Browse > Article
http://dx.doi.org/10.7736/KSPE.2015.32.11.969

Numerical Analysis of the Filling Stage in Insert Injection Molding of Microfluidic Chip with Metal Electrodes  

Lee, Bong-Kee (School of Mechanical Engineering, Chonnam National University)
Na, Seung-Sik (School of Mechanical Engineering, Chonnam National University)
Publication Information
Journal of the Korean Society for Precision Engineering / v.32, no.11, 2015 , pp. 969-976 More about this Journal
Abstract
In the present study, a numerical investigation of an insert injection molding process was carried out for the development of thermoplastic microfluidic chip plates with metal electrodes. Insert injection molding technology enables efficient realization of a plastic-metal hybrid structure and various efforts have been undertaken to produce novel components in several application fields. The microfluidic chip with metal inserts was proposed as a representative example and its molding process was analyzed. The important characteristics of the filling stage, such as the effects of filling time and thickness of the part cavity, were characterized. Furthermore, the detailed distributions of pressure and temperature at the end of the filling stage were investigated, revealing the significance of metal insert temperature.
Keywords
Insert injection molding; Microfluidic chip; Numerical analysis; Filling stage;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
1 Potsch, G. and Michaeli, W., "Injection Molding: An Introduction," Hanser Gardner Publications, pp. 180-181, 2007.
2 Lho, T.-J. and Kim, K.-S., "A Study on Implementation of Al-Inserted Plastic Injection Molding Process for Automobile Interior-Parts," J. Korean Soc. Precis. Eng., Vol. 25, No. 5, pp. 43-51, 2008.
3 Honkanen, M., Hoikkanen, M., Vippola, M., Vuorinen, J., and Lepisto, T., "Metal-Plastic Adhesion in Injection-Molded Hybrids," Journal of Adhesion Science and Technology, Vol. 23, No. 13-14, pp. 1747-1761, 2009.   DOI
4 Chiang, Y.-C., Cheng, H.-C., Huang, C.-F., Lee, J.-L., Lin, Y., et al, "Warpage Phenomenon of Thin-Wall Injection Molding," The International Journal of Advanced Manufacturing Technology, Vol. 55, No. 5-8, pp. 517-526, 2011.   DOI
5 Jin, K., Jeong, T., Kim, T., Kim, N., and Kim, B., "Analysis and Design for Reducing Residual Stress and Distortion after Ejection of injection Molded Part with Metal-Insert," Int. J. Precis. Eng. Manuf., Vol. 15, No. 12, pp. 2533-2542, 2014.   DOI
6 Reyes, D. R., Iossifidis, D., Auroux, P.-A., and Manz, A., "Micro Total Analysis Systems. 1. Introduction, Theory, and Technology," Analytical Chemistry, Vol. 74, No. 12, pp. 2623-2636, 2002.   DOI
7 Park, T., "Thermoplastic Fusion Bonding of UV Modified PMMA Microfluidic Devices," J. Korean Soc. Precis. Eng., Vol. 31, No. 5, pp. 441-449, 2014.   DOI
8 Johnson, A. S., Selimovic, A., and Martin, R. S., "Integration of Microchip Electrophoresis with Electrochemical Detection Using an Epoxy-Based Molding Method to Embed Multiple Electrode Materials," Electrophoresis, Vol. 32, No. 22, pp. 3121-3128, 2011.   DOI
9 Hieber, C. and Shen, S., "A Finite-Element/Finite-Difference Simulation of the Injection-Molding Filling Process," Journal of Non-Newtonian Fluid Mechanics, Vol. 7, No. 1, pp. 1-32, 1980.   DOI