• KSII Transactions on Internet and Information Systems (TIIS)
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• 제12권8호
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• pp.3842-3855
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• 2018

A novel image completion method is proposed that uses the advantage of planar structural information to fill corrupted portions of an image. First, in estimating parameters of the projection plane, the image is divided into several planes, and their planar structural information is analyzed. Second, in calculating the a priori probability of patch and patch offset regularity, this information is converted into a constraint condition to guide the process of filling the hole. Experimental results show that the proposed algorithm is fast and effective, and ensures the structure continuity of the damaged region and smoothness of the texture.

• International Journal of CAD/CAM
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• 제8권1호
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• pp.63-67
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• 2009

This paper puts forward a method based on the boundary deformation for planar grid generation. Many methods start with the special properties of grid and switch to the solution of a direct optimization or a non-linear minimum cost flow. Though with high theoretical significance, it's hard to realize due to the extremely complicated computing process. This paper brings out the automatic generation of planar grid by studying the boundary deformational properties of planar grid, which leads to uniform grid and enjoys the simplicity of computation and realization.

• 한국재료학회지
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• 제13권3호
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• pp.160-168
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• 2003

The co-firing processes for the supported type planar solid oxide fuel cell were investigated. A flat cell of $7.7${\times}$10.8\textrm{cm}^2$ was fabricated successfully by the co-firing process, in which green films were co-sintered in the forms of two layers of anode/electrolyte or of three layers of anode/electrolyte/cathode with gas distributor. A co-fired cell of two layers yielded a power of 200 ㎽/$\textrm{cm}^2$ at 608 ㎷. Its performance loss was mainly due to iR drop in the anodic gas distributor, which was attributed to poor contact between anodic gas distributor and current collector. The performance in the co-fired cell of three layers was much lower than that of two layers, which resulted from the large iR drop and activation overvoltage at the cathodic side. In the co-fired cell of two layers, the impedance analysis indicated that the performance decay during cell operation is due to both anode overvoltage and iR drop at anode side. Also the electrode reaction of the co-fired two layers' cell is considered to be controlled by activation overvoltage within the low current of 50 ㎃.

• 한국재료학회지
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• 제13권4호
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• pp.266-270
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• 2003

We studied BCl$_3$ dry etching of GaAs in a planar inductively coupled plasma system. The investigated process parameters were planar ICP source power, chamber pressure, RIE chuck power and gas flow rate. The ICP source power was varied from 0 to 500 W. Chamber pressure, RIE chuck power and gas flow rate were controlled from 5 to 15 mTorr, 0 to 150 W and 10 to 40 sccm, respectively. We found that a process condition at 20 sccm $BCl_3$ 300 W ICP, 100 W RIE and 7.5 mTorr chamber pressure gave an excellent etch result. The etched GaAs feature depicted extremely smooth surface (RMS roughness < 1 nm), vertical sidewall, relatively fast etch rate (> $3000\AA$/min) and good selectivity to a photoresist (> 3 : 1). XPS study indicated a very clean surface of the material after dry etching of GaAs. We also noticed that our planar ICP source was successfully ignited both with and without RIE chuck power, which was generally not the case with a typical cylindrical ICP source, where assistance of RIE chuck power was required for turning on a plasma and maintaining it. It demonstrated that the planar ICP source could be a very versatile tool for advanced dry etching of damage-sensitive compound semiconductors.

• 소성∙가공
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• 제7권3호
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• pp.233-245
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• 1998

A new approach has been proposed for the incremental analysis of the nonsteady state large deformation of planar anisotropic elastic-plastic sheet forming. A mathematical brief review of a constitutive law for the incremental deformation theory has been presented from flow theory using the minimum plastic work path for elastic-plastic material. Since the material embedded coordinate system(Lagrangian quantity) is used in the proposed theory the stress integration procedure is completely objective. A new return mapping algorithm has been also developed from the general midpoint rule so as to achieve numerically large strain increment by successive control of yield function residuals. Some numerical tests for the return mapping algorithm were performed using Barlat's six component anisotropic stress potential. Performance of the proposed algorithm was shown to be good and stable for a large strain increment, For planar anisotropic sheet forming updating algorithm of planar anisotropic axes has been newly proposed. In order to show the effectiveness and validity of the present formulation earing simulation for a cylindrical cup drawing and front fender stamping analysis are performed. From the results it has been shown that the present formulation can provide a good basis for analysis for analysis of elastic-plastic sheet metal forming processes.

• 한국가시화정보학회지
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• 제14권1호
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• pp.51-56
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• 2016

Oxygen is a key factor in aerobic reactions and most biological activities. Visualization of oxygen distribution of a chemical process or biological system has been a very challenging object despite of its significance and potential impact. To monitor and visualize the spatial distribution of oxygen concentration, various techniques such as electro-chemical probe, polarographic electrode, LIF(laser-induced fluorescence) and so on have been introduced. Oxygen planar optode which utilizes the oxygen quenching of fluorescence light is one of the currently available methods for time-resolved visualization of oxygen distribution on a planar surface. In this study, we utilized VisiSens oxygen planar optode system to visualize the spatial distribution of oxygen concentration on leaves of Korean azalea. As a result, temporal variation of oxygen concentration distribution caused by respiratory activity of the leaf could be quantitatively monitored.

• International Journal of Automotive Technology
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• 제6권3호
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• pp.259-268
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• 2005

In order to analyze the sheet drawability, the measurement of the plastic strain ratio was carried out for the 5182 aluminum alloy sheets in which were cold rolled without lubrication and subsequent recrystallization annealing. The average plastic strain ratio of the 5182 aluminum sheets was 1.50. It was considered that the higher plastic strain ratio was resulted from the ND//<111> component evolved during rolling and maintained during annealing. The AA5182/polypropylene/AA5182 (AA/PP/AA) sandwich sheets of the 5182 aluminum alloy skin sheet and the polypropylene core sheet with high formability have been developed for application for automotive body panels in future light weight vehicles with significant weight reduction. The AA/PP/AA sandwich sheets were fabricated by the adhesion of the core sheet and the upper and lower skin sheets. The AA/PP/AA sandwich sheet had high plastic strain ratio (1.58), however, the planar anisotropy of the sandwich sheet was little changed after fabrication. The optimum combination of directionality of the upper and lower skin sheets having high plastic strain ratio and low planar anisotropy was calculated theoretically and an advanced process for producing the sandwich sheets with high plastic strain ratio was proposed. The developed sandwich sheets have a high average plastic strain ratio of 1.55 and a low planar anisotropy of 0.17, which was improved more by 3.2 times than that of 5182 aluminum single sheet.

• 한국재료학회지
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• 제19권12호
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• pp.699-702
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• 2009

Due to the importance of the SiGe/Si heterostructure in the fields of thermoelectric and electronic applications, SiGe/Si heterostructures have been extensively investigated. For practical applications, thermal stability of the heterostructure during the thermoelectric power generation or fabrication process of electronic devices is of great concern. In this work, we focused on the effect of thermal annealing on the defect configuration in the SiGe/Si heterostructure. The formation mechanism of planar defects in an annealed SiGe/Si heterostructure was investigated by transmission electron microscopy. Due to the interdiffusion of Si and Ge, interface migration phenomena were observed in annealed heterostructures. Because of the strain gradient in the migrated region between the original interface and the migrated interface, the glide of misfit dislocation was observed in the region and planar defects were produced by the interaction of the gliding misfit dislocations. The planar defects were confined to the migrated region, and dislocation pileup by strain gradient was the origin of the confinement of the planar defect.

• 대한금속재료학회지
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• 제46권9호
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.484-485
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• 2003

We report on the optimization of the fabrication process of hybrid sol-gel thin film deposition to produce low cost $1 {\times} 16$ splitters for optical communications. We learn that sol-gel film thickness is dependent upon the spinning speeds and viscosity of the sol-gel solutions and refractive index upon the dopant concentrations of Al and Zr in the sol solutions. We could find the optimized physical conditions to achieve the desired thickness of core and cladding layers. We will further carry out the fabrication and measurements of insertion loss, polarization dependent loss (PDL), etc. for the performance of fabricated splitter devices.