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Study on Measurement of Wafer Processing Throughput and Sequence Simulation of SWP(Single Wafer Process) Cleaning Equipment  

Sun, Bok-Keun (Dept. of Computer Engineering, Hoseo University)
Han, Kwang-Rok (Dept. of Computer Engineering, Hoseo University)
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Abstract
In this study, we study measurement of wafer processing throughput and sequence simulation of single wafer type for wafer cleaning equipments that were used for etching, cleaning and polishing of wafer. Based on finite state machine, simulation model was built with identification of robot's status according to scheduling algorithm. Moreover, through performance of simulation as above, throughput per hour of cleaning equipment was measured. By the simulation method that are proposed in this paper, we could measure the wafer throughput per hour according to recipe and robot motion speed, and find optimal recipe and moving sequence of robot that maximize the throughput.
Keywords
시뮬레이션;처리량 측정;매엽식;웨이퍼 세정 장비;
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