCD Module. It investigates the frequency characteristics of Power/Ground Plane of TFT-LCD drive circuit PCB concretely. After the frequency characteristics is reviewed, EMI improvement is tried to insert to RC termination between Power/Ground Plane and to shift resonance frequency. It is confirmed by a simulation result and RC Termination which is inserted the point where the resonance characteristics change is necessary. It applied in 19 "SXGA TFT-LCD drive circuits and the EMI improvement verification is described.

  • PDF

Improved Characteristic of Radiated Emission of a PCB by Using the Via-Hole Position (단일 비아 위치를 이용한 PCB의 복사성 방사 성능 향상)

  • Kim, Li-Jin;Lee, Jae-Hyun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.20 no.12
    • /
    • pp.1272-1278
    • /
    • 2009
  • The cancellation method of P/G(power/ground) plane resonances which are generated between the power plane and the ground plane in a 4-layer PCB(Printed Circuit Boards) with a via-hole for the improvement of the RE(Radiated Emission) characteristic is presented. The validity of the proposed method was confirmed from simulation and measurement of performances of signal transmission characteristic, intensities of edge-radiation and radiated emission of PCB with a via-hole.

Integrated Circuit(IC) Package Analysis, Modeling, and Design for Resonance Reduction (공진현상 감소를 위한 집적회로 패키지 설계 및 모델링)

  • 안덕근;어영선;심종인
    • Proceedings of the IEEK Conference
    • /
    • 2001.06b
    • /
    • pp.133-136
    • /
    • 2001
  • A new package design method to reduce resonance effect due to an IC package is represented. Frequency-variant circuit model of the power/ground plane was developed to accurately reflect the resonance. The circuit model is benchmarked with a full wave simulation, thereby verifying its accuracy. Then it was shown that the proposed technique can efficiently reduce the resonance due to the IC package.

  • PDF

Analysis of Split Power/Ground Plane Structures for Radiated EMI Reduction (EMI 저감을 위해 분할된 전원/접지 평판 구조에서의 방사성 방출 분석)

  • Lee, Jang-Hoon;Lee, Pil-Soo;Lee, Tae-Heon;Kim, Chang-Gyun;Song, In-Chae;Wee, Jae-Kyung
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.47 no.6
    • /
    • pp.43-50
    • /
    • 2010
  • In this paper, we analyzed radiated emission generated by the split power/ground plane structures in order to reduce EMI in system modules. The magnetic fields and electric fields were simulated and measured on the test boards under various conditions. In order to reduce radiated emission, we have to determine spacing and location of the split ground gap so that input signal frequency does not coincide with the resonance frequency of the split power/ground plane structure and the phase of reflection coefficient is close to $0^{\circ}$ at input signal frequency. Moreover, we found that inserting a stitching capacitor could reduce the radiated emission. Low magnitude of reflection coefficient and the phase close to $0^{\circ}$ are required to reduce radiated emission. It is necessary to properly decide value and location of a stitching capacitor to fulfil those requirements.

Multilayer Power Delivery Network Design for Reduction of EMI and SSN in High-Speed Microprocessor System

  • Park, Seong-Geun;Kim, Ji-Seong;Yook, Jong-Gwan;Park, Han-Kyu
    • Journal of electromagnetic engineering and science
    • /
    • v.2 no.2
    • /
    • pp.68-74
    • /
    • 2002
  • In this paper, a pre-layout design approach for high-speed microprocessor is proposed. For multilayer PCB stark up configuration as well as selection and placement of decoupling capacitors, an effective solution for reducing SSN and EMI is obtained by modeling and simulation of complete power distribution system. The system model includes VRM, decoupling capacitors, multiple power and ground planes for core voltage, vias, as well as microprocessor. Finally, the simulation results are verified by measurements data.

Analysis of the Ground Bounce in Power Planes of PCB Using the Haar-Wavelet MRTD (Haar 웨이블릿 기반 MRTD를 이용한 PCB 전원 공급면에서의 Ground Bounce 해석)

  • 천정남;이종환;김형동
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.10 no.7
    • /
    • pp.1065-1073
    • /
    • 1999
  • This paper analyzed the ground bounce caused by the power plane resonance in the multilayered printed circuit board(PCB) using the Haar-wavelet-based Multiresolution Time-Domain (MRTD). In conventional Finite-Difference Time-Domain(FDTD), the highly fine vertical cell is needed to represent the distance between $V_{cc}$ plane and ground plane since the two planes are very close. Therefore the time step $\Deltat$ must be very small to satisfy the stability condition. As a result, a large number of iterations are needed to obtain the response in wanted time. For this problem, this paper showed that the computation time can be reduced by application of the MRTD method. The results obtained by the MRTD agree very well with those by FDTD method and analytic solutions. In conclusion, this paper proved the efficiency and accuracy of MRTD method for analyzing the EMI/EMC problems in PCB.

  • PDF

A Power Plane Using the Hybrid-Cell EBG Structure for the Suppression of GBN/SSN (GBN/SSN 억제를 위한 이종 셀 EBG 구조를 갖는 전원면)

  • Kim, Dong-Yeop;Joo, Sung-Ho;Lee, Hai-Young
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.18 no.2 s.117
    • /
    • pp.206-212
    • /
    • 2007
  • In this paper, a novel power/ground plane using the hybrid-cell electromagnetic band-gap(EBG) structure is proposed for the wide-band suppression of the ground bound noise(GBN) or simultaneous switching noise(SSN). The -30 dB stopband of the proposed structure starts from a few hundred MHz where the GBN/SSN energy is dominant. The distinctive features of this new structure are the thin spiral strip line and hybrid-cells. They realize the enhanced inductance and the shorter period of the EBG lattice. As a result, the lower cut-off frequency and bandwidth of the -30 dB stopband becomes lower and wider, respectively. In addition, the proposed structure has smaller number of resonance modes between power/ground planes and performs a low EMI behavior compared with the reference board.

Effect of the Pin Radius on the Radiation Characteristics of a Patch Antenna with an Array of Pins Interconnecting the Patch and the Ground (패치와 접지면 사이에 삽입된 핀 배열을 가지는 안테나의 방사특성에 핀 반경이 미치는 효과)

  • Lee, Woo-Ram;Kim, Tae-Young;Kim, Boo-Gyoun;Shin, Jong-Dug
    • Journal of the Institute of Electronics Engineers of Korea TC
    • /
    • v.45 no.10
    • /
    • pp.80-89
    • /
    • 2008
  • Patch antennas with an array of pins interconnecting the patch and the ground (Pin array patch antennas) are fabricated and their characteristics are measured. The radiation characteristics of pin array patch antennas are compared to those of conventional patch antennas. The suppressions of the radiation in horizontal directions in E-plane and H-plane are more than 10 dB and 4 dB, respectively. The forward radiation is increased, while the backward radiation is decreased. The directivity is improved because the half-power beamwidth of radiation patterns in both E-plane and H-plane is reduced. The resonance frequency of a pin array patch antenna increases as the pin radius of a pin amy patch antenna increases. An optimum pin radius of a pin array patch antenna exists for the maximum suppression of the radiation in horizontal directions.

Magnetic Resonant Wireless Power Transfer with L-Shape Arranged Resonators for Laptop Computer

  • Choi, Jung Han;Kang, Seok Hyon;Jung, Chang Won
    • Journal of electromagnetic engineering and science
    • /
    • v.17 no.3
    • /
    • pp.126-132
    • /
    • 2017
  • In this study, we designed, measured, and analyzed a rearranged L-shape magnetic resonance coupling wireless power transfer (MR-WPT) system for practical applications with laptops. The typical four resonator MR-WPT (Tx part: source loop and Tx coil; Rx part: Rx coil and load loop) is difficult to apply to small-sized stationary and mobile applications, such as laptop computers, tablet-PCs, and smartphones, owing to the large volume of the Rx part and the spatial restrictions of the Tx and Rx coils. Therefore, an L-shape structure, which is the orthogonal arrangement of the Tx and Rx parts, is proposed for indoor environment applications, such as at an L-shaped wall or desk. The relatively large Tx part and Rx coil can be installed in the wall and the desk, respectively, while the load loop is embedded in the small stationary or mobile devices. The transfer efficiency (TE) of the proposed system was measured according to the transfer distance (TD) and the misaligned locations of the load loop. In addition, we measured the TE in the active/non-active state and monitor-open/closed state of the laptop computer. The overall highest TE of the L-shape MR-WPT was 61.43% at 45 cm TD, and the TE decreased to 27.9% in the active and monitor-open state of the laptop computer. The conductive ground plane has a much higher impact on the performance when compared to the impact of the active/non-active states. We verified the characteristics and practical benefits of the proposed L-shape MR-WPT compared to the typical MR-WPT for applications to L-shaped corners.