Browse > Article
http://dx.doi.org/10.4313/TEEM.2003.4.2.010

Flexible Display i Low Temperature Processes for Plastic LCDs  

Han, Jeong-In (Information Display Research Center, Korea Electronics Technology Institute)
Publication Information
Transactions on Electrical and Electronic Materials / v.4, no.2, 2003 , pp. 10-14 More about this Journal
Abstract
Flexible displays such as plastic-based liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDDs) have been researched and developed at KETI since 1997. The plastic film substrate is very weak to heat and pressure compared to glass substrate, that its fabrication process is limited to 110$^{\circ}C$ and low pressure. The ITO films were deposited on the bare plastic film substrate by rf-magnetron sputtering. Moreover, in order to maintain uniform cell gap and pressure on the plastic film substrate, we utilized newly-invented jig and fabrication process. Electro-optical characteristics were better than or equivalent to those of typical glass LCDs though it is thinner, lighter-weight, and more robust than glass LCDs.
Keywords
Plastic film; LCD; ITO; Cell gap; Chip bonding;
Citations & Related Records
연도 인용수 순위
  • Reference
1 F. Matsumoto, T. Nagata, T. Miyabori, H. Tanaka, and S. Tsushima, 'Color STN LCD on polymer film substrates', SID DIGEST, p. 965, 1993
2 R. P. Wenz and D. J. W. Aastuen, 'Plastic Microstructure Spaced LCD', SID DIGEST, p. 961, 1993
3 T, J. Gardner and R. P. Wenz, 'STN alignment on rib spaced plastic LCD substrate', SID DIGEST, Vol. 26, P.695, 1995
4 S. K. Park, Y. H. Kim, J. I. Han, D. G. Moon, and W. K. Kim, 'High performance polymer TFTs printed on a plastic substrate', IEEE Trans. Electron Devices, ED. 49, p. 2008, Nov. 2002   DOI   ScienceOn
5 S. K. Park, J. I. Han, W. K. Kim, and M. K. Kwak, 'Deposition of indium tin oxide films on polymer substrates for application in plastic based flat panel displays', Thin Solid Films, Vol. 397, p. 49, 2001   DOI   ScienceOn
6 S. K. Park, J. I. Han, W. K. Kim, and M. G. Kwak, 'Chip bonding on non rigid and flexible substrates with new stepped process', Jpn. J. Appl. Phys., Vol. 40, P.412, 2001   DOI