• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.4
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• pp.759-764
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• 2012

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N at thermo-compression process. Through the simulation work, it was proved that the CPTB decreased in its size of conduction area as time passes, however it was largely affected by the copper oxidation.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.726-729
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• 2010

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N thermo-compression process. Through the simulation work, it was proved that when the CPTB decreased in its size, it was largely affected by the copper oxidation.

• Journal of the Korean Society of Safety
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• v.28 no.4
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• pp.107-113
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• 2013

The design of rainwater storage system unit to manufacture its reservoir tank was tried, the simulation to predict of their structural strength was carried out. Rainwater storage system unit should be easy to their machinability, transport and assemble. Especially, their structure was able to secure the water storage space, withstand loads and easily response to pollution. Considering these various requirements, they have to Doria-pillar structure of the Roman architectural style because these designs could disperse the loads which are applied to them. Therefore, the six kinds of models possible were proposed. Several boundary conditions were given to each model. Their structural strength was predicted through the simulation on their stress and the displacement distribution to constant load. From the evaluated data, the structure which has a large pillar in the central of unit and four small pillars each corner was the best.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.57-61
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• 2021

A formation process of indium bump arrays on micro-pillar structures is proposed. The space to form indium bump on the narrow structures can be secured applying the benzocyclobutene (BCB) planarization and its etch-back process. We exhibit a detailed overview of the process steps involved in the fabrication of 320×256 hybrid camera sensor for short-wavelength infrared (SWIR) detection. The shear strength of the BCB, which has undergone the different processes, is extracted by quartz crystal microbalance measurement. The shear strength of the BCB is three orders of magnitude higher than that of the indium bump itself. The measured dark current distribution of the fabricated SWIR camera sensor indicates the suggested process of indium bumps can be useful for embodying highly sensitive infared camera sensors.

• Journal of Korean Tunnelling and Underground Space Association
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• v.14 no.5
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• pp.453-467
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• 2012

Usage of underground space is increasing at metropolitan city. More than 90% of flood damages have occurred at downtown of metropolitan cities. In order to prevent and/or minimize the flood-induced damage, an underground rainwater detention cavern was proposed to be built underneath existing structures. As for underground caverns to be built for flood control, multi-caverns will be mostly adopted rather than one giant cavern because of stability problem. Because of the stress concentration occurring in the pillars between two adjacent caverns, the pillar-stability is the Achilles' heel in multi-caverns. So, a new pillar-reinforcing technology was proposed in this paper for securing the pillar-stability. In the new pillar-reinforcing technology, reinforced materials which are composed of a steel bar and PC strands are used by applying pressurized grouting, and then, by applying the pre-stress to the PC strands and anchor body. Therefore, this new technology has an advantage of utilizing most of the strength that the in-situ ground can exert, and not much relying on the pre-cast concrete structure. The main effect of the pressurized grouting is the increase of the ground strength and more importantly the decrease of stress concentration in the pillar; that of the pre-stress is the increase of the ground strength due to the increase of the internal pressure. In this paper, ground reinforcing effects were verified the stress change in pillar is obtained by numerical analysis at each construction stage. From these results, the effects of pressurized grouting and pre-stress are verified.

• Journal of Mechanical Science and Technology
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• v.14 no.11
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• pp.1179-1186
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• 2000

• Transactions of Materials Processing
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• v.23 no.5
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• pp.297-302
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• 2014

The current paper introduces work that was conducted during the development of a stamping die for a reinforce center pillar made from high strength steel. In the current study, the Bauschinger effect on the springback analysis was studied by comparing simulation results with real panels, which are currently in production. For a complicated part shape, quantitative measurements of the deformed shape are not easy in general to obtain. An adjustment procedure of the shape data for some chosen sections has been suggested to improve the accuracy of the quantitative measurements. The results show that the kinematic hardening model provides more accurate results.

• Journal of the Korean GEO-environmental Society
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• v.15 no.1
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• pp.53-62
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• 2014

In Korea, in general, separation distance between existing parallel tunnels was set at two to five times as distant as the diameter of the tunnels according to ground conditions. Recently, however, actual applicability of closely spaced parallel tunnels whose distance between tunnel centers was shorter than the diameter has increased due to environmental damages resulting from massive cutting, restriction in purchase of required land, and maintenance of linear continuity. In particular, when the pillar width of tunnel decreases, the safety of pillars affects behaviors of the tunnel and therefore the need for diverse relevant studies has emerged. However, research so far has been largely confined to analysis of behavior characteristics of pillars, or parameters affecting design, and actually applicable and quantitative data have not been presented. Accordingly, in order to present a stability evaluation method which may maximally reflect construction conditions of spots, this study reflected topographical and stratigraphic characteristics of the portal part with the highest closeness between the tunnels, simulated multi-layer conditions with rock mass and complete weathering, and assessed the degree of effect the stability of pillars had on the entire tunnels through numerical analysis according to changes in pillar width by ground strength. This study also presented composite analysis result on ground surface settlement rates, interference volume rates, and average strength to stress and a formula, which may be applicable to actual work, to evaluate safety rates of closely spaced parallel tunnel pillars and minimum pillar width by ground strength based on failure criteria by Hoek-Brown (1980).

• Transactions of Materials Processing
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• v.18 no.4
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• pp.304-309
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• 2009

Quenchable boron steel is a new type of high strength steel to reduce the weight of automobiles and maintain the safety conditions. Quenchable blanks can be hot-stamped and hardened in a water-cooled tool to achieve high strength. In this paper, new alloy for hot stamping is designed based on requirement of mechanical properties and two types of surface coating are investigated in viewpoints of oxidization and exfoliation. An automotive part of center pillar is manufactured by hot-stamping using Al-Si coated sheet. The performance of developed part is compared by static compression test and side impact crash test.

• Korean Journal of Metals and Materials
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• v.50 no.10
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• pp.775-783
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• 2012

The effect of thermal annealing on the in-situ growth characteristics of intermetallics (IMCs) and the mechanical strength of Cu pillar/Sn-3.5Ag microbumps are systematically investigated. The $Cu_6Sn_5$ phase formed at the Cu/solder interface right after bonding and grew with increased annealing time, while the $Cu_3Sn$ phase formed at the $Cu/Cu_6Sn_5$ interface and grew with increased annealing time. IMC growth followed a linear relationship with the square root of the annealing time due to a diffusion-controlled mechanism. The shear strength measured by the die shear test monotonically increased with annealing time. It then changed the slope with further annealing, which correlated with the change in fracture modes from ductile to brittle at a critical transition time. This is ascribed not only to the increasing thickness of brittle IMCs but also to the decreasing thickness of the solder, as there exists a critical annealing time for a fracture mode transition in our thin solder-capped Cu pillar microbump structures.