• Title/Summary/Keyword: Plasma sputtering

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A Comparative Study of Superhard TiN Coatings Deposited by DC and Inductively Coupled Plasma Magnetron Sputtering (DC 스퍼터법과 유도결합 플라즈마 마그네트론 스퍼터법으로 증착된 수퍼하드 TiN 코팅막의 물성 비교연구)

  • Chun, Sung-Yong
    • Journal of the Korean institute of surface engineering
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    • v.46 no.2
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    • pp.55-60
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    • 2013
  • Superhard TiN coatings were fabricated by DC and ICP (inductively coupled plasma) assisted magnetron sputtering techniques. The effect of ICP power, ranging from 0 to 300 W, on coating microstructure, preferred orientation mechanical properties were systematically investigated with HR-XRD, SEM, AFM and nanoindentation. The results show that ICP power has a significant influence on coating microstructure and mechanical properties of TiN coatings. With the increasing of ICP power, coating microstructure evolves from the columnar structure of DC process to a highly dense one. Grain sizes of TiN coatings were decreased from 12.6 nm to 8.7 nm with increase of ICP power. The maximum nanohardness of 67.6 GPa was obtained for the coatings deposited at ICP power of 300 W. Preferred orientation in TiN coatings also vary with ICP power, exerting an effective influence on film nanohardness.

The Present States and Prospect of Sputtering Finishing (Sputtering 가공기술의 현황과 미래)

  • Koo, Kang
    • Textile Coloration and Finishing
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    • v.9 no.5
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    • pp.88-95
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    • 1997
  • 진공기술을 섬유에 응용하려고 생각은 것은 이미 20여년 전이었으며, 그 이후 Osaka에서 제1회 섬유기술종합기계전이 열렸고, 전시장에는 방적, 연사기, 제직기 등이 눈부실만큼 고속화.자동화되고, water jet, air jet 기계 등 생산성 향상을 위한 장치가 많이 전시되어 있었다. 염색가공기계 중 혁신적인 장치를 찾고 있던 중에 NASA의 기술에 의한 저온 plasma 처리장치와 진공증착장치가 찍힌 1장의 panel 사진이 전시되어 있었다. 둘중 어느 것이나 대기 중에서는 처리할 수 없는 진공이라는 조건하에서 표면에 분자, 원자 level의 박막으로 처리해야하는 것에 강한 인상을 받았다. 그후 Shizuoka 대학 Inagaki 교수의 $\ulcorner$저온 plasma$\lrcorner$ 에 관한 기술 강연을 듣고, plasma의 신비스런 원리에 관심이 끌리게 되었다.

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Detailed Comparison of Discharge Characteristics of both FTS and CPMS Systems (FTS와 CPMS 시스템의 방전특성비교)

  • Kwak, D.J.;Sung, Y.M.;Park, C.H.;Ha, P.K.
    • Proceedings of the KIEE Conference
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    • 1994.07b
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    • pp.1619-1621
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    • 1994
  • Both Facing Target Sputtering(FTS) and Cylindrical Post-Magnetron Sputtering(CPMS) systems have been degigned in order to form high density plasma and to obtain high deposition rate. However, these two systems have some different applications, and discharge characteristics of these two systems are not well known. In this paper, the discharge characteristics and plasma parameters of both FTS and CPMS systems are studied experimentally. It is found that these two system show some different discharge characteristics under magnetic fields. The plasma density and electron temperature of these two systems are in the range of $10^{10}{\sim}10^{11}[cm^{-3}]$ and $3.5{\sim}5.5[eV]$, respectively.

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A Study on the Pd-Ni Alloy Hydrogen Membrane Using the Sputter Deposition (스퍼터 증착 방식으로 제조된 Pd-Ni 합금 수소 분리막 연구)

  • Kim Dong-Won;Park Jeong-Won;Kim Sang-Ho;Park Jong-Su
    • Journal of the Korean institute of surface engineering
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    • v.37 no.5
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    • pp.243-248
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    • 2004
  • A palladium-nikel(Pd-Ni) alloy composite membrane has been fabricated on microporous nickel support formed with nickel powder. Plasma surface treatment process is introduced as pre-treatment process instead of HCI activation. Pd coating layer was prepared by dc magnetron sputtering deposition after $H_2$ plasma surface treatment. Palladium-nickel alloy composite layer had a fairly uniform and dense surface morphology. The membrane was characterized by permeation experiments with hydrogen and nitrogen gases at temperature of 773 K and pressure of 2.2psi. The hydrogen permeance was 6 ml/minㆍ$\textrm{cm}^2$ㆍatm and the selectivity was 120 for hydrogen/nitrogen($H_2$/$N_2$) mixing gases at 773 K.

Characterization of AZO Thin Film by Plasma Surface Treatment (플라즈마 표면 처리에 따른 AZO 박막의 특성 변화)

  • Woo, Jong-Chang;Kim, Gwan-Ha
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.2
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    • pp.147-150
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    • 2019
  • There is a need for the development of transparent conductive materials that are economical and environmentally friendly with exhibit low resistivity and high transmittance in the visible spectrum. In this study, the deposition rate and uniformity of Al-doped ZnO-thin films were improved by changing the Z-motion of the sputtering system. The deposition rate and the uniformity were determined to be 3.44 nm/min and 1.23%, respectively, under the 10 mm Z-motion condition. During $O_2$ plasma treatment, the intrusion-type metal elements in the thin film were reduced, which contributed to an oxygen vacancy reduction in addition to structural stabilization. Moreover, the sheet resistance was more easily saturated.

Monitoring and Controlling Uniformity of Plasma Emission Intensity for IGZO Sputtering Process (IGZO박막 증착 공정에서 플라즈마 방출광 모니터링 및 플라즈마 균일도 제어)

  • Choi, Jinwoo;Hwang, Sang Hyuk;Kim, Woo Jae;Shin, Gi Won;Kwon, Heui Tae;Jo, Tae Hoon;Woo, Won Gyun;Cha, Sung Duk;An, Byung Chul;Park, Wan Woo;Do, Jae Chul;Kwon, Gi-Chung
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.4
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    • pp.27-32
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    • 2016
  • In recent years, various researches have been conducted to improve process yields in accordance with miniaturization of semiconductor. APC(Advanced Process Control) is considered one of the methods to increase in process yields. APC is a process control technology that maintains optimal process conditions and improves the reliability of results by controlling and formulating the relationship among the various process parameters and results. We built up an optical diagnostic system with a three-channel spectrometer. The system detects signals those represent the changes of specific emission peaks intensity versus each reference and converts it into MFC control signals to get back the changes to the reference state. Controlling the MFC continues until the specific peak intensity changes into the normal state. Through this device, we tested a APC automatically responding to process changes during the plasma process. We could control gas flow while sputtering process on going and improve uniformity of plasma intensity with this system. Finally, we have got results those enhance the plasma intensity non-uniformity to 7.7% from 15.5%. Also, found unexpected oxygen flow what is estimated to be come out from IGZO target.

Hydrophobic Properties of PTFE Film Deposited on Glass Surface Etched by Ar-plasma (아르곤 플라즈마를 이용하여 유리기판에 증착된 PTFE 박막의 초친수 특성 연구)

  • Rhee, Byung Roh;Bae, Kang;Kim, Hwa-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.27 no.8
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    • pp.516-521
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    • 2014
  • An excellent hydrophobic surface has a high contact angle over 147 degree and the contact angle hysteresis below $5^0$ was produced by using roughness combined with hydrophobic PTFE coatings, which were also confirmed to exhibit an extreme adhesion to glass substrate. To form the rough surface, the glass was etched by Ar-plasma. A very thin PTFE film was coated on the plasma etched glass surface. Roughness factors before or after PTFE coating on the plasma etched glass surface, based on Wensel's model were calculated, which agrees well with the dependence of the contact angle on the roughness factor is predicted by Wensel's model. The PTFE films deposited on glass by using a conventional rf-magnetron sputtering. The glass substrates were etched Ar-plasma prior to the deposition of PTFE. Their hydrophobicities are investigated for application as a anti-fouling coating layer on the screen of displays. It is found that the hydrophobicity of PTFE films mainly depends on the sputtering conditions, such as rf-power, Ar gas content introduced during deposition. These conditions are closely related to the deposition rate or thickness of PTFE film. Thus, it is also found that the deposition rate or the film thickness affects sensitively the geometrical morphology formed on surface of the rf-sputtered PTFE films. In particular, 1,950-nm-thick PTFE films deposited for 30 minute by rf-power 50 watt under Ar gas content of 20 sccm shows a very excellent optical transmittance and a good anti-fouling property and a good durability.

Plasma Dealloying 공정을 통한 Nanoporous Thin Film 제작 및 특성분석

  • Lee, Geun-Hyeok;An, Se-Hun;Jang, Seong-U;Hwang, Se-Hun;Yun, Jeong-Hyeon;Im, Sang-Ho;Han, Seung-Hui
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.353.1-353.1
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    • 2016
  • 다공성 물질은 동공의 크기에 따라 미세동공(Micropore), 메조동공(Mesopore), 거대동공(Macropore)으로 나누어 분류한다. 다공성 재료의 장점은 높은 비표면적으로써, 촉매, 센서, 연료전지 전극, 에너지 저장장치 등으로의 이용 가능성을 보여주는 연구가 활발히 보고되고 있다. 종래의 연구는 두 가지 이상의 원소로 구성된 박막을 제작한 후 전기화학적 분해법, 선택적 용해법 등 습식공정을 통해 다공성 구조체를 제작하였다. 하지만 본 연구에서는 Au, Ag 타겟과 $CH_4$ gas를 이용해 ICP-assisted reactive magnetron sputtering 장비를 활용하여 450 nm 두께의 Au-C, Ag-C 박막을 제작하였다. 이후 연속적으로 RF 250 W를 ICP antenna 에 인가하여 $O_2$ plasma dealloying 공정을 통해 탄소(Carbon) 만을 선택적으로 제거함으로써, 건식 공정만으로 Si wafer ($10{\times}10mm^2$) 기판 위에 250 ~ 300 nm 두께의 다공성 Au, Ag 박막을 제작하였다. SEM (Scanning Electron Microscopy)를 활용하여 표면, 단면 형상을 관찰해 다공성 구조를 확인하였으며, AES (Auger Electron Spectroscopy)를 통해 plasma dealloying 전 후 박막의 조성변화를 관찰하였다. 따라서 plasma dealloying 공정으로 제작된 다공성 Au, Ag 박막은 기존의 습식 공정 대비 청결하고 신속한 공정이 가능하며 높은 재현성을 통해 위의 적용분야에 보다 쉽게 사용될 수 있을 것으로 기대된다.

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Enhanced Hydrophilic Property of TiO2 Thin Film Deposited on Glass Etched with O2 Plasma

  • Kim, Hwa-Min;Seo, Sung Bo;Kim, Dong Young;Bae, Kang;Sohn, Sun Young
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.3
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    • pp.152-155
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    • 2013
  • $TiO_2$ films were deposited on glass substrates with and without $O_2$ plasma etching by using the RF-magnetron sputtering method. We focused on the effect of surface structure on the photoinduced hydrophilic properties of $TiO_2$ films, fabricated on different surface conditions according to the presence or absence of the $O_2$ plasma treatment on glass substrates. The wettability and photoinduced hydrophilic properties of the $TiO_2$ films were investigated according to the changes in water contact angles under UV light irradiations with a very low intensity of 0.1 $mW/cm^2$. The photoinduced hydrophilic properties on the $TiO_2$ formed above the plasma treated glass were also superior to those on the $TiO_2$ formed above the bare glass. This enhanced $TiO_2$ film has been used practically for self cleaning and anti-fogging glasses.

Enhanced Anti-reflective Effect of SiNx/SiOx/InSnO Multi-layers using Plasma Enhanced Chemical Vapor Deposition System with Hybrid Plasma Source

  • Choi, Min-Jun;Kwon, O Dae;Choi, Sang Dae;Baek, Ju-Yeoul;An, Kyoung-Joon;Chung, Kwun-Bum
    • Applied Science and Convergence Technology
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    • v.25 no.4
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    • pp.73-76
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    • 2016
  • Multi-layer films of $SiN_x/SiO_x$/InSnO with anti-reflective effect were grown by new-concept plasma enhanced chemical vapor deposition system (PECVD) with hybrid plasma source (HPS). Anti-reflective effect of $SiN_x/SiO_x$/InSnO was investigated as a function of ratio of $SiN_x$ and $SiO_x$ thickness. Multi-layers deposited by PECVD with HPS represents the enhancement of anti-reflective effect with high transmittance, comparing to the layers by conventional radio frequency (RF) sputtering system. This change is strongly related to the optical and physical properties of each layer, such as refractive index, composition, film density, and surface roughness depending on the deposition system.