• Tribology and Lubricants
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• v.34 no.3
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.58-63
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• 2010

A new contact force estimation technique is proposed. Keeping the contact force at a certain level between finishing tool and the object is essential since the quality of the finished surface is very sensitive to the contact force during the finishing process. However, the contact force measurement cannot be obtained by simply installing load cells under machine table or in the middle of tool linkage. The reason is that the weight of the machine table and the tool linkage are much heavier than the force to be measured. To that end, a method for estimating disturbance is proposed for a system that is similar to the mechanism of the finishing machine, and the same method is applied to estimate the contact force of the brush-type finishing machine. To verify the effectiveness of the proposed method, a small scale test set-up has been built and the method has been tested.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.5
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• pp.23-29
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• 2008

Magnetic abrasive polishing is one of the nontraditional machining technologies newly developed. But it was very difficult to cut non-magnetic materials using MAP process because the process was fundamentally possible by help of a magnetic farce. In this study, we aimed to verify analytically formation of the magnetic field in a case of the nonmagnetic materials especially focused on an aluminum alloy. And also an improving strategy of the magnetic force for the non-magnetic materials was proposed and experimentally verified. Design of experimental method was adopt for assessment of parameters' effect on the MAP results of the aluminum alloy.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.295-296
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• 2008

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.10
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• pp.1049-1055
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• 2004

Chemical Mechanical Polishing (CMP) is referred to as a three body tribological system, because it includes two solids in relative motion and the CMP slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason not only for the friction force but also for material removal during polishing, the friction force generated during CMP process was investigated with the change of abrasive size and concentration of CMP slurry. The threshold point of average coefficient of friction (COF) with increase in abrasives concentration during interlayer dielectric (ILD) CMP was found experimentally and verified mathematically based on contact mechanics. The predictable models, Mode I (wafer is in contact with abrasives and pad) and Mode II (wafer is in contact with abrasives only), were proposed and used to explain the threshold point. The average COF value increased in the low abrasives concentration region which might be explained by Mode I. In contrast the average COF value decreased at high abrasives concentration which might be regarded to as Mode II. The threshold point observed seemed to be due to the transition from Mode I to Mode II. The tendency of threshold point with the variation of abrasive size was studied. The increase of particle radius could cause contact status to reach transition area faster. The correlation between COF and material removal rate was also investigated from the tribological and energetic point of view. Due to the energy loss by vibration of polishing equipment, COF value is not proportional to the material removal rate in this experiment.

• Tribology and Lubricants
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• v.33 no.5
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• pp.228-233
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• 2017

Chemical Mechanical Polishing of chemically stable sapphire substrates is dominantly affected by the mechanical processing of abrasives, in terms of the material removal rate. In this study, we investigated the effect of electrostatic force between the abrasives and substrate, on the polishing. If potassium chloride (KCl) is added to slurry, water molecules are decomposed into $H^+$ and $OH^-$ ions, and the amount of ions in the slurry changes. The zeta potential of the abrasives decreases with an increase in the amount of $H^+$ ions in the stern layer; consequently, the electrostatic force between the abrasives and substrate decreases. The change in zeta potential of abrasives in the slurry is affected by the slurry pH. In acidic zones, the amount of ions bound to the abrasives increases if the amount of $H^+$ ions is increased by adding KCl. However, in basic zones, there is no change in the corresponding amount. In acidic zones, zeta potential decreases as molar concentration of potassium increases; however, it does not change significantly in basic zones. The removal rate tends to decrease with increase in molar amount of potassium in acidic zones, where zeta potential changes significantly. However, in basic zones, the removal rate does not change with zeta potential. The tendencies of zeta potential and that of the frictional force generated during polishing show strong correlation. Through experiments, it is confirmed that the contact probability of abrasives changes according to the electrostatic force generated between the abrasives and substrate, and variation in removal rate.

• Transactions on Electrical and Electronic Materials
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• v.8 no.2
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• pp.53-57
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• 2007

In this study, a novel slurry containing ceria as the abrasive particles was analyzed in terms of its frictional, thermal and kinetic attributes for interlayer dielectric (ILD) CMP application. The novel slurry was used to polish 200-mm blanket ILD wafers on an $IC1000_{TM}$ K-groove pad with in-situ conditioning. Polishing pressures ranged from 1 to 5 PSI and the sliding velocity ranged from 0.5 to 1.5 m/s. Shear force and pad temperature were measured in real time during the polishing process. The frictional analysis indicated that boundary lubrication was the dominant tribological mechanism. The measured average pad leading edge temperature increased from 26.4 to $38.4\;^{\circ}C$ with the increase in polishing power. The ILD removal rate also increased with the polishing power, ranging from 400 to 4000 A/min. The ILD removal rate deviated from Prestonian behavior at the highest $p{\times}V$ polishing condition and exhibited a strong correlation with the measured average pad leading edge temperature. A modified two-step Langmuir-Hinshelwood kinetic model was used to simulate the ILD removal rate. In this model, transient flash heating temperature is assumed to dominate the chemical reaction temperature. The model successfully captured the variable removal rate behavior at the highest $p{\times}V$ polishing condition and indicates that the polishing process was mechanical limited in the low $p{\times}V$ polishing region and became chemically and mechanically balanced with increasing polishing power.

• Design & Manufacturing
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• v.6 no.2
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• pp.48-53
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• 2012

In previous study, it showed that the MAP was greatly effective polishing process for magnesium plate. But it had lower efficiency than magnetic materials such as SM45C. It was very difficult to cut non-magnetic materials using the MAP process because the process was fundamentally possible by help of a magnetic force. This study aimed to verify analytically formation of the magnetic field in a case of the non-magnetic materials especially focused on magnesium plate. So, In this study, the magnetic density flux was predicted using simulation program. As a result, the magnetic density flux was lower at the center of pole on inductor than outside. It had same result on the experimental verification. And magnetic force was lower according to increase of working gap. So, to improve the magnetic force, permanent magnet was installed under the workpiece. In that case, the magnetic density flux not only at center but also at outside of pole was increased. Therefore, the efficiency of magnetic abrasive polishing was also increased. A design of experimental method was adopted for assessment of parameters' effect on the MAP results of magnesium plate for improving the magnetic force.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.45-50
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• 2008

In previous study, it showed that the MAP was greatly effective polishing process for magnesium plate. But it had lower efficiency than magnetic materials such as SM45C. It was very difficult to cut non-magnetic materials using the MAP process because the process was fundamentally possible by help of a magnetic force. This study aimed to verify analytically formation of the magnetic field in a case of the non-magnetic materials especially focused on magnesium plate. So, In this study, the magnetic density flux was predicted using simulation program. As a result, the magnetic density flux was lower at the center of pole on inductor than outside. It had same result on the experimental verification. And magnetic force was lower according to increase of working gap. So, to improve the magnetic force, permanent magnet was installed under the workpiece. In that case, the magnetic density flux not only at center but also at outside of pole was increased. Therefore, the efficiency of magnetic abrasive polishing was also increased. A design of experimental method was adopted for assessment of parameters' effect on the MAP results of magnesium plate for improving the magnetic force.

• The Journal of Korean Academy of Prosthodontics
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• v.41 no.1
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• pp.1-19
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• 2003

The surface of metals should be as smooth as possible for optimum comfort, oral hygiene, low plaque retention, and resistance to corrosion. In this study five specimens of each precious metal(type III gold alloy, ceramic gold alloy, and Ag-Pd alloy) were divided into five groups according to finishing and polishing procedures : group 1(sandblaster), group 2(group 1+stone), group 3(group 2+brown rubber), group 4(group 3+green rubber), and group 5(group 4+rouge). Six specimens of each non-precious metal(Co-Cr alloy, Ni-Cr alloy, and Co-Cr-Ti alloy) were divided into six groups: group 1(sandblaster), group 2(group 1+hard stone), group 3(group 2+electrolytic polisher), group 4(group 3+brown hard rubber point), group 5(group 4+green hard rubber point), and group 6(group 5+rouge). Considering factors affecting the rate of abrasion, the same dentist applied each finishing and polishing procedure. In addition, the surface roughness of enamel, resin, and porcelain was evaluated. The effect of finishing and polishing procedures on surface roughness of precious and non-precious metals, enamel, resin, and porcelain was evaluated by means of Atomic Force Microscope(AutoProbe CP. Park Scientific Instruments, U.S.A.) that can image the three dimensional surface profile and measure average surface roughness values of each sample at the same time. The obtained results were as follows : 1. According to finishing and polishing procedures, the surface roughness of type III gold alloy, ceramic gold alloy, and Ag-Pd alloy was decreased in the order of group 1, 2, 3, 4, and 5 (P<0.01). 2. According to finishing and polishing procedures. the surface roughness of Co-Cr alloy, Ni-Cr alloy, and Co-Cr-Ti alloy was decreased in the order of group 1, 2, 3, 4, 5, and 6 (p<0.01). 3. There was not statistically significant difference in the surface roughness among three metals of precious metals in group 1 but was significant difference in group 2, 3, 4, and 5 (P<0.05). 4. There was not statistically significant difference in the surface roughness among three metals of non-precious metals in all groups. 5. When the surface roughness of the smoothest surface of each metal, enamel. porcelain, and resin was compared, porcelain was the smoothest and the surface roughness was decreased in the order of Ni-Cr alloy. Co-Cr alloy. Co-Cr-Ti alloy, resin. Ag-Pd alloy, ceramic gold alloy type III gold alloy, and enamel (P<0.01). The results of this study indicate that the finishing and polishing procedures should be carried out in a logical, systematic sequence of steps and the harder non-precious metals may be less resistance to abrasion than are the softer precious metals.