• Design & Manufacturing
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• 제10권2호
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• pp.50-54
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• 2016

In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.

• Transactions on Electrical and Electronic Materials
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• 제4권2호
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• pp.10-14
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• 2003

Flexible displays such as plastic-based liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDDs) have been researched and developed at KETI since 1997. The plastic film substrate is very weak to heat and pressure compared to glass substrate, that its fabrication process is limited to 110$^{\circ}C$ and low pressure. The ITO films were deposited on the bare plastic film substrate by rf-magnetron sputtering. Moreover, in order to maintain uniform cell gap and pressure on the plastic film substrate, we utilized newly-invented jig and fabrication process. Electro-optical characteristics were better than or equivalent to those of typical glass LCDs though it is thinner, lighter-weight, and more robust than glass LCDs.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2003년도 춘계학술대회 논문집
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• pp.454-459
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• 2003

The paper will present chip formation mechanism and surface integrity generation mechanism based on the systematical experimental tests. Some basic factors such as the end milling cutter tooth number, cutting forces, cutting temperature, cutting vibration, the chip status, the surface roughness, the hardness distribution and the metallographic texture of the machined surface layer are involved. the chip formation mechanism is typical thermal plastic shear localization at high cutting speed with less number og shear ribbons and bigger shear angle than at low speed, which means lack of chip deformation. The high cutting speed with much more cutting teeth will be beneficial to the reduction of cutting forces, enlarge machining stability region, depression of temperature increment, auti-fatigability as well as surface roughness. The burrs always exists both at low cutting speed and at high cutting speed. So the deburr process should be arranged for milling titanium alloy in any case.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2006년도 추계 학술발표회 논문집
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• pp.677-680
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• 2006

Tensile as well as flexural strengths of concrete can be substantially increased by introducing closely spaced fibers that would obstruct the propagation of microcracks, therefore delaying the onset of tension cracks and increasing the tensile strength of the material. Fibers of various shapes and sizes produced from steel, plastic, glass and natural materials are being used. In this study, we used cellulose chip fiber to decrease the shrinkage crack in mortar and concrete. Specially, we have studied the dispersion characteristic of cellulose chip fiber. As a result, it was assumed that the slurry type of cellulose chip fiber is very effective to disperse the fiber in mortar and concrete.

• 한국정밀공학회지
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• 제32권11호
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• pp.969-976
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• 2015

In the present study, a numerical investigation of an insert injection molding process was carried out for the development of thermoplastic microfluidic chip plates with metal electrodes. Insert injection molding technology enables efficient realization of a plastic-metal hybrid structure and various efforts have been undertaken to produce novel components in several application fields. The microfluidic chip with metal inserts was proposed as a representative example and its molding process was analyzed. The important characteristics of the filling stage, such as the effects of filling time and thickness of the part cavity, were characterized. Furthermore, the detailed distributions of pressure and temperature at the end of the filling stage were investigated, revealing the significance of metal insert temperature.

• Design & Manufacturing
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• 제15권4호
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• pp.32-36
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• 2021

In this study, the cause of the decrease in transmittance of the outer lens among the causes of the decrease in the amount of light in the automobile headlamp was identified, and the improvement method was selected to determine the effect. The causes of defects that lower the transmittance of the outer lens are divided into a moisture problem and a haze problem. The moisture problem is caused by the temperature difference between the inside and the outside of the head lamp, and the haze problem occurs when the heat inside the head lamp evaporates the haze component contained in the plastic material and attaches it to the outer lens. In order to improve the haze problem that occurs in plastic raw materials, the structures of the bulb light source type headlamp and the LED chip light source type headlamp were analyzed. Among them, the housing material of the LED chip light source type headlamp, which is structurally prone to haze gas, was selected as the test target. In the mass-production injection process of the housing, the drying process was selected as a method to minimize haze gas without adding a separate production process. After extracting a sample every drying time at a constant drying temperature, the sample was put into a haze tester and the residual amount of haze gas was measured. As a result, it was confirmed that the residual amount of Haze gas in the material decreased as the drying time increased.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• 한국정밀공학회지
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• 제15권1호
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• pp.51-59
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• 1998

The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.183-199
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• 2002

Reliability.The reliability strongly depended on the CTE of underfill resin..The fractured portion was identical with the maximum plastic equivalent strain..1 % or less value of the maximum plastic equivalent strain certified more than 1000 cycle of TCT life. UFB.Bonding accuracy was confirmed within2$2{\mu}{\textrm}{m}$..The fundamental bondability of UFB was confirmed with no damage around aluminum pads. Some dislocations and vacancies were observed at the interface, however, the atomic level bonding was confirmed. CBB.Dry process was applied to UBM removal.