• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.228-232
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• 2002

The rise throughput and the stability in the device fabrication can be obtained by applying chemical mechanical polishing(CMP) process in 0.18 ${\mu}m$ semiconductor device. However it does have various problems due to the CMP equipment. Especially, among the CMP components, process variables are very important parameters in determining removal rate and non-uniformity. In this paper, We studied the DOE(design of experiment) method for the optimized CMP process. Various process variations, such as table and head speed, slurry flow rate and down force, have investigated in the viewpoint of removal rate and non-uniformity. Through the above DOE results, we could set-up the optimal process parameters.

• Tribology and Lubricants
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• v.32 no.2
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• pp.67-71
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• 2016

This study investigates the characteristics of the sapphire wafer chemical mechanical polishing (CMP) process. The material removal rate is one of the most important factors since it has a significant impact on the production efficiency of a sapphire wafer. Some of the factors affecting the material removal rate include the pressure, platen speed and slurry. Among the factors affecting the CMP process, we analyzed the trends in the material removal rate and surface roughness, which are mechanical factors corresponding to both the pressure and platen speed, were analyzed. We also analyzed the increase in the material removal rate, which is proportional to the pressure and platen speed, using the Preston equation. In the experiment, after polishing a 4-inch sapphire wafer with increasing pressure and platen speed, we confirmed the material removal rate via thickness measurements. Further, surface roughness measurements of the sapphire wafer were performed using atomic force microscopy (AFM) equipment. Using the measurement results, we analyzed the trends in the surface roughness with the increase in material removal rate. In addition, the experimental results, confirmed that the material removal rate increases in proportion to the pressure and platen speed. However, the results showed no association between the material removal rate and surface roughness. The surface roughness after the CMP process showed a largely consistent trend. This study demonstrates the possibility to improve the production efficiency of sapphire wafer while maintaining stable quality via mechanical factors associated with the CMP process.

• Journal of Digital Contents Society
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• v.5 no.4
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• pp.251-256
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• 2004

The flatness of a silicon wafer concerned with ULSI chip is one of the most critical parameters ensuring high yield of wafers. That is necessary to constitute the circuit with high quality for he surface of silicon wafer, which comes to be base to make the direct circuit of the semiconductor, Flatness, therefore, is the most important factor to guarantee it wafer with high quality. The process of polishing is one of the most crucial production line among 10 processing stages to change the rough surface into the flatnees with best quality. Currently at this process, it is general for an engineer in charge to observe, judge and control the model of wafer from the monitor of measuring equipment with his/her own eyes to enhance the degree of flatness. This, however, is quite a troublesome job for someone has to check of process by one's physical experience. The purpose of this study is to approach the model of wafer with digital contents and to apply the result of the research for an algorithm which enables to control the polishing process by means of measuring the degree of flatness automatically, not by person, but by system. In addition, this paper shows that this algorithm proposed for the whole wafer flatness enables to draw an estimated algorithm which is for the thickness of sites to measure the degree of flatness for each site of wafer.

• Korean Journal of Health Education and Promotion
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• v.18 no.2
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• pp.141-156
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• 2001

This study was performed to identify the occupational diseases in the dental technicians working in Korea, and to elucidate the main related affecting factors for the occurrence of the occupational diseases. The research was carried out using a mail questionnaire and data collection was done for two months from April 15, 2000. The questionnaires were delivered to 1000 dental technicians working at 250 dental laboratories which were chosen among the total 1330 dental laboratories in south Korea. And 763 questionnaires were collected, then 739 questionnaires were used for a logistic and a multiple regression analyses. The results obtained in this study are summarized as follows: 1. The occupational diseases in the dental technicians included pneumoconiosis, chronic bronchitis, asthma, pneumonia, hyposmia, allergic dermatitis, eczema, contagious dermatitis, central nervous disorder, dysfunction of finger, vertebral disorder, dysfunction of interphalangeal joint, ophthalmitis, auditory dysfunction, otitismedia, optic trauma, and bum. 2. The main related affecting factors for the occurrence of the occupational diseases in the dental technicians were elucidated as follows: On the ccurrence of chronic bronchitis, vibration of equipment and job career were affected positively. On the ccurrence of asthma, job career and career on current working part were affected positively, but exhaust ventilation, work hour were affected negatively. On the occurrence of eczema, career on current working part and vibration of equipment were affected positively, but personal protective equipment, local exhaust ventilation, isolation of gas source were affected negatively. And eczema was occurred more in methyl methacrylate work than in any other work part. On the occurrence of finger dysfunction, vibration of equipment and noise of work place were affected positively. But personal protective equipment, local exhaust ventilation, isolation of dust and gas source were affected negatively. But finger dysfunction was occurred more in metal polishing than in any other work part. On the occurrence of auditory dysfunction, noise of work place were affected negatively. The results obtained in this study can give a valuable information for a prevention of the occupational diseases in the dental technicians working in Korea, and for keeping them in healthy. This study also can be helpful for a researcher who is aiming at a identification of occupational diseases and a elucidation of related affecting factors in a similar occupation.

• Journal of Technologic Dentistry
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• v.28 no.1
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• pp.177-198
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• 2006

This study purposed to offer basic data for safety education of the dental laboratory technology after the investigation of how much the students in the dept. of dental laboratory technology are aware of the danger of each instrument, equipment or laboratory procedure that they use during laboratory and how much they demand safety education for this. The objects for this study were 423 students who were in the dept. of dental laboratory technology. In this regard, four colleges which have the dept. of dental laboratory technology were randomly selected to do a questionnaire survey. SPSS 12.0 was used to analyze the collected data. The results were as follows: As for satisfaction with their major, the respondents answered Satisfied (59.1%), Average (35.5%) and Dissatisfied (5.4%). In terms of the production process of a partial denture, they considered casting, polishing the casting body, polishing denture and burn out were most dangerous in order. As for the production process of a full denture, what they regarded as the most dangerous in order was polishing denture, deflasking and wax wash. Regarding the laboratory procedures of porcelain material, casting, trimming casting body, polishing porcelain material and burn out were the most dangerous procedures that they perceived. With regard to materials for use, alcohol, polishing, metal and wire were the most dangerous ones they thought. As for the handling characteristics of each material, small towns showed a higher demand for safety of the handling characteristics of alcohol. In terms of school year and sex, juniors and girls had higher scores in the demand for safety of the handling characteristics of acid. Regarding the handling characteristics of each equipment and instrument, all of small towns, juniors and girls showed the highest demand for safety of the handling characteristics of alcohol lamps. With regard to scores in the demand for safety of other characteristics, all of small towns, juniors and girls had the highest demand for safety of emergency treatment. Concerning the demand for safety education by the completion of safety education, in terms of each material, highest was the demand for safety of acid from the group which completed safety education. In regard to equipments and instruments, when it came to the demand for safety of the handling characteristics of casting machine, the educated group's demand for safety of acid was higher. Regarding other characteristics, the group which was not educated gained higher scores in the demand for safety of emergency treatment. 11. In all areas(materials, machines and others), small towns, girls and juniors showed higher scores in the demand for safety. Based on the above results, it was found that when students conduct the laboratory of dental technology, they would think that many materials, instruments or equipments for use are very dangerous. However, safety education was not fully given to them. Regarding the scores in the damned for safety education, the highest was 4.16 and the lowest was 3.43, which suggests that the scores were generally very high. In this regard, it is necessary to continue delivering a systematic safety education of materials, equipments or instruments used during the laboratory of dental technology. Therefore, through the analysis of each material, instruments or facility used in every laboratory and each process, safety accident types and accident risk factors should be investigated to develop educational materials for this. Moreover, it is required to open safety education as a single course of study or insert safety contents of all materials and machines into the class of dental laboratory instrument or dental materials for the purpose of a systematic and thorough safety education to prevent a safety accident during laboratory.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.42 no.5
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• pp.31-40
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• 2005

In this study, we study measurement of wafer processing throughput and sequence simulation of single wafer type for wafer cleaning equipments that were used for etching, cleaning and polishing of wafer. Based on finite state machine, simulation model was built with identification of robot's status according to scheduling algorithm. Moreover, through performance of simulation as above, throughput per hour of cleaning equipment was measured. By the simulation method that are proposed in this paper, we could measure the wafer throughput per hour according to recipe and robot motion speed, and find optimal recipe and moving sequence of robot that maximize the throughput.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.276-276
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• 2009

Solar cells has been studied mainly the high efficiency and lower prices. Using recycling wafer as a way to realize their money in it, there is a way to manufacture a solar cell substrate. How to play the recycling wafer, CMP(Chemical Mechanical Polishing) and remelting process is the complex and the expensive equipment. However, using the Micro-Blaster, the process easier, and cheaper prices. Micro-Blaster confirmed that the remaining amount of material left after the process recycling wafer surface.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.2
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• pp.10-15
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• 2005

For the development of compensation machining program, ultra precision grinding used in ultra precision machine and corrective machining was studied. We explored a new rough grinding technique on optical material such as zerodur. The facility used is a polishing machine with a custom grinding module and a range of diamond resin bond wheel. Surface roughness and form accuracy are measured by surface measurement equipment(Form Talysurf series2). Our compensation machining program has complied with a target of producing surface roughness better than $0.05{\mu}m$ Ra and form accuracy of around $0.05{\mu}m$ Rt and has been unveiled as a work-hour model.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.583-586
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• 2000

The non-selective method by polishing after grinding was used widely to thinning of SDB SOI structures. This method was very difficult to thickness control of thin film, and it was dependent on equipments. However electrochemical etch-stop, one of the selective methods, was able to accurately thickness control and etch equipment was very simple. Therefore, this paper described with the effect of leakage current and electrodes on electrochemical etch-stop. Consequentially, PP(passivation potential) was changed according to the kinds of contact and contact sizes, but OCP(open current potential) was not change with range of -1.5~-1.3V

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.365-371
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• 2003

We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.