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http://dx.doi.org/10.6117/kmeps.2014.21.3.051

Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 2. Effects of time of Pd activation  

Huh, Seok-Hwan (ACI division, Samsung Electro-Mechanics)
Lee, Ji-Hye (ACI division, Samsung Electro-Mechanics)
Ham, Suk-Jin (ACI division, Samsung Electro-Mechanics)
Publication Information
Journal of the Microelectronics and Packaging Society / v.21, no.3, 2014 , pp. 51-56 More about this Journal
Abstract
The reliability of solder joint is significantly affected by the property of surface finish. This paper reports on a study of high speed shear energy and failure mode for Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with the time of Pd activation. The nodule size of electroless Ni-P deposit increased with increasing the time of Pd activation. The roughness (Ra) of electroless Ni-P deposit decreased with increasing the time of Pd activation. Then, with $HNO_3$ vapor, the quasi-brittle and brittle mode of SAC405 solder joint decreased with increasing the time of Pd activation. This results indicate that the increase in the Pd activation time for Electroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface finish play a critical role for improving the robustness of SAC405 solder joint.
Keywords
Pd activation; Electroless Ni-P plating; ENEPIG; Ni-P roughness; Solder joint reliability; High speed shear; Ni-P thickness;
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1 D. Tian, D. Y. Li, F. F. Wang, N. Xiao, R. Q. Lia, N. Li, Q. Li, W. Gao and G. Wu, "A Pd-free activation method for electroless nickel deposition on copper", Surf. Coat. Techol., 228, 27 (2013).   DOI
2 P. H. Lo, W. T. Tsai, J. T. Lee and M. P. Hung, "The electrochemical behavior of electroless plated Ni-P alloy in concentrated NaOH solution", Electrochem. Soc., 142(1), 91 (1995).   DOI
3 Z. Mei, M. Kauffmann, A. Eslambolchi and P. Jonson, "Brittle interfacial fracture of PBGA packages on electroless Ni/ immersion Au", Proc. 48th Electronics Component and Technology Conference, 952 (1998).
4 D. Cullen, E. Huenger, M. Toben, B. Houghton and K. Johal, "A study on interfacial fracture phenomenon of solder joints formed using the electroless nickel/immersion gold surfaces finish", Proc. IPC works 2000, s03, (2000).
5 Y. C. Sohn and J. Yu, "Correlation between interfacial reaction and brittle fracture found in elecroless Ni(P) metallization", J. Microelectron. Packag. Soc., 12(1), 41 (2005).
6 G.M. Wenger, R. J. Coyle, P. P. Solan, J. K. Dorey, C. V. Dodde, R. Erich and A. Primavera, "Case studies of brittle interfacial fractures in area array solder intercommnects", Proc. 26th International Symposium for testing and failure analysis, 355 (2000).
7 D. G. Lee, T. J. Chung, J. W. Choi, S. H. Huh, S. J. Cho, Y. J. Yoon and B. Y. Min, "New surface finish of the substrate for the flip chip packaging" SEMICON Korea 2007, 255 (2007).
8 T. I. Eijim, D. B. Hollesen, A. Holliday, S. A. Gahr and R. J. Coyle, "Assembly and reliability of thermally enhanced high I/O BGA packages", Proc. 21th IEEE International Electronics Manufacturing Symposium, 25 (1997).
9 J. W. Jang, D. R. Frear, T. Y. Lee and K. N. Tu, "Morpholgy of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization", J. Appl. Phys., 88(11), 6359 (2000).   DOI   ScienceOn
10 D. Goyal, T. Lane, P. Kinzie, C. Panichas, K. M. Chong and O. Villalobos, "Failure mechanism of brittle solder joint fracture in the presence of electroless Ni immersion gold (ENIG) interface", Proc. 52nd Electronic Component and Technology Conference, 732 (2002).
11 K. Zeng, R. Stierman, D. Abbott and M. Murtuza "The root cause of black pad failure of solder joints with electroless Ni/ immersion gold plating", JOM, 75 (2006).
12 D. G. Lee, T. J. Chung, J. W Choi, S. H. Huh, S. J. Cho, Y. J. Yoon and B. Y. Min, "New surface finish of the substrate for the flip chip packaging", SEMICON Korea 2007, 255 (2007).
13 Y. D. Jeon, Y. B. Lee, and Y. S. Choi, "Thin electroless Cu/ OSP on electroless Ni as a novel surface finish", 2006 Electronic Components and Technology Conference IEEE, 116 (2006).
14 R. Ramanauskas, A. Selskis, F. Fuodkazyte and V. Fasulaitiene, "PCB failure analysis related to the ENIG black pad problem", Circuit World, 39(3), 124 (2013).   DOI
15 K. Suganuma and K. S. Kim, "The root causes of the black pad phenomenon and avoidance tactics", JOM, 60(6), 61 (2008).
16 K. Pun, P. L. Eu, M. N. Islam and C. Q. Cui, "Effect of Ni layer thickness on intermetallic formation and mechanical strength of Sn-Ag-Cu solder joint", 10th Electronics Packaging Technology Conference, IEEE, 487 (2008).
17 M. O. Alam, "Reliability of BGA solder joints on the Au/Ni/ Cu bond pad-Effect of thickness of Au and Ni layer" IEEE Transaction on Device and Materials Reliability, 6(3), 421 (2006).   DOI
18 J. H. Lee, S. H. Huh, G. H. Jung and S. J. Ham, "Effects of the electroless Ni-P thickness and assembly process on solder ball joint reliability", J. KWS., 34(3), 60 (2014).
19 A. Kumar and Z. Chen, "Effect of Ni-P thickness on the tensile strength of Cu/Electroless Ni-P/Sn-3.5Ag solder joint", 7th Electronics Packaging Technology Conference, IEEE, 873 (2005).
20 S. H. Huh, K. D. Kim and K. S. Kim, "A novel high speed shear test for lead free flip chip package, Electron". Mater. Lett., 8(1), 53 (2012).   DOI   ScienceOn
21 W. L. Liu, S. H. Hsieh and W. J. Chen, "Growth behavior of Ni-P film on Fe/Si substrate in an acid electroless plating bath", Electrochem. Soc., 155(3), D192 (2008).   DOI
22 D. K. Lee, D. G. Kim and B. Y. Yoo, "Influence of doping on Ni electroless deposition at single crystalline Si", Electrochem. Soc., 158(8), D490 (2011).   DOI
23 S. S. Ha, J. W. Kim, J. H. Chae, W. C. Moon, T. H. Hong, C. S. Yoo, J. H. Moon and S. B. Jung, "Thermo-mechanical reliability of lead-free surface mount assemblies for automobile application", J. KWS., 24, 21 (2006).
24 I. Platzman, R. Brener, H. Haick and R. Tannenbaum, "Oxidation of Polycrystalline copper thin films at ambient conditions", J. Phys. Chem. C., 112, 1101 (2008).   DOI   ScienceOn
25 J. W. Yoon, J. W. Kim, J. M. Koo, S. S. Ha, B. I. Noh, W. C. Moon, J. H. Moon and S. B. Jung, "Flip-chip bonding technology and reliability of electronic packaging", J. KWS, 25, 6 (2007).