• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.3
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• pp.133-140
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• 2010

Carbon fiber has many potential applications in a wide array of fields of solar cell, fuel cell, batteries, and polymer matrix composites due to an exceptional mechanical properties and chemical stability. In this study, the effects of catalysts on the property of carbon nanostructures grown on the carbon fiber were systematically investigated. The surface treatment of carbon fiber and catalysts synthesis for carbon nanostructures growth were carried out by one-pot ELP method and thermal CVD, respectively. The surface morphology and crystal structure of carbon nanostructures were examined using a field emission scanning electron microscope and transmission electron microscope. Depending on the type of catalysts and the molar ratio, various types of carbon nanostructures like carbon nanotube, carbon nanofilament, carbon nanospring and etc. were synthesized on the surface of carbon fibers surface.

• Journal of Welding and Joining
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• v.30 no.2
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• pp.65-69
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• 2012

Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.4
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• pp.61-68
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• 2013

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.51-56
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• 2014

The reliability of solder joint is significantly affected by the property of surface finish. This paper reports on a study of high speed shear energy and failure mode for Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with the time of Pd activation. The nodule size of electroless Ni-P deposit increased with increasing the time of Pd activation. The roughness (Ra) of electroless Ni-P deposit decreased with increasing the time of Pd activation. Then, with $HNO_3$ vapor, the quasi-brittle and brittle mode of SAC405 solder joint decreased with increasing the time of Pd activation. This results indicate that the increase in the Pd activation time for Electroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface finish play a critical role for improving the robustness of SAC405 solder joint.

• Journal of the Korean institute of surface engineering
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• v.41 no.4
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• pp.147-155
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• 2008

The dental orthodontic wire provides a good combination of strength, corrosion resistance and moderate cost. The purpose of this study was to investigate the effects of TiN and ZrN coating on corrosion resistance and physical property of orthodontic wire using various instruments. Wires(round type and rectangular type) were used, respectively, for experiment. Ion plating was carried out for wire using Ti and Zr coating materials with nitrogen gas. Ion plated surface of each specimen was observed with field emission scanning electron microscopy(FE-SEM), energy dispersive X-ray spectroscopy(EDS), atomic force microscopy(AFM), vickers hardness tester, and electrochemical tester. The surface of TiN and ZrN coated wire was more smooth than that of other kinds of non-coated wire. TiN and ZrN coated surface showed higher hardness than that of non-coated surface. The corrosion potential of the TiN coated wire was comparatively high. The current density of TiN coated wire was smaller than that of non-coated wire in 0.9% NaCl solution. Pit nucleated at scratch of wire. The pitting corrosion resistance $|E_{pit}-E_{rep}|$ increased in the order of ZrN coated(300 mV), TiN coated(120 mV) and non-coated wire(0 mV).

• The Journal of Korean Academy of Prosthodontics
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• v.45 no.6
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• pp.769-779
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• 2007

Statement of problem. When TiN coating is applied to the abutment screw, occurrence of greater preload and prevention of the screw loosening could be expected due to decrease of frictional resistance. However, the proper thickness of TiN coating on abutment screw has not been yet reported. Purpose. The purpose of this study is to find out the appropriate TiN coating thickness by evaluating the detorque force and the surface change of titanium abutment screw with various TiN coating thickness. Material and methods. 1. Material Thirty five non-coated abutment screws were prepared for TiN coating. TiN coatings were prepared by Arc ion plating method. Depending on the coating deposition time(CDT), experimental groups were divided into 6 groups(CDT 30min, 60min, 90min, 120min, 150min, 180min) and those of 1 group was not coated as a control group. Each group was made up of 5 abutment screws. 2. Methods FE-SEM(Field Emission Scanning Electron Microscoper) and EDX(Energy Dispersive X-ray Spectroscopy) were used to observe the surface of the abutment screw. Electric scales was used to measure the weight of the abutment screw after the repeated closing and opening of 10 trials. Detorque force was measured with digital torque gauge, at each trial. Results. 1. As the coating deposition time increased, the surface became more consistent and smooth. 2. As for the abutment screws that were TiN coated for more than 60 minutes, no surface change was found after the repeated closing and opening. 3. The TiN coated abutment screws showed less weight change than the non-coated abutment screws. 4. The TiN coated abutment screws showed higher mean detorque force than the noncoated abutment screws. 5. The abutment screw coated for 60 minutes showed the highest mean detorque force. Conclusion. The coating layer of proper thickness is demanded to obtain consistent and smooth coating surface, resistance to wear, and increased detorque force of the abutment screw. In conclusion, the coating deposition time of 60 minutes indicated improved mechanical property, when TiN coating was conducted on titanium abutment screw.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.9
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• pp.774-779
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• 2016

This study was performed to study the possibility of TMCP's application for side shell plating curved structures through mechanical property testing to understand if the rules and regulations of DNV and the quality standard of IACS after line heating for TMCP steel and normalizing DH32 material steel could be satisfied. Experimental results showed that TMCP's strength was measured to YS = 385 MPa, 18% higher than the required 315 MPa and TS = 525 MPa, complying with the required range of between 440 and 570 MPa. The minus 20 degree impact test for the Charpy V-Notch complied with the required standard and in addition the hardness test satisfied the requirement of 'Hv10 = 130 ~ 320' by reaching an average of T : 216 and L : 275 respectively.

• Journal of the Korean institute of surface engineering
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• v.49 no.1
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• pp.40-45
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• 2016

Recently, $Bi_2Te_3$-based alloys are the best thermoelectric materials near to room temperature, so it has been researched to achieve increased figure of merit(ZT). Ternary compounds such as Bi-Te-Se and Bi-Sb-Te have higher thermoelectric property than binary compound Bi-Te and Sb-Te, respectively. Compared to DC plating method, pulsed electrodeposition is able to control parameters including average current density, and on/off pulse time etc. Thereby the morphology and properties of the films can be improved. In this study, we electrodeposited n-type ternary Cu-doped $Bi_2(Te-Se)_3$ thin film by modified pulse technique at room temperature. To further enhance thermoelectric properties of $Bi_2(Te-Se)_3$ thin film, we optimized Cu doping concentration in $Bi_2(Te-Se)_3$ thin film and correlated it to electrical and thermoelectric properties. Thus, the crystal, electrical, and thermoelectric properties of electrodeposited $Bi_2(Te-Se)_3$ thin film were characterized the XRD, SEM, EDS, Seebeck measurement, and Hall effect measurement, respectively. As a result, the thermoelectric properties of Cu-doped $Bi_2(Te-Se)_3$ thin films were observed that the Seebeck coefficient is $-101.2{\mu}V/K$ and the power factor is $1412.6{\mu}W/mK^2$ at 10 mg of Cu weight. The power factor of Cu-doped $Bi_2(Te-Se)_3$ thin film is 1.4 times higher than undoped $Bi_2(Te-Se)_3$ thin film.

• Journal of the Korean institute of surface engineering
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• v.38 no.3
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• pp.100-105
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• 2005

Cr-Si-C-N coatings were deposited on steel substrate (SKD 11) by a hybrid system of arc ion plating (AIP) and sputtering techniques. From XRD, XPS, and HRTEM analyses, it was found that Cr-Si-C-N had a fine composite microstructure comprising nano-sized crystallites of Cr(C, N) well distributed in the amorphous phase of $Si_3N_4/SiC$ mixture. Microhardness of Cr(C, N) coatings and Cr-Si-N coatings were reported about $\~22 GPa$ and $\~35 GPa$, respectively. As the Si was incorporated into Cr(C, N) coatings, The Cr-Si-C-N coatings having a Si content of $9.2 at.\%$ showed the maximum hardness value. As increased beyond Si content of $9.2 at.\%$, the interaction between nanocrystallites and amorphous phase was gone, the hardness was reduced as dependent on amorphous phase of $Si_3N_4/SiC$. In addition, the average coefficient of Cr-Si-C-N coatings largely decreased compared with Cr(C, N) coatings.

• Korean Journal of Metals and Materials
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• v.48 no.10
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• pp.951-956
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• 2010

This study examined the effect of copper and sulfuric acid concentrations on the surface morphology and physical properties of copper plated on a polyimide (PI) film. Electrochemical experiments with SEM and a four-point probe were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the composition of an electrolyte. The resistivity and peel strength were controlled using a range of electrolyte compositions. A lower resistivity and high flexibility were obtained when an electrolyte with 20 g/l of copper was used. However, a uniform surface was obtained when a high current density that exceeded $20mA/cm^2$ was applied, which was maintained at copper concentrations exceeding 40 g/l. Increasing sulfuric acid to >150 g/l decreased the peel strength and flexibility. The lowest resistivity and fine adhesion were detected at a $Cu^{2+}:H_2SO_4$ ratio of 50:100 g/l.